�ݺ�ߣshows by User: Anupama209

�ݺ�ߣshows by User: Anupama209 / http://www.slideshare.net/images/logo.gif �ݺ�ߣshows by User: Anupama209 / Thu, 14 Jul 2016 15:04:18 GMT �ݺ�ߣShare feed for �ݺ�ߣshows by User: Anupama209 eDRAM Cells using FinFET Technology /slideshow/edram-cells-using-finfet-technology/64029298 presentation1-160714150418
FinFET is nothing but a MOSFET whose body is a thin piece of silicon with gate wrapped around it. ]]>
FinFET is nothing but a MOSFET whose body is a thin piece of silicon with gate wrapped around it. ]]> Thu, 14 Jul 2016 15:04:18 GMT /slideshow/edram-cells-using-finfet-technology/64029298 Anupama209@slideshare.net(Anupama209) eDRAM Cells using FinFET Technology Anupama209 FinFET is nothing but a MOSFET whose body is a thin piece of silicon with gate wrapped around it. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/presentation1-160714150418-thumbnail.jpg?width=120&height=120&fit=bounds" /><br> FinFET is nothing but a MOSFET whose body is a thin piece of silicon with gate wrapped around it.

eDRAM Cells using FinFET Technology from Anupama K

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0 3D IC Technology /slideshow/3-d-ic-technology/62740035 3dictechnology-160605135743
3-D ICs are an attractive chip architecture that can alleviate the interconnect related problems such as delay and power dissipation and can also facilitate integration of heterogeneous technologies in one chip (SoC).]]>
3-D ICs are an attractive chip architecture that can alleviate the interconnect related problems such as delay and power dissipation and can also facilitate integration of heterogeneous technologies in one chip (SoC).]]> Sun, 05 Jun 2016 13:57:43 GMT /slideshow/3-d-ic-technology/62740035 Anupama209@slideshare.net(Anupama209) 3D IC Technology Anupama209 3-D ICs are an attractive chip architecture that can alleviate the interconnect related problems such as delay and power dissipation and can also facilitate integration of heterogeneous technologies in one chip (SoC). <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/3dictechnology-160605135743-thumbnail.jpg?width=120&height=120&fit=bounds" /><br> 3-D ICs are an attractive chip architecture that can alleviate the interconnect related problems such as delay and power dissipation and can also facilitate integration of heterogeneous technologies in one chip (SoC).

3D IC Technology from Anupama K

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0 LiFi Technology /slideshow/lifi-technology-48000161/48000161 li-fitech-150511144545-lva1-app6891
Li-Fi (Light Fidelity)]]>
Li-Fi (Light Fidelity)]]> Mon, 11 May 2015 14:45:45 GMT /slideshow/lifi-technology-48000161/48000161 Anupama209@slideshare.net(Anupama209) LiFi Technology Anupama209 Li-Fi (Light Fidelity) <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/li-fitech-150511144545-lva1-app6891-thumbnail.jpg?width=120&height=120&fit=bounds" /><br> Li-Fi (Light Fidelity)

LiFi Technology from Anupama K

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0 Yoga /Anupama209/yoga-33929159 yoga-140425012226-phpapp01
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]]> Fri, 25 Apr 2014 01:22:26 GMT /Anupama209/yoga-33929159 Anupama209@slideshare.net(Anupama209) Yoga Anupama209 <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/yoga-140425012226-phpapp01-thumbnail.jpg?width=120&height=120&fit=bounds" /><br>

Yoga from Anupama K

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0 https://cdn.slidesharecdn.com/profile-photo-Anupama209-48x48.jpg?cb=1570981108 https://cdn.slidesharecdn.com/ss_thumbnails/presentation1-160714150418-thumbnail.jpg?width=320&height=320&fit=bounds slideshow/edram-cells-using-finfet-technology/64029298 eDRAM Cells using FinF... https://cdn.slidesharecdn.com/ss_thumbnails/3dictechnology-160605135743-thumbnail.jpg?width=320&height=320&fit=bounds slideshow/3-d-ic-technology/62740035 3D IC Technology https://cdn.slidesharecdn.com/ss_thumbnails/li-fitech-150511144545-lva1-app6891-thumbnail.jpg?width=320&height=320&fit=bounds slideshow/lifi-technology-48000161/48000161 LiFi Technology