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Introduction To Materials Science and Engineering, Ch. 1


          Chapter 1 Materials for Engineering




A fly-by during deployment of the aircraft carrier USS
Stennis. The pilot was grounded for 30 days, but he
likes the picture and thinks it was worth it.
                                                                               1
         University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1



         Materials Science and
             Engineering
? Materials Science ¨C Investigating
  relationships that exist between the structure
  and properties of materials
? Materials Engineering ¨C Is, on the basis of
  these structure-property correlations,
  designing or engineering the structure of a
  material to produce a pre-determined set of
  properties
                                                                             2
       University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1


                          Structure
? Sub atomic ¨C electrons and nuclei (protons
  and neutrons)
? Atomic ¨C organization of atoms or
  molecules
? Microscopic ¨C groups of atoms that are
  normally agglomerated together
? Macroscopic ¨C viewable with the un-aided
  eye


                                                                            3
      University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1



                         Terminology


           mil = 1 / 1000 inch = 25.4 ?m
      micrometer = 1 / 1,000,000 meter = 1?m
     Angstrom = 1 / 10,000,000,000 meter = 1?

1 MICROMETER IS TWO WAVELENGTHS OF GREEN LIGHT LONG



                A 1 MICRON WIDE LINE ON A CD
               IS THE SAME SCALE AS A 100 FOOT
                WIDE ROAD ON NORTH AMERICA

                    A HAIR IS 100 MICROMETERS


                                                                            4
      University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1

                                                          THE SCALE OF THINGS




                                                                                                                                                                                                                                                 The 21st century challenge -- Fashion materials at the nanoscale with desired properties and functionality
                                      Things Natural                                                                      100 m          1 meter (m)                                         Things Manmade

                                                                                                                         10-1 m          0.1 m
                                                                                                                                         100 mm
                                                                                                                                                                                                            Objects fashioned from




                                                                                                                                                             Progress in miniaturization
                                                                                                                                                                                                     metals, ceramics, glasses, polymers ...
                          Monarch butterfly
                              ~ 0.1 m                                                                                                    0.01 m
                                                        Dust mite                                                        10-2 m
                                                         300 ?m                                                                          1 cm
                                                                                                                                                                                            Head of a pin
                                                                                                                                         10 mm                                                1-2 mm
    Cat
  ~ 0.3 m
                                                                                                                         10-3 m          1 millimeter (mm)


                           Human hair                                                                                                                                                                          Microelectronics
                          ~ 50 ?m wide                                                                                                   0.1 mm
                                                         Fly ash                                                         10-4 m                                                             MEMS (MicroElectroMechanical Systems) Devices
     Bee                                               ~ 10-20 ?m                                                                        100 ?m                                                            10 -100 ?m wide




                                                                                                                    Microworld
                                                                           Progress in atomic-level understanding
   ~ 15 mm




                                                                                                                       The
                                                                                                                         10-5 m          0.01 mm
                                                                                                                                         10 ?m



                                                                                                                         10-6 m          1 micrometer (?m)



                                                                                                                                      spectrum
                                                                                                                                       Visible
                           Red blood cells
                           with white cell           Atoms of silicon
    Magnetic                  ~ 2-5 ?m                                                                                                                                                                            Red blood cells
 domains garnet                                    spacing ~tenths of nm                                                                                                                                         Pollen grain
      film                                                                                                               10-7     m      0.1 ?m
   11 ?m wide                                                                                                                            100 nm
                                                                                                                    Nanoworld




     stripes
Schematic, central core   ATP synthase
                                                                                                                       The




                                                                                                                         10-8 m          0.01 ?m
                                                                                                                                         10 nm

                                                                                                                                                                                                                        Quantum dot array --
                                                                                                                                                                                           Indium arsenide           germanium dots on silicon
                                                                                                                                                                                             quantum dot
                                                                                                                         10-9 m          1 nanometer (nm)
            10
            nm                                         DNA
                                                    ~2 nm wide
                                 Cell membrane
                                                                                                                            -10
                                                                                                                                                                                                                                                                                                                                                   5
                                      University of Tennessee, Dept.10 m   0.1 nm
                                                                     of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1




Processing



                       Structure



                                                      Properties



                                                                                   Performance


                                                                                             6
             University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1


Structure, Processing, & Properties
? Properties depend on structure
  ex: hardness vs structure of steel
                                                                      (d)

                   600
  Hardness (BHN)



                                                                        30?m
                   500                               (c)
                                                                      Data obtained from Figs. 10.21(a)
                   400                 (b)                            and 10.23 with 4wt%C composition,
                          (a)                                         and from Fig. 11.13 and associated
                                                           4?m        discussion, Callister 6e.
                   300                                                Micrographs adapted from (a) Fig.
                                                                      10.10; (b) Fig. 9.27;(c) Fig. 10.24;
                                          30?m
                                                                      and (d) Fig. 10.12, Callister 6e.
                   200       30?m

                   100
                      0.01 0.1            1   10 100 1000
                                         Cooling Rate (C/s)
? Processing can change structure
  ex: structure vs cooling rate of steel
                                                                                                             7
                   University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1



  The Materials Selection Process
1. Pick Application                   Determine required Properties
    Properties: mechanical, electrical, thermal,
    magnetic, optical, deteriorative.


2. Properties               Identify candidate Material(s)
    Material: structure, composition.

3. Material     Identify required Processing
    Processing: changes structure and overall shape
    ex: casting, sintering, vapor deposition, doping
        forming, joining, annealing.


                                                                              8
        University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1


    Composition, Bonding, Crystal Structure
and Microstructure DEFINE Materials Properties

                                Composition
             Bonding                                     Crystal Structure


                              Thermomechanical
                                 Processing

                                Microstructure

                 Electrical &                                             Thermal
Mechanical                                      Optical
                  Magnetic                                                Properties
Properties                                     Properties
                  Properties
                                                                                       9
         University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1


                                             ELECTRICAL
? Electrical Resistivity of Copper:
                                   6
                                                                    i                   Adapted from Fig. 18.8, Callister 6e.

                                                             a   t%N                    (Fig. 18.8 adapted from: J.O. Linde,
                                   5                   3 .32                            Ann Physik 5, 219 (1932); and
                                                  +
  Resistivity, ¦Ñ


                                                                                        C.A. Wert and R.M. Thomson,
                                               Cu              %N
                                                                   i
                   (10-8 Ohm-m)


                                                                                        Physics of Solids, 2nd edition,
                                                            at             i
                                   4
                                                      2 .16          a t% N             McGraw-Hill Company, New York,

                                                   u+          .12
                                                                                        1970.)
                                                  C          1
                                   3                    C u+
                                                     ed
                                             d eform         a t%N
                                                                     i
                                   2                    1.12
                                                   Cu+
                                                                      u
                                   1                          r e¡± C
                                                          ¡°Pu
                                   0
                                            -200          -100              0       T (¡ãC)
? Adding ¡°impurity¡± atoms to Cu increases resistivity.
? Deforming Cu increases resistivity.
                                                                                                                                10
                                  University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1


                                MAGNETIC
? Magnetic Storage:                               ? Magnetic Permeability
  --Recording medium                                    vs. Composition:
    is magnetized by                                   --Adding 3 atomic % Si
    recording head.                                      makes Fe a better
                                                         recording medium!




                                                      Magnetization
                                                                             Fe+3%Si

                                                                                Fe



                                                                      Magnetic Field
                                                      Adapted from C.R. Barrett, W.D. Nix, and
 Fig. 20.18, Callister 6e.                            A.S. Tetelman, The Principles of
 (Fig. 20.18 is from J.U. Lemke, MRS Bulletin,        Engineering Materials, Fig. 1-7(a), p. 9,
 Vol. XV, No. 3, p. 31, 1990.)                        1973. Electronically reproduced
                                                      by permission of Pearson Education, Inc.,
                                                      Upper Saddle River, New Jersey.

                                                                                                  11
               University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1


                             OPTICAL
? Transmittance:
 --Aluminum oxide may be transparent, translucent, or
   opaque depending on the material structure.

                           polycrystal:                   polycrystal:
single crystal             low porosity                  high porosity




                                                                            Adapted from Fig. 1.2,
                                                                            Callister 6e.
                                                                            (Specimen preparation,
                                                                            P.A. Lessing; photo by J.
                                                                            Telford.)



                                                                                                        12
           University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1



                        DETERIORATIVE
? Stress & Saltwater...                         ? Heat treatment: slows
  --causes cracks!                                 crack speed in salt water!




                                                       crack speed (m/s)
                                                                           10 -8         ¡°as-is¡±
                                                                                         ¡°held at
                                                                                         160C for 1hr
                                                                                         before testing¡±
                                                                     10 -10          Alloy 7178 tested in
                                                                                     saturated aqueous NaCl
                                                                                     solution at 23C

                                                                                   increasing load
                                                 Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation and
                                                 Fracture Mechanics of Engineering Materials" (4th ed.), p. 505,
 Adapted from Fig. 17.0, Callister 6e.           John Wiley and Sons, 1996. (Original source: Markus O.
 (Fig. 17.0 is from Marine Corrosion, Causes,    Speidel, Brown Boveri Co.)
 and Prevention, John Wiley and Sons, Inc.,
                                                                                                   4?m
 1975.)
                                                 --material:
                                                    7150-T651 Al "alloy"
                                                    (Zn,Cu,Mg,Zr)


                                                 Adapted from Fig. 11.24,
                                                 Callister 6e. (Fig. 11.24 provided courtesy of G.H.
                                                 Narayanan and A.G. Miller, Boeing Commercial
                                                 Airplane Company.)                                            13
                   University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1


                           Types of Materials

Metals: strong, ductile, tough, high density, conductors.
Ceramics: strong, brittle, low density, insulators.
Polymers: weak, ductile, low density, insulators.
Semiconductors: weak, brittle, low density, semi-conductors.
Composites: strong, ductile, low density, conductors, insulators.

Crystals: atoms have long range periodic order (a).
Glasses: atoms have short range order only (b).




 (a)                                               (b)
                                                                                  14
            University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1

                                 Types of Materials
Let us classify materials according to the way the atoms are bound together
(Chapter 2).
Metals: valence electrons are detached from atoms, and spread in an 'electron
sea' that "glues" the ions together. Strong, ductile, conduct electricity and heat
well, are shiny if polished.
Semiconductors: the bonding is covalent (electrons are shared between
atoms). Their electrical properties depend strongly on minute proportions of
contaminants. Examples: Si, Ge, GaAs.
Ceramics: atoms behave like either positive or negative ions, and are bound
by Coulomb forces. They are usually combinations of metals or
semiconductors with oxygen, nitrogen or carbon (oxides, nitrides, and
carbides). Hard, brittle, insulators. Examples: glass, porcelain.
Polymers: are bound by covalent forces and also by weak van der Waals
forces, and usually based on C and H. They decompose at moderate
temperatures (100 ¨C 400 C), and are lightweight. Examples: plastics rubber. 15
                 University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1



                         Metals




Several uses of steel and pressed aluminum.

                                                                      16
University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1


                                   Ceramics




Examples of ceramic materials ranging from household and lab
products to high performance combustion engines which utilize both
Metals and ceramics.                                             17
             University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1



                                 Ceramics




Crystalline ceramics (a) and non-crystalline glasses (b) yield
inherently different properties for applications. Open circles
represent nonmetallic atoms, solids represent metal atoms.
                                                                                 18
           University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1



                                  Ceramics




Examples of glasses. Depending on the material structure, the glass
can be opaque, transparent, or translucent. Glasses can also be
Processed to yield high thermal shock resistance.                 19
            University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1



                              Polymers




Polymers or commercially called ¡°Plastics¡± need no intro.
                                                                              20
        University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1



                             Polymers




Polymer composite materials, reinforcing glass fibers in a
polymer matrix.
                                                                             21
       University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1



                           Semiconductors




   (a)



                                              (b)

(a) Micro-Electrical-Mechanical Systems (MEMS), (b) Si wafer
for computer chip devices.
                                                                                22
          University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1




                                                                      23
University of Tennessee, Dept. of Materials Science and Engineering
Introduction To Materials Science and Engineering, Ch. 1




Course Goals:          SUMMARY
 ? Use the right material for the job.

 ? Understand the relation between properties,
   structure, and processing.


 ? Recognize new design opportunities offered
   by materials selection.




                                                                              24
        University of Tennessee, Dept. of Materials Science and Engineering

More Related Content

Chapter 1 basics

  • 1. Introduction To Materials Science and Engineering, Ch. 1 Chapter 1 Materials for Engineering A fly-by during deployment of the aircraft carrier USS Stennis. The pilot was grounded for 30 days, but he likes the picture and thinks it was worth it. 1 University of Tennessee, Dept. of Materials Science and Engineering
  • 2. Introduction To Materials Science and Engineering, Ch. 1 Materials Science and Engineering ? Materials Science ¨C Investigating relationships that exist between the structure and properties of materials ? Materials Engineering ¨C Is, on the basis of these structure-property correlations, designing or engineering the structure of a material to produce a pre-determined set of properties 2 University of Tennessee, Dept. of Materials Science and Engineering
  • 3. Introduction To Materials Science and Engineering, Ch. 1 Structure ? Sub atomic ¨C electrons and nuclei (protons and neutrons) ? Atomic ¨C organization of atoms or molecules ? Microscopic ¨C groups of atoms that are normally agglomerated together ? Macroscopic ¨C viewable with the un-aided eye 3 University of Tennessee, Dept. of Materials Science and Engineering
  • 4. Introduction To Materials Science and Engineering, Ch. 1 Terminology mil = 1 / 1000 inch = 25.4 ?m micrometer = 1 / 1,000,000 meter = 1?m Angstrom = 1 / 10,000,000,000 meter = 1? 1 MICROMETER IS TWO WAVELENGTHS OF GREEN LIGHT LONG A 1 MICRON WIDE LINE ON A CD IS THE SAME SCALE AS A 100 FOOT WIDE ROAD ON NORTH AMERICA A HAIR IS 100 MICROMETERS 4 University of Tennessee, Dept. of Materials Science and Engineering
  • 5. Introduction To Materials Science and Engineering, Ch. 1 THE SCALE OF THINGS The 21st century challenge -- Fashion materials at the nanoscale with desired properties and functionality Things Natural 100 m 1 meter (m) Things Manmade 10-1 m 0.1 m 100 mm Objects fashioned from Progress in miniaturization metals, ceramics, glasses, polymers ... Monarch butterfly ~ 0.1 m 0.01 m Dust mite 10-2 m 300 ?m 1 cm Head of a pin 10 mm 1-2 mm Cat ~ 0.3 m 10-3 m 1 millimeter (mm) Human hair Microelectronics ~ 50 ?m wide 0.1 mm Fly ash 10-4 m MEMS (MicroElectroMechanical Systems) Devices Bee ~ 10-20 ?m 100 ?m 10 -100 ?m wide Microworld Progress in atomic-level understanding ~ 15 mm The 10-5 m 0.01 mm 10 ?m 10-6 m 1 micrometer (?m) spectrum Visible Red blood cells with white cell Atoms of silicon Magnetic ~ 2-5 ?m Red blood cells domains garnet spacing ~tenths of nm Pollen grain film 10-7 m 0.1 ?m 11 ?m wide 100 nm Nanoworld stripes Schematic, central core ATP synthase The 10-8 m 0.01 ?m 10 nm Quantum dot array -- Indium arsenide germanium dots on silicon quantum dot 10-9 m 1 nanometer (nm) 10 nm DNA ~2 nm wide Cell membrane -10 5 University of Tennessee, Dept.10 m 0.1 nm of Materials Science and Engineering
  • 6. Introduction To Materials Science and Engineering, Ch. 1 Processing Structure Properties Performance 6 University of Tennessee, Dept. of Materials Science and Engineering
  • 7. Introduction To Materials Science and Engineering, Ch. 1 Structure, Processing, & Properties ? Properties depend on structure ex: hardness vs structure of steel (d) 600 Hardness (BHN) 30?m 500 (c) Data obtained from Figs. 10.21(a) 400 (b) and 10.23 with 4wt%C composition, (a) and from Fig. 11.13 and associated 4?m discussion, Callister 6e. 300 Micrographs adapted from (a) Fig. 10.10; (b) Fig. 9.27;(c) Fig. 10.24; 30?m and (d) Fig. 10.12, Callister 6e. 200 30?m 100 0.01 0.1 1 10 100 1000 Cooling Rate (C/s) ? Processing can change structure ex: structure vs cooling rate of steel 7 University of Tennessee, Dept. of Materials Science and Engineering
  • 8. Introduction To Materials Science and Engineering, Ch. 1 The Materials Selection Process 1. Pick Application Determine required Properties Properties: mechanical, electrical, thermal, magnetic, optical, deteriorative. 2. Properties Identify candidate Material(s) Material: structure, composition. 3. Material Identify required Processing Processing: changes structure and overall shape ex: casting, sintering, vapor deposition, doping forming, joining, annealing. 8 University of Tennessee, Dept. of Materials Science and Engineering
  • 9. Introduction To Materials Science and Engineering, Ch. 1 Composition, Bonding, Crystal Structure and Microstructure DEFINE Materials Properties Composition Bonding Crystal Structure Thermomechanical Processing Microstructure Electrical & Thermal Mechanical Optical Magnetic Properties Properties Properties Properties 9 University of Tennessee, Dept. of Materials Science and Engineering
  • 10. Introduction To Materials Science and Engineering, Ch. 1 ELECTRICAL ? Electrical Resistivity of Copper: 6 i Adapted from Fig. 18.8, Callister 6e. a t%N (Fig. 18.8 adapted from: J.O. Linde, 5 3 .32 Ann Physik 5, 219 (1932); and + Resistivity, ¦Ñ C.A. Wert and R.M. Thomson, Cu %N i (10-8 Ohm-m) Physics of Solids, 2nd edition, at i 4 2 .16 a t% N McGraw-Hill Company, New York, u+ .12 1970.) C 1 3 C u+ ed d eform a t%N i 2 1.12 Cu+ u 1 r e¡± C ¡°Pu 0 -200 -100 0 T (¡ãC) ? Adding ¡°impurity¡± atoms to Cu increases resistivity. ? Deforming Cu increases resistivity. 10 University of Tennessee, Dept. of Materials Science and Engineering
  • 11. Introduction To Materials Science and Engineering, Ch. 1 MAGNETIC ? Magnetic Storage: ? Magnetic Permeability --Recording medium vs. Composition: is magnetized by --Adding 3 atomic % Si recording head. makes Fe a better recording medium! Magnetization Fe+3%Si Fe Magnetic Field Adapted from C.R. Barrett, W.D. Nix, and Fig. 20.18, Callister 6e. A.S. Tetelman, The Principles of (Fig. 20.18 is from J.U. Lemke, MRS Bulletin, Engineering Materials, Fig. 1-7(a), p. 9, Vol. XV, No. 3, p. 31, 1990.) 1973. Electronically reproduced by permission of Pearson Education, Inc., Upper Saddle River, New Jersey. 11 University of Tennessee, Dept. of Materials Science and Engineering
  • 12. Introduction To Materials Science and Engineering, Ch. 1 OPTICAL ? Transmittance: --Aluminum oxide may be transparent, translucent, or opaque depending on the material structure. polycrystal: polycrystal: single crystal low porosity high porosity Adapted from Fig. 1.2, Callister 6e. (Specimen preparation, P.A. Lessing; photo by J. Telford.) 12 University of Tennessee, Dept. of Materials Science and Engineering
  • 13. Introduction To Materials Science and Engineering, Ch. 1 DETERIORATIVE ? Stress & Saltwater... ? Heat treatment: slows --causes cracks! crack speed in salt water! crack speed (m/s) 10 -8 ¡°as-is¡± ¡°held at 160C for 1hr before testing¡± 10 -10 Alloy 7178 tested in saturated aqueous NaCl solution at 23C increasing load Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation and Fracture Mechanics of Engineering Materials" (4th ed.), p. 505, Adapted from Fig. 17.0, Callister 6e. John Wiley and Sons, 1996. (Original source: Markus O. (Fig. 17.0 is from Marine Corrosion, Causes, Speidel, Brown Boveri Co.) and Prevention, John Wiley and Sons, Inc., 4?m 1975.) --material: 7150-T651 Al "alloy" (Zn,Cu,Mg,Zr) Adapted from Fig. 11.24, Callister 6e. (Fig. 11.24 provided courtesy of G.H. Narayanan and A.G. Miller, Boeing Commercial Airplane Company.) 13 University of Tennessee, Dept. of Materials Science and Engineering
  • 14. Introduction To Materials Science and Engineering, Ch. 1 Types of Materials Metals: strong, ductile, tough, high density, conductors. Ceramics: strong, brittle, low density, insulators. Polymers: weak, ductile, low density, insulators. Semiconductors: weak, brittle, low density, semi-conductors. Composites: strong, ductile, low density, conductors, insulators. Crystals: atoms have long range periodic order (a). Glasses: atoms have short range order only (b). (a) (b) 14 University of Tennessee, Dept. of Materials Science and Engineering
  • 15. Introduction To Materials Science and Engineering, Ch. 1 Types of Materials Let us classify materials according to the way the atoms are bound together (Chapter 2). Metals: valence electrons are detached from atoms, and spread in an 'electron sea' that "glues" the ions together. Strong, ductile, conduct electricity and heat well, are shiny if polished. Semiconductors: the bonding is covalent (electrons are shared between atoms). Their electrical properties depend strongly on minute proportions of contaminants. Examples: Si, Ge, GaAs. Ceramics: atoms behave like either positive or negative ions, and are bound by Coulomb forces. They are usually combinations of metals or semiconductors with oxygen, nitrogen or carbon (oxides, nitrides, and carbides). Hard, brittle, insulators. Examples: glass, porcelain. Polymers: are bound by covalent forces and also by weak van der Waals forces, and usually based on C and H. They decompose at moderate temperatures (100 ¨C 400 C), and are lightweight. Examples: plastics rubber. 15 University of Tennessee, Dept. of Materials Science and Engineering
  • 16. Introduction To Materials Science and Engineering, Ch. 1 Metals Several uses of steel and pressed aluminum. 16 University of Tennessee, Dept. of Materials Science and Engineering
  • 17. Introduction To Materials Science and Engineering, Ch. 1 Ceramics Examples of ceramic materials ranging from household and lab products to high performance combustion engines which utilize both Metals and ceramics. 17 University of Tennessee, Dept. of Materials Science and Engineering
  • 18. Introduction To Materials Science and Engineering, Ch. 1 Ceramics Crystalline ceramics (a) and non-crystalline glasses (b) yield inherently different properties for applications. Open circles represent nonmetallic atoms, solids represent metal atoms. 18 University of Tennessee, Dept. of Materials Science and Engineering
  • 19. Introduction To Materials Science and Engineering, Ch. 1 Ceramics Examples of glasses. Depending on the material structure, the glass can be opaque, transparent, or translucent. Glasses can also be Processed to yield high thermal shock resistance. 19 University of Tennessee, Dept. of Materials Science and Engineering
  • 20. Introduction To Materials Science and Engineering, Ch. 1 Polymers Polymers or commercially called ¡°Plastics¡± need no intro. 20 University of Tennessee, Dept. of Materials Science and Engineering
  • 21. Introduction To Materials Science and Engineering, Ch. 1 Polymers Polymer composite materials, reinforcing glass fibers in a polymer matrix. 21 University of Tennessee, Dept. of Materials Science and Engineering
  • 22. Introduction To Materials Science and Engineering, Ch. 1 Semiconductors (a) (b) (a) Micro-Electrical-Mechanical Systems (MEMS), (b) Si wafer for computer chip devices. 22 University of Tennessee, Dept. of Materials Science and Engineering
  • 23. Introduction To Materials Science and Engineering, Ch. 1 23 University of Tennessee, Dept. of Materials Science and Engineering
  • 24. Introduction To Materials Science and Engineering, Ch. 1 Course Goals: SUMMARY ? Use the right material for the job. ? Understand the relation between properties, structure, and processing. ? Recognize new design opportunities offered by materials selection. 24 University of Tennessee, Dept. of Materials Science and Engineering