/ http://www.slideshare.net/images/logo.gif / 際際滷Share feed for 際際滷shows by User: ScottTao https://cdn.slidesharecdn.com/profile-photo-ScottTao-48x48.jpg?cb=1609455825 15+ years in semiconductor packaging development & production quality: - QFN, flip chip, PoP, WLP/eWLP, TSV, 3D packaging - Processor, SoC, Connectivity, RF module, EPS - 28/20nm backend Char - Optical MEMS projecter/Fluidic MEMS printhead - LAB on electronic component/assembly/ board characterization - 8D/RMA/CAR/PCN - Suppliers HVM ramp up audit/monthly operation KPI review 8+ years in industrial technology research and development - automatic power transmission design and development - scroll compressor design and development - C and C++ program 75+ patents granted in USPTO, lead corporate paten team (2y) Specialties: - Advanced portable e...