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His background and training are in Solid-State Physical Electronics and Materials Science. After received B.S. in Materials Science and Engineering, he joined TSMC for a summer intern (as a Advanced Process Integration Engineer in BTSD). Now, he is pursuing his master's degree at National Chiao Tung University with a thesis on semiconductor devices(iii-v FinFET) for low power logic applications.
by the way, this is the CV for my home tuition service :https://docs.google.com/open?id=0B93nM1kqtYrhV2tXY2FQNUlSXzg

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