ºÝºÝߣshows by User: kimshyong / http://www.slideshare.net/images/logo.gif ºÝºÝߣshows by User: kimshyong / Thu, 16 May 2019 09:12:30 GMT ºÝºÝߣShare feed for ºÝºÝߣshows by User: kimshyong Plasma based methods to produce hydrophobic coatings (repels water) /slideshow/plasma-based-methods-to-produce-hydrophobic-coatings-repels-water/146008127 ppp2018siowhydrophobiccoating-190516091230
this review discusses the plasma based method to produce water repelling coatings (hydrophobic). examples are siloxane-based, fluorine-based, diamond like carbon]]>
this review discusses the plasma based method to produce water repelling coatings (hydrophobic). examples are siloxane-based, fluorine-based, diamond like carbon]]> Thu, 16 May 2019 09:12:30 GMT /slideshow/plasma-based-methods-to-produce-hydrophobic-coatings-repels-water/146008127 kimshyong@slideshare.net(kimshyong) Plasma based methods to produce hydrophobic coatings (repels water) kimshyong this review discusses the plasma based method to produce water repelling coatings (hydrophobic). examples are siloxane-based, fluorine-based, diamond like carbon <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/ppp2018siowhydrophobiccoating-190516091230-thumbnail.jpg?width=120&amp;height=120&amp;fit=bounds" /><br> this review discusses the plasma based method to produce water repelling coatings (hydrophobic). examples are siloxane-based, fluorine-based, diamond like carbon
Plasma based methods to produce hydrophobic coatings (repels water) from kimshyong
]]> 135 3 https://cdn.slidesharecdn.com/ss_thumbnails/ppp2018siowhydrophobiccoating-190516091230-thumbnail.jpg?width=120&height=120&fit=bounds document Black http://activitystrea.ms/schema/1.0/post http://activitystrea.ms/schema/1.0/posted 0 XPS sulfur phosphorus binding energy /slideshow/xps-sulfur-phosphorus-binding-energy/146007575 xpssulfurphosophorussains2018-190516090801
binding energies for various sulfur (sulfonate, sulfate) and and phosphorus (phosphonate, phosphate, etc.) compounds. this definite determination is required in the battery and solar cells studies. ]]>
binding energies for various sulfur (sulfonate, sulfate) and and phosphorus (phosphonate, phosphate, etc.) compounds. this definite determination is required in the battery and solar cells studies. ]]> Thu, 16 May 2019 09:08:01 GMT /slideshow/xps-sulfur-phosphorus-binding-energy/146007575 kimshyong@slideshare.net(kimshyong) XPS sulfur phosphorus binding energy kimshyong binding energies for various sulfur (sulfonate, sulfate) and and phosphorus (phosphonate, phosphate, etc.) compounds. this definite determination is required in the battery and solar cells studies. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/xpssulfurphosophorussains2018-190516090801-thumbnail.jpg?width=120&amp;height=120&amp;fit=bounds" /><br> binding energies for various sulfur (sulfonate, sulfate) and and phosphorus (phosphonate, phosphate, etc.) compounds. this definite determination is required in the battery and solar cells studies.
XPS sulfur phosphorus binding energy from kimshyong
]]> 243 4 https://cdn.slidesharecdn.com/ss_thumbnails/xpssulfurphosophorussains2018-190516090801-thumbnail.jpg?width=120&height=120&fit=bounds document Black http://activitystrea.ms/schema/1.0/post http://activitystrea.ms/schema/1.0/posted 0 sintered silver as lead free (pb-free) die attach materials. /slideshow/sintered-silver-as-lead-free-pbfree-die-attach-materials/56896538 06521795-160111081335
This paper documents the feasibility study of using micrometer-scale Ag paste as a lead-free (Pb-free) die attach material for microelectronic packaging. Currently, there is no viable Pb-free die attach in the market which can pass the reliability testing regimen. Sintered Ag was explored as an interconnect material because of its relatively low processing temperature and robust joint after sintered. This report suggests a possible route for using Ag paste as a Pb-free die attach by dispensing as per current production epoxy die attach. This feasibility study reports the mechanical integrity, electrical and reliability testing of a surface mount power package with four types of dispensable Ag past‰es]]>
This paper documents the feasibility study of using micrometer-scale Ag paste as a lead-free (Pb-free) die attach material for microelectronic packaging. Currently, there is no viable Pb-free die attach in the market which can pass the reliability testing regimen. Sintered Ag was explored as an interconnect material because of its relatively low processing temperature and robust joint after sintered. This report suggests a possible route for using Ag paste as a Pb-free die attach by dispensing as per current production epoxy die attach. This feasibility study reports the mechanical integrity, electrical and reliability testing of a surface mount power package with four types of dispensable Ag past‰es]]> Mon, 11 Jan 2016 08:13:34 GMT /slideshow/sintered-silver-as-lead-free-pbfree-die-attach-materials/56896538 kimshyong@slideshare.net(kimshyong) sintered silver as lead free (pb-free) die attach materials. kimshyong This paper documents the feasibility study of using micrometer-scale Ag paste as a lead-free (Pb-free) die attach material for microelectronic packaging. Currently, there is no viable Pb-free die attach in the market which can pass the reliability testing regimen. Sintered Ag was explored as an interconnect material because of its relatively low processing temperature and robust joint after sintered. This report suggests a possible route for using Ag paste as a Pb-free die attach by dispensing as per current production epoxy die attach. This feasibility study reports the mechanical integrity, electrical and reliability testing of a surface mount power package with four types of dispensable Ag past‰es <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/06521795-160111081335-thumbnail.jpg?width=120&amp;height=120&amp;fit=bounds" /><br> This paper documents the feasibility study of using micrometer-scale Ag paste as a lead-free (Pb-free) die attach material for microelectronic packaging. Currently, there is no viable Pb-free die attach in the market which can pass the reliability testing regimen. Sintered Ag was explored as an interconnect material because of its relatively low processing temperature and robust joint after sintered. This report suggests a possible route for using Ag paste as a Pb-free die attach by dispensing as per current production epoxy die attach. This feasibility study reports the mechanical integrity, electrical and reliability testing of a surface mount power package with four types of dispensable Ag past‰es
sintered silver as lead free (pb-free) die attach materials. from kimshyong
]]> 966 5 https://cdn.slidesharecdn.com/ss_thumbnails/06521795-160111081335-thumbnail.jpg?width=120&height=120&fit=bounds document Black http://activitystrea.ms/schema/1.0/post http://activitystrea.ms/schema/1.0/posted 0 https://public.slidesharecdn.com/v2/images/profile-picture.png https://cdn.slidesharecdn.com/ss_thumbnails/ppp2018siowhydrophobiccoating-190516091230-thumbnail.jpg?width=320&height=320&fit=bounds slideshow/plasma-based-methods-to-produce-hydrophobic-coatings-repels-water/146008127 Plasma based methods t... https://cdn.slidesharecdn.com/ss_thumbnails/xpssulfurphosophorussains2018-190516090801-thumbnail.jpg?width=320&height=320&fit=bounds slideshow/xps-sulfur-phosphorus-binding-energy/146007575 XPS sulfur phosphorus ... https://cdn.slidesharecdn.com/ss_thumbnails/06521795-160111081335-thumbnail.jpg?width=320&height=320&fit=bounds slideshow/sintered-silver-as-lead-free-pbfree-die-attach-materials/56896538 sintered silver as lea...