/ http://www.slideshare.net/images/logo.gif / 際際滷Share feed for 際際滷shows by User: RoyMorta https://cdn.slidesharecdn.com/profile-photo-RoyMorta-48x48.jpg?cb=1505218785 - With broad experience in semiconductor Failure Analysis and capable of performing both package & die level analysis. Hands-on on the different FA techniques such as Bench Testing, CSAM, XRAY, SEM-EDX, RIE, Fault isolation (Liquid Crystal analysis, EMMI and OBIRCH), Cross-section, Parallel-lapping and Deprocessing. - With experience in establishing a Failure Analysis and Reliability Laboratory, its process flow, procedure and specification. - Familiar with Reliability and its different stresses. Can plan and execute a Qualification or Reliability plan by creating a timeline aligned with available resources (manpower and tester allocation). - With experience in handling Customer RMA (ret...