9 years of consumer electronic product reliability design experience.
Solid experience in reliability technology, including DFR, DFMEA, Reliability test method developing in handheld electronic product;
Solid experience in phone mechanical shock reliability analysis and risk identification.
Optimize design with DOE. Confirm the strain limit with ALT test;
Deep understanding of IC component interconnection mechanical and thermal mechanical reliability (packaging level, PCBA level and FPC level);
Deep understanding of electronic material reliability evaluation and test method developing.