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Philip has had extensive experience in project management from product conceptualization and architecture through product release. Philip specializes in electronics packaging design, particularly in the design and analysis of the structural, thermal, manufacturability, serviceability and reliability aspects of packaging design. Philip is an energetic, innovative and analytical professional who is a team player, cares about people, and gets results. 

Other key skills include: 
Designed parts with SolidWorks, Pro/E, Pro/Creo 2.0
Did CFD modeling with Icepak and Flotherm 
Implemented 6-sigma concepts in parts & assembly design
Designed cabinets for Indoor and Outdoor applications
Designed T...

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