DYHW-110.pdf
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Column Sensor | Cantilever Beam Load Cell | S-type Tension Pressure Sensor | Capsule Sensor | Tension Sensor | Multi Dimensional Force Sensor | Micro Sensor | Spoke Pressure Sensor | Weighing Module | Static Torque Sensor | Dynamic Torque Sensor | Diffused Silicon Pressure Transmitter | Weighing Junction Box | Weighing Transducer
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The document describes a column sensor manufactured by DAYSENSOR that:
- Has high stability and can be installed in small spaces. It uses high quality alloy steel.
- Has applications in automobile compression, automatic assembly, 3C production testing, new energy product assembly, medical testing, and other industrial fields that require dynamic equipment testing.
- Provides technical specifications for the sensor's rated range, output sensitivity, zero point output, non-linearity, lag, repeatability, creep, temperature sensitivity drift, zero temperature drift, response frequency, material, impedance, insulation resistance, use voltage, operating temperature range, safety overload, extreme overload, cable specifications, and cable limit pull force.DYZ-102.pdf
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The document describes a membrane box sensor that features high stability, can be installed in small spaces, and can be customized. It has stable anti-interference signals, is made of quality stainless steel, and is widely used in automobile, 3C production, medical, and industrial testing applications. It provides technical specifications for the sensor's rated range, output sensitivity, non-linearity, repeatability, temperature sensitivity, response frequency, materials, and operating conditions.DYHX-002.pdf
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DYDW-001 Cantilever sensor two-dimensional force weighing bidirectional sensor 50kg 100kg 200kg 500kg 1tDYMH-107.pdf
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The document describes a membrane box sensor manufactured by DAYSENSOR. It has the following key features:
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Microelectromechanical Systems (MEMS) technology has revolutionized various industries, including automotive, healthcare, aerospace, and consumer electronics. MEMS devices integrate mechanical and electrical components at the microscale, enabling precise sensing, actuation, and control. The evolution of MEMS has been significantly influenced by advancements in materials, sensors, and actuators. This document provides a comprehensive analysis of the role of materials, sensors, and actuators in the development of MEMS technology.
1. Introduction to MEMS Technology
MEMS technology refers to miniaturized mechanical and electro-mechanical devices fabricated using microfabrication techniques. These systems typically include sensors, actuators, and electronic components integrated onto a single chip. The advancements in MEMS technology have been driven by the development of novel materials, improved fabrication techniques, and enhanced sensor-actuator performance.
Key Features of MEMS Technology:
Miniaturization of mechanical components
Integration of electronic circuits and mechanical systems
High precision and sensitivity
Low power consumption
Cost-effective mass production
2. Materials in MEMS Technology
The choice of materials plays a crucial role in determining the performance, reliability, and efficiency of MEMS devices. MEMS materials can be broadly classified into structural materials, functional materials, and packaging materials.
2.1 Structural Materials
Structural materials form the backbone of MEMS devices and are responsible for mechanical strength, stability, and durability.
(a) Silicon-Based Materials
Single-Crystal Silicon (Si): The most widely used material in MEMS due to its excellent mechanical properties, low cost, and compatibility with semiconductor fabrication.
Polycrystalline Silicon (Poly-Si): Commonly used for microstructures such as beams, membranes, and cantilevers.
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(b) Metal-Based Materials
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Gold (Au) and Platinum (Pt): Preferred for biomedical applications due to their biocompatibility.
Titanium (Ti): Provides high strength and corrosion resistance for specialized MEMS applications.
(c) Polymer-Based Materials
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SU-8: A high-aspect-ratio photoresist polymer used in microfluidics and lab-on-a-chip applications.
Polyimide: Provides good mechanical and thermal properties for flexible MEMS applications.
2.2 Functional Materials
Functional materials exhibit specific electrical, magnetic, thermal, or optical properties that enhance MEMS device performance.
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Etendue of microLED for AR wearable glassDYHW-110.pdf
- 1. DAYSENSOR DYHW-110 Micro-scale pressure sensor Features: ¡¤High stability ¡¤Can be installed in a small space ¡¤Can be non-standard customized ¡¤Anti-interference signals are stable ¡¤Quality stainless steel ¡¤It is widely used in 3C digital manufacturing detection process force measurement, power equipment, mechanical arm and other automation fields. ¼¼ÊõÖ¸±ê Rated quantitative schedule Kg 1-100 Output sensitivity mV/V 1.0-2.0 Zero point output %F.S. ¡À2 Non-linear %F.S. 0.5 lag %F.S. 0.5 Repeatability %F.S. 0.3 Creep (30 min) %F.S. 0.1 Temperature sensitivity drift %F.S./10¡æ 0.5 Zero temperature drift %F.S./10¡æ 0.5 Response frequency Hz 1k Material stainless steel impedance ¦¸ 350/500 Insulation resistance M¦¸/100V DC ¡Ý5000 Use voltage V 5-10 Operating temperature range ¡æ -20-80 Safety overload %R.C. 120 Extreme overload %R.C. 200 Cable line specifications m ¦µ2*1m Cable limit pull force N 98 TEDS selectable 1) High temperature sensors are available, with a maximum operating temperature of 150¡æ. 2) High impedance sensors can be provided with an output impedance of 1000 ¦¸. https://www.loadcells.store
- 2. DAYSENSOR Product Size Fig Unit: mm Range(kg) 5-10 20-30 50-100 ¦Õ 1.5 2 2.5 force diagram Center convex point force