Shirsho Sengupta
Personal Information
Organization / Workplace
Greater San Diego Area United States
Occupation
Staff Packaging Engineer at Qualcomm
Industry
Electronics / Computer Hardware
About
Interests & Expertise:
 Semiconductor assembly/ manufacturing/ far-backend (FBEoL) processes, technology & supply chain development with specialization in high density interconnect (HDI) flip-chip BGA, PGA & LGA packages.
 Silicon-package integration, BEoL/C4 & package interaction (CPI).
 Assembly/packaging materials: flux, underfill, solders, surfactant, TIM, adhesives & sealants, die-attach, substrates.
 Reliability issues in electronic packages, failure mechanisms, models, analysis techniques, accelerated tests, test standards, FMEA & root cause diagnostics, life-data analysis.
 Advanced semiconductor packaging technologies, 2.5/ 3D stacked die packaging.
 Fracture mechanics, f...
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