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Review: FE Exam
 Text: Materials Science and Engineering:
An Introduction, 6th ed., William D.
Callister, Jr., Wiley, 2003.
Review: FE Exam
 Part 1  atomic structure & bonding
 What holds materials together?
 Part 2  Imperfections in solids
 How are they packed?
 Part 3  mechanical properties
 How do they deform?
Review: Chapter 1  Introduction
 Types of Materials
 Metals
 Polymers
 Ceramics
Review: Chapt 2-Atomic Structure
 Atomic Number, Atomic Weight, etc.
 Periodic table
 Electron Structure - valence electrons 
unfilled shells
 Bonding
 ionic
 covalent
 metallic
 van der Waals
Review: Chapt 3  Crystal
Structures
 Unit Cell
 Metals
 BCC
 FCC
 HCP
 Atomic packing factor
 Coordination number
 Crystallographic directions [uvw]
families of directions <uvw>
 Linear density of atoms (ld) = atoms/unit
length
Review: Chapt 3  Crystal
Structures (cont.)
 Miller indices of planes (hkl)
families of planes {hkl}
 Planar density (pd) = # of atoms/ unit area
(pd) = S.A. atoms/S.A. unit cell
 X-Ray Diffraction
 Braggs law



sin
2
n
dhk
Review: Chapter 4
 Imperfections
 Point defects
 Interstitial
 Vacancy
 Substitution
 Solid solutions
 Line defects
 Edge dislocation - Burgers vector perpendicular to
dislocation line
 Screw dislocation - Burgers vector parallel to
dislocation line
 Planar defects
 Twin
 Stacking fault
 Grain Boundary
Review: Chapter 4 (cont.)
 Microscopy
 Optical
 Electron Microscopy
 Sample Prep  polishing & etching
Review: Chapter 5
 Diffusion
 Vacancy diffusion
 Interstitial diffusion
 Ficks First Law
Second Law
 Temp effect
 Slab- non-steady state
dx
dC
D
J 

2
2
x
C
D
t
C













RT
Q
exp
D
D d
0










Dt
2
x
erf
1
C
C
C
C
0
s
0
x
Review: Chapter 19
 Thermal Properties
 Heat Capacity
 C = dQ/dT Cp > Cv
 phonons
 thermal expansion coefficient
 l/l = l T
 thermal conduction of heat
 q = -k (dT/dx)
 k = heat transfer coefficient
Review: Chapter 6
Mechanical Properties
 Stress vs. strain
 Hookes law s  E e
A
F
0

s
0
0


 

e
sy
TS
sF
E
Review: Chapter 6
 Poissons Ratio
 Toughness
 Resilience
 Hardness
z
x
z
y
e
e


e
e
Review  Chapter 7
Dislocations and Strengthening Mechanisms
 Deformation by motion of dislocations
 Slip plane  plane of easiest deformation
 Slip direction  direction of easiest slippage
 Slip system  direction and plane
 Applied stress must be resolved along slip direction
  = s cos cos
 Twinning
 Mechanism of strengthening
 Grain size reduction
 Solid-solution hardening
 impurities reduce mobility of dislocations
 Strain hardening %CW = 100 x (A0-Af)/A0
 Recovery, recrystallization, & grain growth
Review  Chapter 8
Fracture  failure
 Ductile fracture
 Large deformations
 cone & cup
 small necked regions
 Brittle fracture
 Almost no deformation other than failure
 transgranular  within grain
 intergranular- between grains
Review, Chapter 8 (cont.)
 Griffith Crack - Stress concentration
 Critical stress
 Fatigue  cyclic stress
 Creep
2
1
s
c
a
E
2









s
0
t
m K s

s
Review- Chapter 9
Phase Diagrams
 Isomorphous system
 1. How many &
which phases
 2. Use tie line to
read compositions
 3. Use lever rule
to get weight
fractions
Review- Chapter 9
 binary eutectic system
 1. How many & which phases
 2. Use tie line to read compositions
 3. Use lever rule to get weight fractions
Review- Chapter 9 (cont.)
 Eutectic L S1+S2
 Eutectoid S1 S2+S3
 Peritectic S1+L S2
 Hypoeutectoid
 Hypereutectoid
cool
heat
cool
heat
cool
heat
Review - Chapter 10
Rate of Phase Transformation
 Nucleation process
Review - Chapter 10 (cont)
 Phase transformations vs. temperature
and time
 Pearlite
 Martensite
 Bainite
 Spheroidite
Chapter 11
 Heat Treatments
Review  Chapter 11
Fabrication of Metals
 Forming
 Forging
 Rolling
 Extrusion
 Drawing
 Casting
 Powder metallurgy
 Welding
 Machining
 Alloy Nomenclature
 Cast Irons  addition of Si catalyzes graphite
formation
 Refractories
Review  Chapter 12
Ceramics
 Crystal structures
 oxygen larger  generally in FCC lattice
 cations go in lattice sites based on
 size
 stoichiometry
 charge balance
 bond hybridization
 no good slip planes  brittle failure
 Silicates
 built up of SiO4
4-
 layered
 countercations to neutralize charge
Chapter 12  Ceramics
 Carbon forms
 diamond
 graphite
 fullerenes
 amorphous
 Lattice imperfections
 Frenkel defect  cation displaced into
interstitial site
 Schottky defect  missing cation/anion pair
 Phase diagrams
 Mechanical properties
Chapter 13  Ceramics (cont)
 Glasses
 amorphous sodium or borosilicates
 Forming
 pressing
 drawing
 blowing
 Clay products - forming
 Hydroplastic forming
 Slip casting
 Refractories
 Powder pressing
 Cements
 Advanced ceramics
Chapter 14  Polymers
 Types of polymers
 Commodity plastics
 PE = Polyethylene
 PS = Polystyrene
 PP = Polypropylene
 PVC = Poly(vinyl chloride)
 PET = Poly(ethylene terephthalate)
 Specialty or Engineering Plastics
 Teflon (PTFE) = Poly(tetrafluoroethylene)
 PC = Polycarbonate (Lexan)
 Polysulfones
 Polyesters and Polyamides (Nylon)
Chapter 14  Polymers
 Molecular Weight
 Actually a molecular weight distribution
 Mn = Number-averaged molecular weight
 Mw = Weight-averaged molecular weight
 Polydispersity = Mw/Mn
 A measure of the width of the distribution
 Chain Shapes
 linear
 branched
 crosslinked
 network
Chapter 14 & 15  Polymers
 Isomerism
 Isotactic
 Syndiotactic
 Atactic
 Cis vs. Trans
 Copolymers
 Random
 Alternating
 Block
 Crystallinity
 Spherulites
Chapter 16  Composites
 Combine materials with objective of getting a
more desirable combination of properties
 Dispersed phase
 Matrix
 Particle reinforced
 large particle
 dispersion strengthened
 Rule of mixtures
 Upper limit Ec(u) = EmVm + EpVp
 Lower limit  
E
V
E
V
E
E
E
m
p
p
m
p
m
c
Chapter 16  Composites
 Reinforced concrete
 Prestressed concrete
 Fiber reinforced
 Short vs. long fibers
 Critical length
 allignment
c
f
c
2
d

s
Chapter 18  Electrical Properties
Definitions
 R = resistance = Ohms
  = RA/l = resistivity = ohm meter
 s = 1/ = conductivity
 C = Q/V = capacitance
 er = e/eo = dielectric constant
Chapter 18  Electrical Properties
 Energy Bands  valance vs. conduction
 Conductor  no band gap
 Insulator  wide gap
 Semiconductor  narrow gap
 Intrinsic  pure or compound
 Electron vs. hole (which carries charge)
 Extrinsic (doped)
 n-type  donor levels  extra electrons
 p-type  acceptor levels  extra holes
 Microelectronics
 pn junction  rectifier diode
 npn transistor
Chapter 20  Superconductivity
 Tc = temperature below which
superconducting
= critical temperature
Jc = critical current density if J > Jc not
superconducting
Hc = critical magnetic field if H > Hc not
superconducting
 Meissner Effect - Superconductors expel
magnetic fields
Chapter 21  Optical Properties
 Electromagnetic radiation
 Angle of refraction at interface





hc
h
E
)
medium
in
light
of
velocity
(
v
)
vacuum
in
light
of
velocity
(
c
index
refractive
n 




 sin
sin
n
n
Chapter 21  Optical Properties
 Light interaction with solids
 Reflection
 Absorption
 Scattering
 Transmission
 Semiconductors  absorb light with energy
greater than band gap
 Luminescence  emission of light by a material
 phosphorescence = If very stable (long-lived = >10-8 s)
 fluorescence = If less stable (<10-8 s)
 LASERS  coherent light
 Fiber optics
ty
reflectivi
2
n
1
n
R
2










t
I
I
ln
0
Questions???
 Contact Prof. David Rethwisch to discuss
questions.
 office 4139 SC
 Phone 335-1413
 email david-rethwisch@uiowa.edu

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FE_review.ppt

  • 1. Review: FE Exam Text: Materials Science and Engineering: An Introduction, 6th ed., William D. Callister, Jr., Wiley, 2003.
  • 2. Review: FE Exam Part 1 atomic structure & bonding What holds materials together? Part 2 Imperfections in solids How are they packed? Part 3 mechanical properties How do they deform?
  • 3. Review: Chapter 1 Introduction Types of Materials Metals Polymers Ceramics
  • 4. Review: Chapt 2-Atomic Structure Atomic Number, Atomic Weight, etc. Periodic table Electron Structure - valence electrons unfilled shells Bonding ionic covalent metallic van der Waals
  • 5. Review: Chapt 3 Crystal Structures Unit Cell Metals BCC FCC HCP Atomic packing factor Coordination number Crystallographic directions [uvw] families of directions <uvw> Linear density of atoms (ld) = atoms/unit length
  • 6. Review: Chapt 3 Crystal Structures (cont.) Miller indices of planes (hkl) families of planes {hkl} Planar density (pd) = # of atoms/ unit area (pd) = S.A. atoms/S.A. unit cell X-Ray Diffraction Braggs law sin 2 n dhk
  • 7. Review: Chapter 4 Imperfections Point defects Interstitial Vacancy Substitution Solid solutions Line defects Edge dislocation - Burgers vector perpendicular to dislocation line Screw dislocation - Burgers vector parallel to dislocation line Planar defects Twin Stacking fault Grain Boundary
  • 8. Review: Chapter 4 (cont.) Microscopy Optical Electron Microscopy Sample Prep polishing & etching
  • 9. Review: Chapter 5 Diffusion Vacancy diffusion Interstitial diffusion Ficks First Law Second Law Temp effect Slab- non-steady state dx dC D J 2 2 x C D t C RT Q exp D D d 0 Dt 2 x erf 1 C C C C 0 s 0 x
  • 10. Review: Chapter 19 Thermal Properties Heat Capacity C = dQ/dT Cp > Cv phonons thermal expansion coefficient l/l = l T thermal conduction of heat q = -k (dT/dx) k = heat transfer coefficient
  • 11. Review: Chapter 6 Mechanical Properties Stress vs. strain Hookes law s E e A F 0 s 0 0 e sy TS sF E
  • 12. Review: Chapter 6 Poissons Ratio Toughness Resilience Hardness z x z y e e e e
  • 13. Review Chapter 7 Dislocations and Strengthening Mechanisms Deformation by motion of dislocations Slip plane plane of easiest deformation Slip direction direction of easiest slippage Slip system direction and plane Applied stress must be resolved along slip direction = s cos cos Twinning Mechanism of strengthening Grain size reduction Solid-solution hardening impurities reduce mobility of dislocations Strain hardening %CW = 100 x (A0-Af)/A0 Recovery, recrystallization, & grain growth
  • 14. Review Chapter 8 Fracture failure Ductile fracture Large deformations cone & cup small necked regions Brittle fracture Almost no deformation other than failure transgranular within grain intergranular- between grains
  • 15. Review, Chapter 8 (cont.) Griffith Crack - Stress concentration Critical stress Fatigue cyclic stress Creep 2 1 s c a E 2 s 0 t m K s s
  • 16. Review- Chapter 9 Phase Diagrams Isomorphous system 1. How many & which phases 2. Use tie line to read compositions 3. Use lever rule to get weight fractions
  • 17. Review- Chapter 9 binary eutectic system 1. How many & which phases 2. Use tie line to read compositions 3. Use lever rule to get weight fractions
  • 18. Review- Chapter 9 (cont.) Eutectic L S1+S2 Eutectoid S1 S2+S3 Peritectic S1+L S2 Hypoeutectoid Hypereutectoid cool heat cool heat cool heat
  • 19. Review - Chapter 10 Rate of Phase Transformation Nucleation process
  • 20. Review - Chapter 10 (cont) Phase transformations vs. temperature and time Pearlite Martensite Bainite Spheroidite Chapter 11 Heat Treatments
  • 21. Review Chapter 11 Fabrication of Metals Forming Forging Rolling Extrusion Drawing Casting Powder metallurgy Welding Machining Alloy Nomenclature Cast Irons addition of Si catalyzes graphite formation Refractories
  • 22. Review Chapter 12 Ceramics Crystal structures oxygen larger generally in FCC lattice cations go in lattice sites based on size stoichiometry charge balance bond hybridization no good slip planes brittle failure Silicates built up of SiO4 4- layered countercations to neutralize charge
  • 23. Chapter 12 Ceramics Carbon forms diamond graphite fullerenes amorphous Lattice imperfections Frenkel defect cation displaced into interstitial site Schottky defect missing cation/anion pair Phase diagrams Mechanical properties
  • 24. Chapter 13 Ceramics (cont) Glasses amorphous sodium or borosilicates Forming pressing drawing blowing Clay products - forming Hydroplastic forming Slip casting Refractories Powder pressing Cements Advanced ceramics
  • 25. Chapter 14 Polymers Types of polymers Commodity plastics PE = Polyethylene PS = Polystyrene PP = Polypropylene PVC = Poly(vinyl chloride) PET = Poly(ethylene terephthalate) Specialty or Engineering Plastics Teflon (PTFE) = Poly(tetrafluoroethylene) PC = Polycarbonate (Lexan) Polysulfones Polyesters and Polyamides (Nylon)
  • 26. Chapter 14 Polymers Molecular Weight Actually a molecular weight distribution Mn = Number-averaged molecular weight Mw = Weight-averaged molecular weight Polydispersity = Mw/Mn A measure of the width of the distribution Chain Shapes linear branched crosslinked network
  • 27. Chapter 14 & 15 Polymers Isomerism Isotactic Syndiotactic Atactic Cis vs. Trans Copolymers Random Alternating Block Crystallinity Spherulites
  • 28. Chapter 16 Composites Combine materials with objective of getting a more desirable combination of properties Dispersed phase Matrix Particle reinforced large particle dispersion strengthened Rule of mixtures Upper limit Ec(u) = EmVm + EpVp Lower limit E V E V E E E m p p m p m c
  • 29. Chapter 16 Composites Reinforced concrete Prestressed concrete Fiber reinforced Short vs. long fibers Critical length allignment c f c 2 d s
  • 30. Chapter 18 Electrical Properties Definitions R = resistance = Ohms = RA/l = resistivity = ohm meter s = 1/ = conductivity C = Q/V = capacitance er = e/eo = dielectric constant
  • 31. Chapter 18 Electrical Properties Energy Bands valance vs. conduction Conductor no band gap Insulator wide gap Semiconductor narrow gap Intrinsic pure or compound Electron vs. hole (which carries charge) Extrinsic (doped) n-type donor levels extra electrons p-type acceptor levels extra holes Microelectronics pn junction rectifier diode npn transistor
  • 32. Chapter 20 Superconductivity Tc = temperature below which superconducting = critical temperature Jc = critical current density if J > Jc not superconducting Hc = critical magnetic field if H > Hc not superconducting Meissner Effect - Superconductors expel magnetic fields
  • 33. Chapter 21 Optical Properties Electromagnetic radiation Angle of refraction at interface hc h E ) medium in light of velocity ( v ) vacuum in light of velocity ( c index refractive n sin sin n n
  • 34. Chapter 21 Optical Properties Light interaction with solids Reflection Absorption Scattering Transmission Semiconductors absorb light with energy greater than band gap Luminescence emission of light by a material phosphorescence = If very stable (long-lived = >10-8 s) fluorescence = If less stable (<10-8 s) LASERS coherent light Fiber optics ty reflectivi 2 n 1 n R 2 t I I ln 0
  • 35. Questions??? Contact Prof. David Rethwisch to discuss questions. office 4139 SC Phone 335-1413 email david-rethwisch@uiowa.edu