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Recipe For Copper Decapsulation

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This document provides a recipe for removing copper caps from packages using the RKD Elite Etch tool. The recipe calls for mixing 90% fuming nitric acid with 20% fuming sulfuric acid in a 3:1 ratio and etching at 35 degrees Celsius for 120 seconds, then rinsing with acetone. It also provides a variation for etching wires 1 mil or larger at 25 degrees Celsius. Post-etch cleaning involves rinsing, ultrasonic cleaning, and drying with nitrogen.

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Recipe for Copper Decapsulation Using RKD Elite Etch Acid Type: Temperature Volume Heat-up Etch time Rinse time (Celsius): (ml/min): time (sec): (sec): (sec): Mixed 3:1 Varies with 35属 5 120 0 Pulse Mode package size 90% Fuming Nitric See Cookbook 20% Fuming Sulfuric Post Etch Rinse: Spray with Acetone. Post Cleaning varies with device. UltraSonic with Acetone. or D.I. or IPA. NMP seems to attack the wires. ( Again this is device specific. ) Dry with N2 Note: This works excellent for Cu wire of 2 mil or larger on the Elite Etch. Acid Type: Temperature Volume Heat-up Etch time Rinse time (Celsius): (ml/min): time (sec): (sec): (sec): Mixed 3:1 Varies with 25属 5 120 0 Pulse Mode package size 90% Fuming Nitric See Cookbook 20% Fuming Sulfuric Note: This recipe works with wires 1 mil. ( These recipes only work with the RKD Elite Etch. ( The Nisene systems are unable to achieve the desired results due to pump technologies, mixture control, and temperature characteristics. ) Ambient room temperature is also a factor. The ambient room temperature must be at least 3 degrees colder than the etch temperature for this process to work. Post Etch Rinse: Spray with Acetone. Post Cleaning varies with device. UltraSonic with Acetone. or D.I. or IPA. NMP seems to attack the wires. ( Again this is device specific. )

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Recipe For Copper Decapsulation

  • 1. Recipe for Copper Decapsulation Using RKD Elite Etch Acid Type: Temperature Volume Heat-up Etch time Rinse time (Celsius): (ml/min): time (sec): (sec): (sec): Mixed 3:1 Varies with 35属 5 120 0 Pulse Mode package size 90% Fuming Nitric See Cookbook 20% Fuming Sulfuric Post Etch Rinse: Spray with Acetone. Post Cleaning varies with device. UltraSonic with Acetone. or D.I. or IPA. NMP seems to attack the wires. ( Again this is device specific. ) Dry with N2 Note: This works excellent for Cu wire of 2 mil or larger on the Elite Etch. Acid Type: Temperature Volume Heat-up Etch time Rinse time (Celsius): (ml/min): time (sec): (sec): (sec): Mixed 3:1 Varies with 25属 5 120 0 Pulse Mode package size 90% Fuming Nitric See Cookbook 20% Fuming Sulfuric Note: This recipe works with wires 1 mil. ( These recipes only work with the RKD Elite Etch. ( The Nisene systems are unable to achieve the desired results due to pump technologies, mixture control, and temperature characteristics. ) Ambient room temperature is also a factor. The ambient room temperature must be at least 3 degrees colder than the etch temperature for this process to work. Post Etch Rinse: Spray with Acetone. Post Cleaning varies with device. UltraSonic with Acetone. or D.I. or IPA. NMP seems to attack the wires. ( Again this is device specific. )