/ http://www.slideshare.net/images/logo.gif / 際際滷Share feed for 際際滷shows by User: SaahithyanRadhakrish https://cdn.slidesharecdn.com/profile-photo-SaahithyanRadhakrish-48x48.jpg?cb=1523517336 Technical expertise on Physical layer (Layer 1) Wireless communication technologies like 2G/2.5G/3G and WiMax. Hands on experience in Development and testing of features in GSM & EDGE. Simulated and developed algorithms for WiMax synchronizaion procedures. Hands on experience in coding device driver for FPGA and DSP. Thorough knowledge on 3GPP specification of 2G/2.5G. Enthusiastic to learn and work on other wireless technologies.