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Founder and CEO of 3DMontblanc "an IP company for heterogeneous SoC"

20 years + in Digital/Telecom related projects
 & electronics packaging + various codesign environnement (electrical/optical).

Specialties:2.5D system architectures (Logic to Memory applications including opto-ASIC integration). 
IC/TSI/PKG codesign (SI/PI) at the physical layer,
Microwave & Digital testing (VNA,PNA,BERT,Scope)
Optical testing (SONET & WDM testing) including optical simulation
Analytical skills & process oriented for product development

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