20 years of semiconductor industries experiences covering EOL assembly operations to Test & Backend; depth in Advanced IC packaging design, Test &Assembly development in Intel. Instrumental in setting up & developed a group of IC package design team in Intel Communication Group. Maintained pragmatic engineering practices through track record implementation in Camera Module development and LED product development. Experiences in world class manufacturing operation, product & process development involving both startup and growth organizations has enabled successful operational excellence in organization.
Well versed in product life cycle planning from requirements gathering to strategic Pr...