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Tuscaloosa, Alabama Area United States
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GTA
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Worked as Associate Packaging Engineer in RnD department, Sandisk Semiconductor(Shanghai). My work was focussed on developing and implementing advanced packaging technologies in device packaging.
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Goldstein Ch 4 (11,17,18,21)
Goldstein Ch 4 (11,17,18,21)Goldstein Ch 4 (11,17,18,21)
Goldstein Ch 4 (11,17,18,21)
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Goldstein ch4hw
Goldstein ch4hwGoldstein ch4hw
Goldstein ch4hw
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Goldstein solution chapter 8 (2, 20,26,35)
Goldstein solution chapter 8 (2, 20,26,35) Goldstein solution chapter 8 (2, 20,26,35)
Goldstein solution chapter 8 (2, 20,26,35)
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