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sunil gaikwad
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This document discusses thermal challenges in LED applications and introduces SinkPAD technology as a solution. SinkPAD PCB technology provides a direct thermal path that conducts heat from the LED chip more efficiently than conventional metal core PCBs. This allows LEDs to run cooler, last longer, and achieve higher brightness compared to traditional solutions. The document compares SinkPAD to metal back PCBs and outlines the benefits SinkPAD provides, such as lower junction temperatures, thinner designs, and reduced costs. Potential applications of SinkPAD include lighting fixtures, displays, and any system requiring efficient thermal management of high-power LEDs.

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Presented BY Gaikwad Sunil S. Guided By Mrs. Jayashree Patil
Thermal Challenges In The LED Applications How it is Addressed? Metal Back PCB Technology Is There a Better Way? SinkPAD Technology What Would I Gain Using SinkPAD? Comparisons Of Metal Back & SinkPAD Potential Applications Conclusion PRESENTATION OUTLINE
Increasing Trend For LED Power Increasing Trend For Higher Brightness Primary Thermal Path: Conduction Cooling Higher Thermal Resistance Power Density Increasing more LEDs in a small area Long Life Expectation THERMAL CHALLANGES
How Heat Issues Addressed Historically?
YES SinkPAD Technology Is There a Better Way to Remove Heat?
SinkPAD technology is a thermal management Printed Circuit Board (PCB) technology that makes it possible to conduct heat out of a LED and into the atmosphere faster and more efficiently than a conventional MCPCB. SinkPAD provides superior thermal performance for medium to high power LEDs. This is the most economical & scalable "Direct Thermal Path" MCPCB solution available for the LED application. What is SinkPAD Technology?
SinkPAD metal substrate sectional view: SinkPADTM TECHNOLOGY
To understand how SinkPAD technology works let's first review the primary thermal path found in LED applications. In a LED the heat originates at the chip (die) in the same way that in a normal light bulb heat originates at the filament. The key difference is that in the case of a light bulb the heat is radiated into the atmosphere and in the case of a LED heat must be conducted through a series of mediums before it reaches the atmosphere. A high rate of thermal conduction means cooler running LEDs while a low rate means very hot and potentially self destructive LEDs. How SinkPAD Works?
SinkPAD technology makes it possible to increase the thermal conduction rate from the slug (i.e. thermal pad within the LED package) to the metal base of a PCB from the industry standards of 1 - 4 W/m.K to that of the metal base itself which ranges between 135 W/m.K and 385 W/m.K. In essence SinkPAD PCB technology provides Direct Thermal Path to the LED by eliminating dielectric from the thermal path. How SinkPAD Works?
SinkPAD Showing practical example of Direct Heat Transfer Path: SinkPADTM TECHNOLOGY
SinkPAD PCB will Lower LED Junction Temperature Which means : 1) Option to run LED at lower junction temperature i.e. Increase Life of the LED Fixture 2) Option to run LED at higher power / maintain temperature i.e. Get more lumens per LED 3) Reduce number of LEDs to get same light i.e. Reduces Fixture Cost 4) Higher drive currents, brighter light, fewer components What would I gain using SinkPAD?
COMPARISION OF METAL BACK & SinkPAD PCB Metal Back PCB Higher Thermal Resistance Slow Heat Transfer Rate i.e. 1- 5 W/m.k. Special Dielectric Required Thick Base Metal Required Limited to Epoxy dielectric only Metal is Insulated Thermally From The Component SinkPAD PCB Direct Thermal Path Fast Heat Transfer Rate i.e.210 to 385 W/m.K Standard Dielectric Used Thinner Base Metal Options Epoxy, Polyimide or any typical dielectric can be used Metal is Connected Thermally to the Component
Following Video Shows Thermal Test of Sinkpad PCB Vs MCPCB
THERMAL PATHS IN SinkPAD PCB AND MCPCB
POTENTIALAPPLICATIONS
Potential Applications of SinkpadTM is as Following:
Higher Thermal Transfer Rate, Lower Junction Temperature. Multilayer Possible Without Increase In Thermal Resistance. Weight Saving i.e. Possibly thinner profile. Most Economical Direct Thermal Path Solution. Maximum LED life . Maximum lumens output . Improved color stability . Same light output with fewer LEDs means reduced cost . MERITS OF SinkPAD PCB
SinkPAD corporations new thermal management PCB are a complete and effective solution to the challenges faced by the solid state lighting industry, specifically those with high power LED PCB applications available now. The new SinkPAD technology significantly improves LED thermal management in all LED systems. It is most effective in high-power high-bright surface mount LED systems for commercial applications. CONCLUSION
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  • 1. Presented BY Gaikwad Sunil S. Guided By Mrs. Jayashree Patil
  • 2. Thermal Challenges In The LED Applications How it is Addressed? Metal Back PCB Technology Is There a Better Way? SinkPAD Technology What Would I Gain Using SinkPAD? Comparisons Of Metal Back & SinkPAD Potential Applications Conclusion PRESENTATION OUTLINE
  • 3. Increasing Trend For LED Power Increasing Trend For Higher Brightness Primary Thermal Path: Conduction Cooling Higher Thermal Resistance Power Density Increasing more LEDs in a small area Long Life Expectation THERMAL CHALLANGES
  • 4. How Heat Issues Addressed Historically?
  • 5. YES SinkPAD Technology Is There a Better Way to Remove Heat?
  • 6. SinkPAD technology is a thermal management Printed Circuit Board (PCB) technology that makes it possible to conduct heat out of a LED and into the atmosphere faster and more efficiently than a conventional MCPCB. SinkPAD provides superior thermal performance for medium to high power LEDs. This is the most economical & scalable "Direct Thermal Path" MCPCB solution available for the LED application. What is SinkPAD Technology?
  • 7. SinkPAD metal substrate sectional view: SinkPADTM TECHNOLOGY
  • 8. To understand how SinkPAD technology works let's first review the primary thermal path found in LED applications. In a LED the heat originates at the chip (die) in the same way that in a normal light bulb heat originates at the filament. The key difference is that in the case of a light bulb the heat is radiated into the atmosphere and in the case of a LED heat must be conducted through a series of mediums before it reaches the atmosphere. A high rate of thermal conduction means cooler running LEDs while a low rate means very hot and potentially self destructive LEDs. How SinkPAD Works?
  • 9. SinkPAD technology makes it possible to increase the thermal conduction rate from the slug (i.e. thermal pad within the LED package) to the metal base of a PCB from the industry standards of 1 - 4 W/m.K to that of the metal base itself which ranges between 135 W/m.K and 385 W/m.K. In essence SinkPAD PCB technology provides Direct Thermal Path to the LED by eliminating dielectric from the thermal path. How SinkPAD Works?
  • 10. SinkPAD Showing practical example of Direct Heat Transfer Path: SinkPADTM TECHNOLOGY
  • 11. SinkPAD PCB will Lower LED Junction Temperature Which means : 1) Option to run LED at lower junction temperature i.e. Increase Life of the LED Fixture 2) Option to run LED at higher power / maintain temperature i.e. Get more lumens per LED 3) Reduce number of LEDs to get same light i.e. Reduces Fixture Cost 4) Higher drive currents, brighter light, fewer components What would I gain using SinkPAD?
  • 12. COMPARISION OF METAL BACK & SinkPAD PCB Metal Back PCB Higher Thermal Resistance Slow Heat Transfer Rate i.e. 1- 5 W/m.k. Special Dielectric Required Thick Base Metal Required Limited to Epoxy dielectric only Metal is Insulated Thermally From The Component SinkPAD PCB Direct Thermal Path Fast Heat Transfer Rate i.e.210 to 385 W/m.K Standard Dielectric Used Thinner Base Metal Options Epoxy, Polyimide or any typical dielectric can be used Metal is Connected Thermally to the Component
  • 13. Following Video Shows Thermal Test of Sinkpad PCB Vs MCPCB
  • 14. THERMAL PATHS IN SinkPAD PCB AND MCPCB
  • 16. Potential Applications of SinkpadTM is as Following:
  • 17. Higher Thermal Transfer Rate, Lower Junction Temperature. Multilayer Possible Without Increase In Thermal Resistance. Weight Saving i.e. Possibly thinner profile. Most Economical Direct Thermal Path Solution. Maximum LED life . Maximum lumens output . Improved color stability . Same light output with fewer LEDs means reduced cost . MERITS OF SinkPAD PCB
  • 18. SinkPAD corporations new thermal management PCB are a complete and effective solution to the challenges faced by the solid state lighting industry, specifically those with high power LED PCB applications available now. The new SinkPAD technology significantly improves LED thermal management in all LED systems. It is most effective in high-power high-bright surface mount LED systems for commercial applications. CONCLUSION