�ݺ�ߣshows by User: MIPI-Alliance

�ݺ�ߣshows by User: MIPI-Alliance / http://www.slideshare.net/images/logo.gif �ݺ�ߣshows by User: MIPI-Alliance / Mon, 04 Oct 2021 14:02:52 GMT �ݺ�ߣShare feed for �ݺ�ߣshows by User: MIPI-Alliance MIPI DevCon 2021: MIPI I3C Under the Spotlight: A Fireside Chat with the I3C Experts /slideshow/mipi-devcon-2021-mipi-i3c-under-the-spotlight-a-fireside-chat-with-the-i3c-experts/250366674 13devcon2021-mipi-i3c-under-the-spotlight-a-fireside-chat-with-the-i3c-experts-panel-211004140252
Panel discussion with Tim McKee, MIPI I3C Working Group chair; Matthew Schnoor; Eyuel Zewdu Teferi, MIPI I3C Basic Ad-hoc Working Group vice chair; and Radu Pitigoi-Aron This session puts MIPI I3C® "under the spotlight" by assembling a panel of experts to talk about the latest developments in the world of I3C. The panel discusses the latest I3C specifications (including the latest HCI specification), how to address conformance in the absence of face-to-face plug fests, and how the MIPI I3C interface is being leveraged by other standards organizations.]]>
Panel discussion with Tim McKee, MIPI I3C Working Group chair; Matthew Schnoor; Eyuel Zewdu Teferi, MIPI I3C Basic Ad-hoc Working Group vice chair; and Radu Pitigoi-Aron This session puts MIPI I3C® "under the spotlight" by assembling a panel of experts to talk about the latest developments in the world of I3C. The panel discusses the latest I3C specifications (including the latest HCI specification), how to address conformance in the absence of face-to-face plug fests, and how the MIPI I3C interface is being leveraged by other standards organizations.]]> Mon, 04 Oct 2021 14:02:52 GMT /slideshow/mipi-devcon-2021-mipi-i3c-under-the-spotlight-a-fireside-chat-with-the-i3c-experts/250366674 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: MIPI I3C Under the Spotlight: A Fireside Chat with the I3C Experts MIPI-Alliance Panel discussion with Tim McKee, MIPI I3C Working Group chair; Matthew Schnoor; Eyuel Zewdu Teferi, MIPI I3C Basic Ad-hoc Working Group vice chair; and Radu Pitigoi-Aron This session puts MIPI I3C® "under the spotlight" by assembling a panel of experts to talk about the latest developments in the world of I3C. The panel discusses the latest I3C specifications (including the latest HCI specification), how to address conformance in the absence of face-to-face plug fests, and how the MIPI I3C interface is being leveraged by other standards organizations. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/13devcon2021-mipi-i3c-under-the-spotlight-a-fireside-chat-with-the-i3c-experts-panel-211004140252-thumbnail.jpg?width=120&height=120&fit=bounds" /> Panel discussion with Tim McKee, MIPI I3C Working Group chair; Matthew Schnoor; Eyuel Zewdu Teferi, MIPI I3C Basic Ad-hoc Working Group vice chair; and Radu Pitigoi-Aron This session puts MIPI I3C® "under the spotlight" by assembling a panel of experts to talk about the latest developments in the world of I3C. The panel discusses the latest I3C specifications (including the latest HCI specification), how to address conformance in the absence of face-to-face plug fests, and how the MIPI I3C interface is being leveraged by other standards organizations.

MIPI DevCon 2021: MIPI I3C Under the Spotlight: A Fireside Chat with the I3C Experts from MIPI Alliance

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0 MIPI DevCon 2021: MIPI I3C Application and Validation Models for IoT Sensor Nodes /slideshow/mipi-devcon-2021-mipi-i3c-application-and-validation-models-for-iot-sensor-nodes/250366654 12devcon2021-mipii3c-application-and-validation-models-for-iotsensor-nodes-211004135939
Presented by Eyuel Zewdu Teferi, David Schumacher and Souha Kouki, STMicroelectronics This presentation provides a global overview of using MIPI I3C® protocol for on-board communication among subsystems of an IoT sensor node. It includes adoption of MIPI CTS by using SysML models of requirements and test cases as an approach to manage I3C application use cases requirement validation.]]>
Presented by Eyuel Zewdu Teferi, David Schumacher and Souha Kouki, STMicroelectronics This presentation provides a global overview of using MIPI I3C® protocol for on-board communication among subsystems of an IoT sensor node. It includes adoption of MIPI CTS by using SysML models of requirements and test cases as an approach to manage I3C application use cases requirement validation.]]> Mon, 04 Oct 2021 13:59:39 GMT /slideshow/mipi-devcon-2021-mipi-i3c-application-and-validation-models-for-iot-sensor-nodes/250366654 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: MIPI I3C Application and Validation Models for IoT Sensor Nodes MIPI-Alliance Presented by Eyuel Zewdu Teferi, David Schumacher and Souha Kouki, STMicroelectronics This presentation provides a global overview of using MIPI I3C® protocol for on-board communication among subsystems of an IoT sensor node. It includes adoption of MIPI CTS by using SysML models of requirements and test cases as an approach to manage I3C application use cases requirement validation. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/12devcon2021-mipii3c-application-and-validation-models-for-iotsensor-nodes-211004135939-thumbnail.jpg?width=120&height=120&fit=bounds" /> Presented by Eyuel Zewdu Teferi, David Schumacher and Souha Kouki, STMicroelectronics This presentation provides a global overview of using MIPI I3C® protocol for on-board communication among subsystems of an IoT sensor node. It includes adoption of MIPI CTS by using SysML models of requirements and test cases as an approach to manage I3C application use cases requirement validation.

MIPI DevCon 2021: MIPI I3C Application and Validation Models for IoT Sensor Nodes from MIPI Alliance

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0 MIPI DevCon 2021: MIPI I3C Signal Integrity Challenges on DDR5-based Server Platform Solutions /slideshow/mipi-devcon-2021-mipi-i3c-signal-integrity-challenges-on-ddr5based-server-platform-solutions/250366625 11devcon2021-mipi-i3c-signal-integrity-challenges-on-ddr5-based-server-platform-solutions-211004135219
Presented by Azusena Lupercio Ramirez, Juan Orozco and Nestor Hernandez Cruz, Intel Corporation The MIPI I3C® protocol is first used in a server application for the DDR5 DIMM SPD function. MIPI I3C was defined for low capacitance applications, while DDR5 SPD exceeds by far the bus capacitance specification. This presentation covers the interoperability challenges of the dynamic push-pull and open-drain operating modes, on server applications with an in-depth analysis of the implications of long PCB traces, multiple DIMM routing branches, and multiple loads to the electrical and timing parameters.]]>
Presented by Azusena Lupercio Ramirez, Juan Orozco and Nestor Hernandez Cruz, Intel Corporation The MIPI I3C® protocol is first used in a server application for the DDR5 DIMM SPD function. MIPI I3C was defined for low capacitance applications, while DDR5 SPD exceeds by far the bus capacitance specification. This presentation covers the interoperability challenges of the dynamic push-pull and open-drain operating modes, on server applications with an in-depth analysis of the implications of long PCB traces, multiple DIMM routing branches, and multiple loads to the electrical and timing parameters.]]> Mon, 04 Oct 2021 13:52:19 GMT /slideshow/mipi-devcon-2021-mipi-i3c-signal-integrity-challenges-on-ddr5based-server-platform-solutions/250366625 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: MIPI I3C Signal Integrity Challenges on DDR5-based Server Platform Solutions MIPI-Alliance Presented by Azusena Lupercio Ramirez, Juan Orozco and Nestor Hernandez Cruz, Intel Corporation The MIPI I3C® protocol is first used in a server application for the DDR5 DIMM SPD function. MIPI I3C was defined for low capacitance applications, while DDR5 SPD exceeds by far the bus capacitance specification. This presentation covers the interoperability challenges of the dynamic push-pull and open-drain operating modes, on server applications with an in-depth analysis of the implications of long PCB traces, multiple DIMM routing branches, and multiple loads to the electrical and timing parameters. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/11devcon2021-mipi-i3c-signal-integrity-challenges-on-ddr5-based-server-platform-solutions-211004135219-thumbnail.jpg?width=120&height=120&fit=bounds" /> Presented by Azusena Lupercio Ramirez, Juan Orozco and Nestor Hernandez Cruz, Intel Corporation The MIPI I3C® protocol is first used in a server application for the DDR5 DIMM SPD function. MIPI I3C was defined for low capacitance applications, while DDR5 SPD exceeds by far the bus capacitance specification. This presentation covers the interoperability challenges of the dynamic push-pull and open-drain operating modes, on server applications with an in-depth analysis of the implications of long PCB traces, multiple DIMM routing branches, and multiple loads to the electrical and timing parameters.

MIPI DevCon 2021: MIPI I3C Signal Integrity Challenges on DDR5-based Server Platform Solutions from MIPI Alliance

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0 MIPI DevCon 2021: MIPI I3C interface for the ETSI Smart Secure Platform /slideshow/mipi-devcon-2021-mipi-i3c-interface-for-the-etsi-smart-secure-platform/250366611 10devcon2021-etsi-mipi-i3c-interface-for-the-etsi-smart-secure-platform-211004135015
Presented by Gulio Follero, ETSI The ETSI Technical Committee Smart Card Platform (TC SCP) is developing the specification of the next generation secure element, the Smart Secure Platform (SSP). SCP is standardizing the MIPI I3C interface for SSP. This presentation describes the SSP architecture and its main use cases, followed by a discussion of how the MIPI I3C interface is adapted to the SSP and the main benefits in terms of speed, power and efficiency.]]>
Presented by Gulio Follero, ETSI The ETSI Technical Committee Smart Card Platform (TC SCP) is developing the specification of the next generation secure element, the Smart Secure Platform (SSP). SCP is standardizing the MIPI I3C interface for SSP. This presentation describes the SSP architecture and its main use cases, followed by a discussion of how the MIPI I3C interface is adapted to the SSP and the main benefits in terms of speed, power and efficiency.]]> Mon, 04 Oct 2021 13:50:14 GMT /slideshow/mipi-devcon-2021-mipi-i3c-interface-for-the-etsi-smart-secure-platform/250366611 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: MIPI I3C interface for the ETSI Smart Secure Platform MIPI-Alliance Presented by Gulio Follero, ETSI The ETSI Technical Committee Smart Card Platform (TC SCP) is developing the specification of the next generation secure element, the Smart Secure Platform (SSP). SCP is standardizing the MIPI I3C interface for SSP. This presentation describes the SSP architecture and its main use cases, followed by a discussion of how the MIPI I3C interface is adapted to the SSP and the main benefits in terms of speed, power and efficiency. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/10devcon2021-etsi-mipi-i3c-interface-for-the-etsi-smart-secure-platform-211004135015-thumbnail.jpg?width=120&height=120&fit=bounds" /> Presented by Gulio Follero, ETSI The ETSI Technical Committee Smart Card Platform (TC SCP) is developing the specification of the next generation secure element, the Smart Secure Platform (SSP). SCP is standardizing the MIPI I3C interface for SSP. This presentation describes the SSP architecture and its main use cases, followed by a discussion of how the MIPI I3C interface is adapted to the SSP and the main benefits in terms of speed, power and efficiency.

MIPI DevCon 2021: MIPI I3C interface for the ETSI Smart Secure Platform from MIPI Alliance

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0 MIPI DevCon 2021: MIPI Security for Automotive and IoT – Initial Focus on MASS /slideshow/mipi-devcon-2021-mipi-security-for-automotive-and-iot-initial-focus-on-mass/250366597 09devcon2021-mipi-security-for-automotive-and-iot-initial-focus-on-mass-211004134813
Presented by Philip Hawkes and Rick Wietfeldt, co-chairs of the MIPI Security Working Group MIPI Automotive SerDes Solutions (MASS) allows transmission of sensor and display data between sensors, electronic control units (ECUs) and displays distributed around a vehicle. The MIPI Security Working Group is developing a MASS security framework for protecting this data against malicious attacks. This session covers the objectives of the security framework and explains how the framework achieves those objectives.]]>
Presented by Philip Hawkes and Rick Wietfeldt, co-chairs of the MIPI Security Working Group MIPI Automotive SerDes Solutions (MASS) allows transmission of sensor and display data between sensors, electronic control units (ECUs) and displays distributed around a vehicle. The MIPI Security Working Group is developing a MASS security framework for protecting this data against malicious attacks. This session covers the objectives of the security framework and explains how the framework achieves those objectives.]]> Mon, 04 Oct 2021 13:48:13 GMT /slideshow/mipi-devcon-2021-mipi-security-for-automotive-and-iot-initial-focus-on-mass/250366597 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: MIPI Security for Automotive and IoT – Initial Focus on MASS MIPI-Alliance Presented by Philip Hawkes and Rick Wietfeldt, co-chairs of the MIPI Security Working Group MIPI Automotive SerDes Solutions (MASS) allows transmission of sensor and display data between sensors, electronic control units (ECUs) and displays distributed around a vehicle. The MIPI Security Working Group is developing a MASS security framework for protecting this data against malicious attacks. This session covers the objectives of the security framework and explains how the framework achieves those objectives. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/09devcon2021-mipi-security-for-automotive-and-iot-initial-focus-on-mass-211004134813-thumbnail.jpg?width=120&height=120&fit=bounds" /> Presented by Philip Hawkes and Rick Wietfeldt, co-chairs of the MIPI Security Working Group MIPI Automotive SerDes Solutions (MASS) allows transmission of sensor and display data between sensors, electronic control units (ECUs) and displays distributed around a vehicle. The MIPI Security Working Group is developing a MASS security framework for protecting this data against malicious attacks. This session covers the objectives of the security framework and explains how the framework achieves those objectives.

MIPI DevCon 2021: MIPI Security for Automotive and IoT – Initial Focus on MASS from MIPI Alliance

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0 MIPI DevCon 2021: MIPI HTI, PTI and STP: The Bases for Next-Generation Online Analyses of Multicore ProcessorsS /slideshow/mipi-devcon-2021-mipi-hti-pti-and-stp-the-bases-for-nextgeneration-online-analyses-of-multicore-processorss/250351293 08devcon2021-mipi-hti-pti-stp-the-bases-for-next-generation-online-analyses-of-multicore-processors-211001204602
Presented by Thomas B. Preußer and Alexander Weiss, Accemic Technologies GmbH The key challenge for testing and debugging embedded multicore systems is their limited observability. MIPI trace protocols provide essential operational insights non-intrusively, and this presentation advocates for the continuous online analysis of these trace data. It also contrasts the challenges posed by the vigorously compressed MIPI trace protocols with the enormous benefits that can be gained by online processing.]]>
Presented by Thomas B. Preußer and Alexander Weiss, Accemic Technologies GmbH The key challenge for testing and debugging embedded multicore systems is their limited observability. MIPI trace protocols provide essential operational insights non-intrusively, and this presentation advocates for the continuous online analysis of these trace data. It also contrasts the challenges posed by the vigorously compressed MIPI trace protocols with the enormous benefits that can be gained by online processing.]]> Fri, 01 Oct 2021 20:46:02 GMT /slideshow/mipi-devcon-2021-mipi-hti-pti-and-stp-the-bases-for-nextgeneration-online-analyses-of-multicore-processorss/250351293 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: MIPI HTI, PTI and STP: The Bases for Next-Generation Online Analyses of Multicore ProcessorsS MIPI-Alliance Presented by Thomas B. Preußer and Alexander Weiss, Accemic Technologies GmbH The key challenge for testing and debugging embedded multicore systems is their limited observability. MIPI trace protocols provide essential operational insights non-intrusively, and this presentation advocates for the continuous online analysis of these trace data. It also contrasts the challenges posed by the vigorously compressed MIPI trace protocols with the enormous benefits that can be gained by online processing. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/08devcon2021-mipi-hti-pti-stp-the-bases-for-next-generation-online-analyses-of-multicore-processors-211001204602-thumbnail.jpg?width=120&height=120&fit=bounds" /> Presented by Thomas B. Preußer and Alexander Weiss, Accemic Technologies GmbH The key challenge for testing and debugging embedded multicore systems is their limited observability. MIPI trace protocols provide essential operational insights non-intrusively, and this presentation advocates for the continuous online analysis of these trace data. It also contrasts the challenges posed by the vigorously compressed MIPI trace protocols with the enormous benefits that can be gained by online processing.

MIPI DevCon 2021: MIPI HTI, PTI and STP: The Bases for Next-Generation Online Analyses of Multicore ProcessorsS from MIPI Alliance

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0 MIPI DevCon 2021: Meeting the Needs of Next-Generation Displays with a High-Performance MIPI DSI-2 Subsystem Solution /slideshow/mipi-devcon-2021-meeting-the-needs-of-nextgeneration-displays-with-a-highperformance-mipi-dsi2-subsystem-solution/250351290 07devcon2021-meeting-needs-next-generation-displays-high-performance-mipi-dsi1-subsystem-solution-211001204345
Presented by Alain Legault, Hardent Inc.; Joe Rodriguez, Rambus Inc.; and Justin Endo, Mixel, Inc. Next-generation display applications have an insatiable appetite for bandwidth. Using a combination of VESA Display Stream Compression (DSC) and MIPI DSI-2℠ technology, designers can achieve display resolutions up to 8K without compromise to video quality, battery life or cost. This presentation discusses a fully integrated, off-the-shelf display IP subsystem solution, consisting of Mixel (MIPI C-PHY℠/D-PHY℠ combo), Rambus (MIPI DSI-2® controller) and Hardent (VESA DSC) IP, that can deliver this state-of-the-art performance in a power-efficient and compact footprint.]]>
Presented by Alain Legault, Hardent Inc.; Joe Rodriguez, Rambus Inc.; and Justin Endo, Mixel, Inc. Next-generation display applications have an insatiable appetite for bandwidth. Using a combination of VESA Display Stream Compression (DSC) and MIPI DSI-2℠ technology, designers can achieve display resolutions up to 8K without compromise to video quality, battery life or cost. This presentation discusses a fully integrated, off-the-shelf display IP subsystem solution, consisting of Mixel (MIPI C-PHY℠/D-PHY℠ combo), Rambus (MIPI DSI-2® controller) and Hardent (VESA DSC) IP, that can deliver this state-of-the-art performance in a power-efficient and compact footprint.]]> Fri, 01 Oct 2021 20:43:44 GMT /slideshow/mipi-devcon-2021-meeting-the-needs-of-nextgeneration-displays-with-a-highperformance-mipi-dsi2-subsystem-solution/250351290 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: Meeting the Needs of Next-Generation Displays with a High-Performance MIPI DSI-2 Subsystem Solution MIPI-Alliance Presented by Alain Legault, Hardent Inc.; Joe Rodriguez, Rambus Inc.; and Justin Endo, Mixel, Inc. Next-generation display applications have an insatiable appetite for bandwidth. Using a combination of VESA Display Stream Compression (DSC) and MIPI DSI-2℠ technology, designers can achieve display resolutions up to 8K without compromise to video quality, battery life or cost. This presentation discusses a fully integrated, off-the-shelf display IP subsystem solution, consisting of Mixel (MIPI C-PHY℠/D-PHY℠ combo), Rambus (MIPI DSI-2® controller) and Hardent (VESA DSC) IP, that can deliver this state-of-the-art performance in a power-efficient and compact footprint. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/07devcon2021-meeting-needs-next-generation-displays-high-performance-mipi-dsi1-subsystem-solution-211001204345-thumbnail.jpg?width=120&height=120&fit=bounds" /> Presented by Alain Legault, Hardent Inc.; Joe Rodriguez, Rambus Inc.; and Justin Endo, Mixel, Inc. Next-generation display applications have an insatiable appetite for bandwidth. Using a combination of VESA Display Stream Compression (DSC) and MIPI DSI-2℠ technology, designers can achieve display resolutions up to 8K without compromise to video quality, battery life or cost. This presentation discusses a fully integrated, off-the-shelf display IP subsystem solution, consisting of Mixel (MIPI C-PHY℠/D-PHY℠ combo), Rambus (MIPI DSI-2® controller) and Hardent (VESA DSC) IP, that can deliver this state-of-the-art performance in a power-efficient and compact footprint.

MIPI DevCon 2021: Meeting the Needs of Next-Generation Displays with a High-Performance MIPI DSI-2 Subsystem Solution from MIPI Alliance

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0 MIPI DevCon 2021: MIPI CSI-2 v4.0 Panel Discussion with the MIPI Camera Working Group /slideshow/mipi-devcon-2021-mipi-csi2-v40-panel-discussion-with-the-mipi-camera-working-group/250351285 06devcon2021-mipi-csi2-panel-discussion-with-the-mipi-camera-wg-211001204108
Panel discussion with Haran Thanigasalam, Intel Corporation, MIPI Camera Working Group chair; Natsuko Ibuki, Google, LLC; Yuichi Mizutani, Sony Corporation; and Wonseok Lee, Samsung Electronics, Co. ]]>
Panel discussion with Haran Thanigasalam, Intel Corporation, MIPI Camera Working Group chair; Natsuko Ibuki, Google, LLC; Yuichi Mizutani, Sony Corporation; and Wonseok Lee, Samsung Electronics, Co. ]]> Fri, 01 Oct 2021 20:41:08 GMT /slideshow/mipi-devcon-2021-mipi-csi2-v40-panel-discussion-with-the-mipi-camera-working-group/250351285 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: MIPI CSI-2 v4.0 Panel Discussion with the MIPI Camera Working Group MIPI-Alliance Panel discussion with Haran Thanigasalam, Intel Corporation, MIPI Camera Working Group chair; Natsuko Ibuki, Google, LLC; Yuichi Mizutani, Sony Corporation; and Wonseok Lee, Samsung Electronics, Co. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/06devcon2021-mipi-csi2-panel-discussion-with-the-mipi-camera-wg-211001204108-thumbnail.jpg?width=120&height=120&fit=bounds" /> Panel discussion with Haran Thanigasalam, Intel Corporation, MIPI Camera Working Group chair; Natsuko Ibuki, Google, LLC; Yuichi Mizutani, Sony Corporation; and Wonseok Lee, Samsung Electronics, Co.

MIPI DevCon 2021: MIPI CSI-2 v4.0 Panel Discussion with the MIPI Camera Working Group from MIPI Alliance

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0 MIPI DevCon 2021: MIPI D-PHY and MIPI CSI-2 for IoT: AI Edge Devices /slideshow/mipi-devcon-2021-mipi-dphy-and-mipi-csi2-for-iot-ai-edge-devices-250351277/250351277 05session-dc2021-mipi-d-phy-and-mipi-csi-2-for-iot-ai-edge-devices-211001203845
Presented by Ashraf Takla, Mixel Inc. This presentation covers the deployment of MIPI D-PHY℠ and MIPI CSI-2® in IoT and edge devices. While many mobile-influenced applications benefit from the low-power, small-form factor of MIPI specifications, AI edge processors in particular are seeing a surge in the use of MIPI specifications for their sensors as market trends shift from processing in the cloud or central location, to processing at the edge. This presentation includes a high-level system overview of a specific use case, Perceive Ergo edge inference processor, and how Mixel was able to meet Perceive’s stringent requirements with its MIPI D-PHY CSI-2 TX and D-PHY CSI-2 RX IPs.]]>
Presented by Ashraf Takla, Mixel Inc. This presentation covers the deployment of MIPI D-PHY℠ and MIPI CSI-2® in IoT and edge devices. While many mobile-influenced applications benefit from the low-power, small-form factor of MIPI specifications, AI edge processors in particular are seeing a surge in the use of MIPI specifications for their sensors as market trends shift from processing in the cloud or central location, to processing at the edge. This presentation includes a high-level system overview of a specific use case, Perceive Ergo edge inference processor, and how Mixel was able to meet Perceive’s stringent requirements with its MIPI D-PHY CSI-2 TX and D-PHY CSI-2 RX IPs.]]> Fri, 01 Oct 2021 20:38:45 GMT /slideshow/mipi-devcon-2021-mipi-dphy-and-mipi-csi2-for-iot-ai-edge-devices-250351277/250351277 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: MIPI D-PHY and MIPI CSI-2 for IoT: AI Edge Devices MIPI-Alliance Presented by Ashraf Takla, Mixel Inc. This presentation covers the deployment of MIPI D-PHY℠ and MIPI CSI-2® in IoT and edge devices. While many mobile-influenced applications benefit from the low-power, small-form factor of MIPI specifications, AI edge processors in particular are seeing a surge in the use of MIPI specifications for their sensors as market trends shift from processing in the cloud or central location, to processing at the edge. This presentation includes a high-level system overview of a specific use case, Perceive Ergo edge inference processor, and how Mixel was able to meet Perceive’s stringent requirements with its MIPI D-PHY CSI-2 TX and D-PHY CSI-2 RX IPs. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/05session-dc2021-mipi-d-phy-and-mipi-csi-2-for-iot-ai-edge-devices-211001203845-thumbnail.jpg?width=120&height=120&fit=bounds" /> Presented by Ashraf Takla, Mixel Inc. This presentation covers the deployment of MIPI D-PHY℠ and MIPI CSI-2® in IoT and edge devices. While many mobile-influenced applications benefit from the low-power, small-form factor of MIPI specifications, AI edge processors in particular are seeing a surge in the use of MIPI specifications for their sensors as market trends shift from processing in the cloud or central location, to processing at the edge. This presentation includes a high-level system overview of a specific use case, Perceive Ergo edge inference processor, and how Mixel was able to meet Perceive’s stringent requirements with its MIPI D-PHY CSI-2 TX and D-PHY CSI-2 RX IPs.

MIPI DevCon 2021: MIPI D-PHY and MIPI CSI-2 for IoT: AI Edge Devices from MIPI Alliance

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0 MIPI DevCon 2021: Enabling Long-Reach MIPI CSI-2 Connectivity in Automotive with MIPI IP /slideshow/mipi-devcon-2021-mipi-dphy-and-mipi-csi2-for-iot-ai-edge-devices/250351254 04devcon2021-enabling-long-reach-mipi-csi-2-connectivity-in-automotive-with-mipi-ip-211001202915
Presented by Licinio Sousa, Synopsys, Inc., and Edo Cohen, Valens Semiconductor Synopsys and Valens Semiconductor outline how MIPI automotive solutions can enable safe and robust long-reach connectivity for cameras and sensors. The ability for high volumes of data to travel at a fast rate over a long reach infrastructure is now mandatory in automotive vision applications. In addition, maintaining a reliable link can be the difference between successful operation and system failure in a car. In this presentation, Synopsys and Valens present a Valens MIPI A-PHY℠ design for in-vehicle connectivity using Synopsys’ ISO 26262-ready MIPI CSI-2® and MIPI C-PHY℠/D-PHY℠ IP in the FinFET process to meet their latency and bandwidth requirements. The presentation also previews examples of display applications that can benefit from the same architecture.]]>
Presented by Licinio Sousa, Synopsys, Inc., and Edo Cohen, Valens Semiconductor Synopsys and Valens Semiconductor outline how MIPI automotive solutions can enable safe and robust long-reach connectivity for cameras and sensors. The ability for high volumes of data to travel at a fast rate over a long reach infrastructure is now mandatory in automotive vision applications. In addition, maintaining a reliable link can be the difference between successful operation and system failure in a car. In this presentation, Synopsys and Valens present a Valens MIPI A-PHY℠ design for in-vehicle connectivity using Synopsys’ ISO 26262-ready MIPI CSI-2® and MIPI C-PHY℠/D-PHY℠ IP in the FinFET process to meet their latency and bandwidth requirements. The presentation also previews examples of display applications that can benefit from the same architecture.]]> Fri, 01 Oct 2021 20:29:15 GMT /slideshow/mipi-devcon-2021-mipi-dphy-and-mipi-csi2-for-iot-ai-edge-devices/250351254 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: Enabling Long-Reach MIPI CSI-2 Connectivity in Automotive with MIPI IP MIPI-Alliance Presented by Licinio Sousa, Synopsys, Inc., and Edo Cohen, Valens Semiconductor Synopsys and Valens Semiconductor outline how MIPI automotive solutions can enable safe and robust long-reach connectivity for cameras and sensors. The ability for high volumes of data to travel at a fast rate over a long reach infrastructure is now mandatory in automotive vision applications. In addition, maintaining a reliable link can be the difference between successful operation and system failure in a car. In this presentation, Synopsys and Valens present a Valens MIPI A-PHY℠ design for in-vehicle connectivity using Synopsys’ ISO 26262-ready MIPI CSI-2® and MIPI C-PHY℠/D-PHY℠ IP in the FinFET process to meet their latency and bandwidth requirements. The presentation also previews examples of display applications that can benefit from the same architecture. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/04devcon2021-enabling-long-reach-mipi-csi-2-connectivity-in-automotive-with-mipi-ip-211001202915-thumbnail.jpg?width=120&height=120&fit=bounds" /> Presented by Licinio Sousa, Synopsys, Inc., and Edo Cohen, Valens Semiconductor Synopsys and Valens Semiconductor outline how MIPI automotive solutions can enable safe and robust long-reach connectivity for cameras and sensors. The ability for high volumes of data to travel at a fast rate over a long reach infrastructure is now mandatory in automotive vision applications. In addition, maintaining a reliable link can be the difference between successful operation and system failure in a car. In this presentation, Synopsys and Valens present a Valens MIPI A-PHY℠ design for in-vehicle connectivity using Synopsys’ ISO 26262-ready MIPI CSI-2® and MIPI C-PHY℠/D-PHY℠ IP in the FinFET process to meet their latency and bandwidth requirements. The presentation also previews examples of display applications that can benefit from the same architecture.

MIPI DevCon 2021: Enabling Long-Reach MIPI CSI-2 Connectivity in Automotive with MIPI IP from MIPI Alliance

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0 MIPI DevCon 2021: Latest Developments within MIPI Automotive SerDes Solutions (MASS) /slideshow/mipi-devcon-2021-latest-developments-within-mipi-automotive-serdes-solutions-mass/250351248 03devcon2021-latest-developments-mipi-automotive-serdes-solutions-211001202739
Presented by James Goel, MIPI Technical Steering Group chair, and Rick Wietfeldt, Security Working Group co-chair This session brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols running over MIPI A-PHY℠. The presentation also explains how recent developments make it easier for you to integrate MIPI A-PHY into your next automotive E/E architecture and how, through A-PHY's adoption as an IEEE standard, it can be accessed for evaluation without MIPI membership. In addition, the presenters discuss how recently released MIPI Camera and Display Service Extensions (CSE and DSE) and their associated protocol adaptation layers (PALs) work together to embed functional safety and security enablers natively at the "edge" – ultimately within the sensor, display and ECU components themselves.]]>
Presented by James Goel, MIPI Technical Steering Group chair, and Rick Wietfeldt, Security Working Group co-chair This session brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols running over MIPI A-PHY℠. The presentation also explains how recent developments make it easier for you to integrate MIPI A-PHY into your next automotive E/E architecture and how, through A-PHY's adoption as an IEEE standard, it can be accessed for evaluation without MIPI membership. In addition, the presenters discuss how recently released MIPI Camera and Display Service Extensions (CSE and DSE) and their associated protocol adaptation layers (PALs) work together to embed functional safety and security enablers natively at the "edge" – ultimately within the sensor, display and ECU components themselves.]]> Fri, 01 Oct 2021 20:27:38 GMT /slideshow/mipi-devcon-2021-latest-developments-within-mipi-automotive-serdes-solutions-mass/250351248 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: Latest Developments within MIPI Automotive SerDes Solutions (MASS) MIPI-Alliance Presented by James Goel, MIPI Technical Steering Group chair, and Rick Wietfeldt, Security Working Group co-chair This session brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols running over MIPI A-PHY℠. The presentation also explains how recent developments make it easier for you to integrate MIPI A-PHY into your next automotive E/E architecture and how, through A-PHY's adoption as an IEEE standard, it can be accessed for evaluation without MIPI membership. In addition, the presenters discuss how recently released MIPI Camera and Display Service Extensions (CSE and DSE) and their associated protocol adaptation layers (PALs) work together to embed functional safety and security enablers natively at the "edge" – ultimately within the sensor, display and ECU components themselves. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/03devcon2021-latest-developments-mipi-automotive-serdes-solutions-211001202739-thumbnail.jpg?width=120&height=120&fit=bounds" /> Presented by James Goel, MIPI Technical Steering Group chair, and Rick Wietfeldt, Security Working Group co-chair This session brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols running over MIPI A-PHY℠. The presentation also explains how recent developments make it easier for you to integrate MIPI A-PHY into your next automotive E/E architecture and how, through A-PHY's adoption as an IEEE standard, it can be accessed for evaluation without MIPI membership. In addition, the presenters discuss how recently released MIPI Camera and Display Service Extensions (CSE and DSE) and their associated protocol adaptation layers (PALs) work together to embed functional safety and security enablers natively at the "edge" – ultimately within the sensor, display and ECU components themselves.

MIPI DevCon 2021: Latest Developments within MIPI Automotive SerDes Solutions (MASS) from MIPI Alliance

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0 MIPI DevCon 2021: The MIPI Specification Roadmap: Driving Advancements in Mobile, IoT, Automotive and 5G /slideshow/mipi-devcon-2021-the-mipi-specification-roadmap-driving-advancements-in-mobile-iot-automotive-and-5g/250351244 02devcon2021-technical-roadmap2-211001202546
Presented by James Goel, MIPI Technical Steering Group Chair Despite the many challenges over the past year, MIPI Alliance is on track to release more specifications in 2021 than in any other year in the organization's history. This packed schedule covers updates to many of MIPI's most popular specifications, including all physical layer specifications, MIPI I3C® and I3C Basic℠, and those for camera and display, in addition to introducing several new specifications. James Goel, chair of the MIPI Technical Steering Group, highlights some of the key specifications released over the past year and then provides a look at what's still to come. He' also provides an overview of MIPI's development activity in particular focus areas, such as automotive, IoT, 5G and security.]]>
Presented by James Goel, MIPI Technical Steering Group Chair Despite the many challenges over the past year, MIPI Alliance is on track to release more specifications in 2021 than in any other year in the organization's history. This packed schedule covers updates to many of MIPI's most popular specifications, including all physical layer specifications, MIPI I3C® and I3C Basic℠, and those for camera and display, in addition to introducing several new specifications. James Goel, chair of the MIPI Technical Steering Group, highlights some of the key specifications released over the past year and then provides a look at what's still to come. He' also provides an overview of MIPI's development activity in particular focus areas, such as automotive, IoT, 5G and security.]]> Fri, 01 Oct 2021 20:25:45 GMT /slideshow/mipi-devcon-2021-the-mipi-specification-roadmap-driving-advancements-in-mobile-iot-automotive-and-5g/250351244 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: The MIPI Specification Roadmap: Driving Advancements in Mobile, IoT, Automotive and 5G MIPI-Alliance Presented by James Goel, MIPI Technical Steering Group Chair Despite the many challenges over the past year, MIPI Alliance is on track to release more specifications in 2021 than in any other year in the organization's history. This packed schedule covers updates to many of MIPI's most popular specifications, including all physical layer specifications, MIPI I3C® and I3C Basic℠, and those for camera and display, in addition to introducing several new specifications. James Goel, chair of the MIPI Technical Steering Group, highlights some of the key specifications released over the past year and then provides a look at what's still to come. He' also provides an overview of MIPI's development activity in particular focus areas, such as automotive, IoT, 5G and security. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/02devcon2021-technical-roadmap2-211001202546-thumbnail.jpg?width=120&height=120&fit=bounds" /> Presented by James Goel, MIPI Technical Steering Group Chair Despite the many challenges over the past year, MIPI Alliance is on track to release more specifications in 2021 than in any other year in the organization's history. This packed schedule covers updates to many of MIPI's most popular specifications, including all physical layer specifications, MIPI I3C® and I3C Basic℠, and those for camera and display, in addition to introducing several new specifications. James Goel, chair of the MIPI Technical Steering Group, highlights some of the key specifications released over the past year and then provides a look at what's still to come. He' also provides an overview of MIPI's development activity in particular focus areas, such as automotive, IoT, 5G and security.

MIPI DevCon 2021: The MIPI Specification Roadmap: Driving Advancements in Mobile, IoT, Automotive and 5G from MIPI Alliance

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0 MIPI DevCon 2021: State of the Alliance /slideshow/mipi-devcon-2021-state-of-the-alliance/250351241 01devcon2021-mipi-state-of-the-alliance-211001202340
Get an update on MIPI Alliance priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G. Peter Lefkin, MIPI managing director, discusses collaborative efforts within the Alliance and industry, as well as progress toward strategic priorities, including the development of key specifications and resources, education opportunities, outreach and other activities to support the MIPI member ecosystem.]]>
Get an update on MIPI Alliance priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G. Peter Lefkin, MIPI managing director, discusses collaborative efforts within the Alliance and industry, as well as progress toward strategic priorities, including the development of key specifications and resources, education opportunities, outreach and other activities to support the MIPI member ecosystem.]]> Fri, 01 Oct 2021 20:23:39 GMT /slideshow/mipi-devcon-2021-state-of-the-alliance/250351241 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2021: State of the Alliance MIPI-Alliance Get an update on MIPI Alliance priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G. Peter Lefkin, MIPI managing director, discusses collaborative efforts within the Alliance and industry, as well as progress toward strategic priorities, including the development of key specifications and resources, education opportunities, outreach and other activities to support the MIPI member ecosystem. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/01devcon2021-mipi-state-of-the-alliance-211001202340-thumbnail.jpg?width=120&height=120&fit=bounds" /> Get an update on MIPI Alliance priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G. Peter Lefkin, MIPI managing director, discusses collaborative efforts within the Alliance and industry, as well as progress toward strategic priorities, including the development of key specifications and resources, education opportunities, outreach and other activities to support the MIPI member ecosystem.

MIPI DevCon 2021: State of the Alliance from MIPI Alliance

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0 MIPI DevCon 2020 | Snapshot of MIPI RFFE v3.0 from a System-Architecture Perspective /slideshow/mipi-devcon-2020-snapshot-of-mipi-rffe-v30-from-a-systemarchitecture-perspective/238800432 mipi-devcon-2020-snapshot-on-mipi-rffe-v3-from-a-systems-architecture-perspective-201008195603
Lalan Mishra, vice-chair of the MIPI RFFE Working Group, presents the new features of MIPI RFFE v3.0 to help architecture and design engineers understand how the triggering features in the latest version work together to improve performance and to switch quickly among the various bands and band combinations in a 5G system.]]>
Lalan Mishra, vice-chair of the MIPI RFFE Working Group, presents the new features of MIPI RFFE v3.0 to help architecture and design engineers understand how the triggering features in the latest version work together to improve performance and to switch quickly among the various bands and band combinations in a 5G system.]]> Thu, 08 Oct 2020 19:56:03 GMT /slideshow/mipi-devcon-2020-snapshot-of-mipi-rffe-v30-from-a-systemarchitecture-perspective/238800432 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2020 | Snapshot of MIPI RFFE v3.0 from a System-Architecture Perspective MIPI-Alliance Lalan Mishra, vice-chair of the MIPI RFFE Working Group, presents the new features of MIPI RFFE v3.0 to help architecture and design engineers understand how the triggering features in the latest version work together to improve performance and to switch quickly among the various bands and band combinations in a 5G system. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/mipi-devcon-2020-snapshot-on-mipi-rffe-v3-from-a-systems-architecture-perspective-201008195603-thumbnail.jpg?width=120&height=120&fit=bounds" /> Lalan Mishra, vice-chair of the MIPI RFFE Working Group, presents the new features of MIPI RFFE v3.0 to help architecture and design engineers understand how the triggering features in the latest version work together to improve performance and to switch quickly among the various bands and band combinations in a 5G system.

MIPI DevCon 2020 | Snapshot of MIPI RFFE v3.0 from a System-Architecture Perspective from MIPI Alliance

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0 MIPI DevCon 2020 | The Story Behind the MIPI I3C HCI Driver for Linux /slideshow/mipi-devcon-2020-the-story-behind-the-mipi-i3c-hci-driver-for-linux/238800416 mipi-devcon-2020-the-story-behind-the-mipi-i3c-hci-driver-for-linux-201008195051
Nicolas Pitre of BayLibre covers the work that has been done to date to plan Linux support when new technology is developed and a quick overview of future development.]]>
Nicolas Pitre of BayLibre covers the work that has been done to date to plan Linux support when new technology is developed and a quick overview of future development.]]> Thu, 08 Oct 2020 19:50:51 GMT /slideshow/mipi-devcon-2020-the-story-behind-the-mipi-i3c-hci-driver-for-linux/238800416 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2020 | The Story Behind the MIPI I3C HCI Driver for Linux MIPI-Alliance Nicolas Pitre of BayLibre covers the work that has been done to date to plan Linux support when new technology is developed and a quick overview of future development. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/mipi-devcon-2020-the-story-behind-the-mipi-i3c-hci-driver-for-linux-201008195051-thumbnail.jpg?width=120&height=120&fit=bounds" /> Nicolas Pitre of BayLibre covers the work that has been done to date to plan Linux support when new technology is developed and a quick overview of future development.

MIPI DevCon 2020 | The Story Behind the MIPI I3C HCI Driver for Linux from MIPI Alliance

]]> 242 0 https://cdn.slidesharecdn.com/ss_thumbnails/mipi-devcon-2020-the-story-behind-the-mipi-i3c-hci-driver-for-linux-201008195051-thumbnail.jpg?width=120&height=120&fit=bounds presentation Black http://activitystrea.ms/schema/1.0/post

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0 MIPI DevCon 2020 | Interoperability Challenges and Solutions for MIPI I3C /MIPI-Alliance/mipi-devcon-2020-interoperability-challenges-and-solutions-for-mipi-i3c mipi-devcon-2020-interoperability-challenges-and-solutions-for-mipi-i3c-201008194849
This presentation from Geoffrey Duerden of Introspect Technology features a case study of several specific interoperability challenges and solutions in terms of circuit and layout guidelines, protocol implementations and target applications.]]>
This presentation from Geoffrey Duerden of Introspect Technology features a case study of several specific interoperability challenges and solutions in terms of circuit and layout guidelines, protocol implementations and target applications.]]> Thu, 08 Oct 2020 19:48:48 GMT /MIPI-Alliance/mipi-devcon-2020-interoperability-challenges-and-solutions-for-mipi-i3c MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2020 | Interoperability Challenges and Solutions for MIPI I3C MIPI-Alliance This presentation from Geoffrey Duerden of Introspect Technology features a case study of several specific interoperability challenges and solutions in terms of circuit and layout guidelines, protocol implementations and target applications. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/mipi-devcon-2020-interoperability-challenges-and-solutions-for-mipi-i3c-201008194849-thumbnail.jpg?width=120&height=120&fit=bounds" /> This presentation from Geoffrey Duerden of Introspect Technology features a case study of several specific interoperability challenges and solutions in terms of circuit and layout guidelines, protocol implementations and target applications.

MIPI DevCon 2020 | Interoperability Challenges and Solutions for MIPI I3C from MIPI Alliance

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0 MIPI DevCon 2020 | Why an Integrated MIPI C-PHY/D-PHY IP is Essential /slideshow/mipi-devcon-2020-why-an-integrated-mipi-cphydphy-ip-is-essential/238800393 mipi-devcon-2020-why-an-integrated-mipi-c-phy-d-phy-ip-is-essential-201008194420
Licinio Sousa of Synopsys describes the key advantages of the latest MIPI C-PHY℠ and D-PHY℠ specifications and how designers are implementing them in multipixel cameras and high-resolution displays targeting mobile, drone and automotive applications.]]>
Licinio Sousa of Synopsys describes the key advantages of the latest MIPI C-PHY℠ and D-PHY℠ specifications and how designers are implementing them in multipixel cameras and high-resolution displays targeting mobile, drone and automotive applications.]]> Thu, 08 Oct 2020 19:44:20 GMT /slideshow/mipi-devcon-2020-why-an-integrated-mipi-cphydphy-ip-is-essential/238800393 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2020 | Why an Integrated MIPI C-PHY/D-PHY IP is Essential MIPI-Alliance Licinio Sousa of Synopsys describes the key advantages of the latest MIPI C-PHY℠ and D-PHY℠ specifications and how designers are implementing them in multipixel cameras and high-resolution displays targeting mobile, drone and automotive applications. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/mipi-devcon-2020-why-an-integrated-mipi-c-phy-d-phy-ip-is-essential-201008194420-thumbnail.jpg?width=120&height=120&fit=bounds" /> Licinio Sousa of Synopsys describes the key advantages of the latest MIPI C-PHY℠ and D-PHY℠ specifications and how designers are implementing them in multipixel cameras and high-resolution displays targeting mobile, drone and automotive applications.

MIPI DevCon 2020 | Why an Integrated MIPI C-PHY/D-PHY IP is Essential from MIPI Alliance

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0 MIPI DevCon 2020 | MIPI to Bluetooth LE: Leveraging Mobile Technology for Wireless IoT Applications /slideshow/mipi-devcon-2020-mipi-to-bluetooth-le-leveraging-mobile-technology-for-wireless-iot-applications/238800385 mipi-devcon-2020-mipi-to-bluetooth-le-leveraging-mobile-technology-for-wireless-iot-applications-201008194149
Grant Jennings of GOWIN Semiconductor shares use case examples in the wireless IoT space found while helping customers develop new types of solutions with the first SoC FPGA with built in Bluetooth Low Energy (LE) transceiver.]]>
Grant Jennings of GOWIN Semiconductor shares use case examples in the wireless IoT space found while helping customers develop new types of solutions with the first SoC FPGA with built in Bluetooth Low Energy (LE) transceiver.]]> Thu, 08 Oct 2020 19:41:49 GMT /slideshow/mipi-devcon-2020-mipi-to-bluetooth-le-leveraging-mobile-technology-for-wireless-iot-applications/238800385 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2020 | MIPI to Bluetooth LE: Leveraging Mobile Technology for Wireless IoT Applications MIPI-Alliance Grant Jennings of GOWIN Semiconductor shares use case examples in the wireless IoT space found while helping customers develop new types of solutions with the first SoC FPGA with built in Bluetooth Low Energy (LE) transceiver. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/mipi-devcon-2020-mipi-to-bluetooth-le-leveraging-mobile-technology-for-wireless-iot-applications-201008194149-thumbnail.jpg?width=120&height=120&fit=bounds" /> Grant Jennings of GOWIN Semiconductor shares use case examples in the wireless IoT space found while helping customers develop new types of solutions with the first SoC FPGA with built in Bluetooth Low Energy (LE) transceiver.

MIPI DevCon 2020 | MIPI to Bluetooth LE: Leveraging Mobile Technology for Wireless IoT Applications from MIPI Alliance

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0 MIPI DevCon 2020 | MIPI Alliance: Enabling the IoT Opportunity /slideshow/mipi-devcon-2020-mipi-alliance-enabling-the-iot-opportunity/238800343 mipi-devcon-2020-enabling-the-iot-opportunity-201008192720
Kevin Yee, chair of MIPI Marketing Steering Group, and Ian Smith, MIPI technical content manager and author of the MIPI Alliance IoT White Paper, explain the advantages of using MIPI specifications within IoT devices and provide an overview of the MIPI specifications that are most relevant to the IoT market.]]>
Kevin Yee, chair of MIPI Marketing Steering Group, and Ian Smith, MIPI technical content manager and author of the MIPI Alliance IoT White Paper, explain the advantages of using MIPI specifications within IoT devices and provide an overview of the MIPI specifications that are most relevant to the IoT market.]]> Thu, 08 Oct 2020 19:27:20 GMT /slideshow/mipi-devcon-2020-mipi-alliance-enabling-the-iot-opportunity/238800343 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2020 | MIPI Alliance: Enabling the IoT Opportunity MIPI-Alliance Kevin Yee, chair of MIPI Marketing Steering Group, and Ian Smith, MIPI technical content manager and author of the MIPI Alliance IoT White Paper, explain the advantages of using MIPI specifications within IoT devices and provide an overview of the MIPI specifications that are most relevant to the IoT market. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/mipi-devcon-2020-enabling-the-iot-opportunity-201008192720-thumbnail.jpg?width=120&height=120&fit=bounds" /> Kevin Yee, chair of MIPI Marketing Steering Group, and Ian Smith, MIPI technical content manager and author of the MIPI Alliance IoT White Paper, explain the advantages of using MIPI specifications within IoT devices and provide an overview of the MIPI specifications that are most relevant to the IoT market.

MIPI DevCon 2020 | MIPI Alliance: Enabling the IoT Opportunity from MIPI Alliance

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0 MIPI DevCon 2020 | MIPI DevCon 2020 | How MIPI Interfaces Solve Challenges in ADAS/AD Sensor Validation /slideshow/mipi-devcon-2020-mipi-devcon-2020-how-mipi-interfaces-solve-challenges-in-adasad-sensor-validation/238800330 mipi-devcon-2020-how-mipi-interfaces-solve-challenges-in-adas-ad-sensor-validation-201008192411
This presentation, from Gregor Sievers, Ph.D., of dSPACE GmbH, addresses how the MIPI CSI-2℠, D-PHY℠, CCS, and A-PHY℠ specifications simplify validation and testing and help bring autonomous driving to the streets.]]>
This presentation, from Gregor Sievers, Ph.D., of dSPACE GmbH, addresses how the MIPI CSI-2℠, D-PHY℠, CCS, and A-PHY℠ specifications simplify validation and testing and help bring autonomous driving to the streets.]]> Thu, 08 Oct 2020 19:24:11 GMT /slideshow/mipi-devcon-2020-mipi-devcon-2020-how-mipi-interfaces-solve-challenges-in-adasad-sensor-validation/238800330 MIPI-Alliance@slideshare.net(MIPI-Alliance) MIPI DevCon 2020 | MIPI DevCon 2020 | How MIPI Interfaces Solve Challenges in ADAS/AD Sensor Validation MIPI-Alliance This presentation, from Gregor Sievers, Ph.D., of dSPACE GmbH, addresses how the MIPI CSI-2℠, D-PHY℠, CCS, and A-PHY℠ specifications simplify validation and testing and help bring autonomous driving to the streets. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/mipi-devcon-2020-how-mipi-interfaces-solve-challenges-in-adas-ad-sensor-validation-201008192411-thumbnail.jpg?width=120&height=120&fit=bounds" /> This presentation, from Gregor Sievers, Ph.D., of dSPACE GmbH, addresses how the MIPI CSI-2℠, D-PHY℠, CCS, and A-PHY℠ specifications simplify validation and testing and help bring autonomous driving to the streets.

MIPI DevCon 2020 | MIPI DevCon 2020 | How MIPI Interfaces Solve Challenges in ADAS/AD Sensor Validation from MIPI Alliance

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0 https://cdn.slidesharecdn.com/profile-photo-MIPI-Alliance-48x48.jpg?cb=1682086354 MIPI Alliance (MIPI) develops interface specifications for mobile and mobile-influenced industries. Founded in 2003, the organization has 280 member companies worldwide and 14 active working groups delivering specifications within the mobile ecosystem. MIPI Alliance members include handset manufacturers, device OEMs, software providers, semiconductor companies, application processor developers, IP tool providers, test and test equipment companies, as well as camera, tablet and laptop manufacturers. There is at least one MIPI specification in every smartphone manufactured today. www.mipi.org https://cdn.slidesharecdn.com/ss_thumbnails/13devcon2021-mipi-i3c-under-the-spotlight-a-fireside-chat-with-the-i3c-experts-panel-211004140252-thumbnail.jpg?width=320&height=320&fit=bounds slideshow/mipi-devcon-2021-mipi-i3c-under-the-spotlight-a-fireside-chat-with-the-i3c-experts/250366674 MIPI DevCon 2021: MIPI... https://cdn.slidesharecdn.com/ss_thumbnails/12devcon2021-mipii3c-application-and-validation-models-for-iotsensor-nodes-211004135939-thumbnail.jpg?width=320&height=320&fit=bounds slideshow/mipi-devcon-2021-mipi-i3c-application-and-validation-models-for-iot-sensor-nodes/250366654 MIPI DevCon 2021: MIPI... https://cdn.slidesharecdn.com/ss_thumbnails/11devcon2021-mipi-i3c-signal-integrity-challenges-on-ddr5-based-server-platform-solutions-211004135219-thumbnail.jpg?width=320&height=320&fit=bounds slideshow/mipi-devcon-2021-mipi-i3c-signal-integrity-challenges-on-ddr5based-server-platform-solutions/250366625 MIPI DevCon 2021: MIPI...