/ http://www.slideshare.net/images/logo.gif / 際際滷Share feed for 際際滷shows by User: seongdokim https://cdn.slidesharecdn.com/profile-photo-seongdokim-48x48.jpg?cb=1523565334 SIC(System IC) R&D Lab. - [Mobile AP chip design]BSP SW development for mobile Application Processor. - Good understanding of AP overall architecture and system application. - Good understanding of major AP interface such as MIPI CSI/DSI, M-PHY,eDP, PCIe, UFS, SDIO etc. - [WiFi/BT chip design]Android host SW development for WiFi/Bluetooth - good understanding of WiFi standard & protocol (IEEE 802.11 ac) ,- goog understanding Bluetooth protocon and profile such as BLE(Bluetooth Low Energy) and IoT MC(Mobile Communication ) R&D Lab. - new Application Processor phone level evaluation - memory performance analysis in smart phone (LPDDR, eMMC) - new MODEM solution phone lev...