Sales and business development of networking and storage semiconductors (ASIC, ASSP, CSSP), card level products and related software to Tier 1 and Tier 2 telecom and enterprise networking equipment manufacturers and service providers in the wireless, wireline and data center markets. Influenced all levels from executives to line managers, both internally and at customers, across major functions (including R&D/Engineering/Architecture, Product Management, Sourcing/Supply Chain/Operations, Finance and Legal), to achieve design win targets. Acted as both the Global Account Manager for named Tier 2 customers (direct and channel/distribution) and as member of several Tier 1 Global Account Teams.