A project manager and package development expert for semiconductor backend packaging and electronics manufacturing with more than 15 years of experience around ASEAN region.
Expertise: project management, thermosonic wirebonding, ultrasonic wirebonding, soft solder die attach, surface mount technology, lead-free solders.
An all-rounder, started in preventive maintenance and equipment engineering to process engineering then process development and project management. I lead projects, solve problems and an expert of control and documentation.