The document is a resume for Tsungchan Tsai that highlights his relevant experience, education, skills, and accomplishments. It summarizes that he has over 10 years of experience in plasma technology development, thin film fabrication, and software engineering. He received his Ph.D. in Mechanical Engineering from Texas A&M University and has worked in both industrial and academic research settings, leading multiple projects and publishing several papers.
This document summarizes research on using magneto-optic imaging for non-destructive testing of metal structures. It describes developing new thin-film sensors with improved sensitivity, integrating the sensors and image recognition algorithms into a portable system, and applying a neural network algorithm called SONON to enhance defect detection in images. Laboratory experiments demonstrated the new sensors could detect smaller defects than previous methods. The overall aim is more accurate, automated inspections using portable, wearable equipment.
This document discusses a novel magneto-optic sensor called the MODE sensor that can be used for non-destructive testing of structural integrity. The MODE sensor uses thin films made of rare earth and transition metal oxides that have high magneto-optic properties, allowing it to detect cracks, fissures, and corrosion in structures. A portable system has been designed using this sensor to allow real-time inspection of bridges, fuel tanks, and other metal structures. The system includes image processing and pattern recognition capabilities to help identify defects.
The Namur Nanosafety Centre at the University of Namur provides physicochemical characterization, toxicity assessment, and training services for nanomaterials. Their areas of expertise include nanomaterial characterization, studies of nanomaterial fate and biodistribution, in vitro and in vivo toxicity testing following OECD guidelines, and regulation. They have equipment for characterization, toxicity assessment, and have conducted projects in quality control of nanomaterials, hazard identification, and regulatory testing. They offer customized services and training to companies to support safe development and use of nanomaterials.
Yuan-Wei Chang has worked as a technical consultant since 2014 utilizing accelerated aging tests, finite element analysis, and CAD software to analyze reliability and failure of implants, composites, and powders. He has also worked as a research associate at UCLA from 2010-2015 developing high strength alloys and additive manufacturing projects. Additionally, he has reviewed journal papers for Materials Letters since 2014 and taught materials science as a teaching assistant from 2011-2015 at UCLA. He holds a PhD in Materials Science and Engineering from UCLA and has published several papers in materials journals.
Dr. John L. Hodgkinson has expertise in thin film characterization and coating technologies, especially CVD techniques and plasma-driven processes, which are applicable to many industries. This includes glass manufacturing, solar, electronics, optics, nanomaterials, aerospace, automotive, biomaterials, composites, textiles, analytical equipment, and surface modification. He also has experience in chemical engineering, having designed CVD coating systems and laboratory-scale process demonstrators. His background provides relevant experience in additional areas like emulsions, formulated products, chemical synthesis, engine management, power transmission systems, and test equipment.
Electro-physiological characterisation of cells for healthcare applicationsajayhakkumar
油
This document summarizes Dr. Soumen Das' talk on electro-physiological characterization of cells for healthcare applications. The talk discusses how micro- and nanotechnologies are enabling the manipulation and analysis of biological systems at the cellular scale. This includes techniques such as soft lithography, microfluidics, and dielectrophoresis that allow label-free separation and analysis of cells. The scaling effects between microscale devices and biology enables more sensitive detection. These techniques have applications in personalized healthcare such as cancer detection by analyzing changes in non-biological properties of cells.
The document discusses several topics related to materials science and engineering including alloy development, coating deposition, tribological assessment, electron microscopy characterization of materials, processing and characterization of photonic glasses, biomaterials development, and bioactive and catalytic surface studies. It also notes that the aerospace industry is a major employer for metallurgical engineers due to the extreme operating environments. Finally, it states that aluminum manufacturing plays a role in many everyday products from light posts to electronics.
Application of non destructive test for structural health monitoring - state ...eSAT Journals
油
Abstract
The concept of non-destructive testing (NDT) is to obtain material properties in place specimens without the destruction of the specimens and to do the structural health monitoring. NDT using Rebound hammer, Ultra pulse velocity, Half-cell potential, core cutter, carbonation depth, rebar locator, Rapid chloride penetration test, electric resistivity meter test and vibration base analysis by data analoger are very popular and highly effective in conducting structural health monitoring. The structure can be investigated by using a visual inspection, NDT, laboratory and field test performance. In this article a review of these tests have been provided to conduct effective structural health monitoring of a RCC structure
Keywords: Non-destructive test, visual inspection, corrosion, compressive strength
First and foremost place for metallurgical engineering jobs is the aerospace industry. This is a field where modern day materials scientists and engineers are always sought after. Because of the extreme environments of operation, materials and metallurgical engineers can always find jobs in the aerospace and defense industry.
For more info to click here: http://www.secat.net/blog/199/Secat_-_The_Beginning_of_Something_BIG!.html
Monitoring of concrete structures by electro mechanical impedance technique IEI GSC
油
By Dr. S.N.Khante Associate Professor & Bhagyashri Sangai
at 31st National Convention of Civil Engineers
organised by
Gujarat State Center, The Institution of Engineers (India) at Ahmedabad
Nanotechnology involves manipulating and controlling materials at the nanoscale, which is approximately 1 to 100 nanometers. It has applications in many areas such as electronics, energy, medicine, and water filtration. Some key benefits of nanotechnology include developing stronger and lighter materials, more effective cancer treatments, and improved solar cells and membranes for water filtration that remove particles down to a few nanometers in size. The future of nanotechnology involves further development of self-assembly techniques to build complex structures at the nanoscale.
The document provides an overview of the state of nanotechnology, including major accomplishments and tools/techniques. In the past 15-20 years, measurements and imaging have improved to picometer precision (1), modeling can successfully simulate molecular interactions (2), and some nanostructure fabrication processes exist (3). A variety of microscopy, metrology, simulation and synthesis tools form the foundation for nanotechnology research. Recent progress includes new microscopy arrays, molecular modeling software, nanomaterials, electronics, and biochip applications. Grand challenges include developing stronger lightweight materials and improving computer and solar cell efficiency.
This document provides information on nanotechnology and methods for characterizing nanomaterials. It begins with definitions of nanotechnology and a nanometer. It then discusses the history and development of nanotechnology, including Richard Feynman's seminal talk in 1959. The document covers various synthesis methods for nanomaterials, including top-down and bottom-up approaches, and specific techniques like ball milling, physical vapor deposition, sol-gel processing, and others. Finally, it summarizes common characterization techniques for analyzing nanomaterials, such as SEM, TEM, XRD, FT-IR spectroscopy, and their basic principles and applications.
This document provides an overview of various nanoscale imaging tools, including optical microscopes, electron microscopes like transmission electron microscopes and scanning electron microscopes, and scanning probe microscopes like scanning tunneling microscopes and atomic force microscopes. It describes key parameters, components, imaging modes and examples of images produced by these different microscopic techniques.
1. Le Van Hai is a postdoc researcher in Japan with experience in materials science, semiconductor processing, and device fabrication.
2. He has experience fabricating some of the world's smallest Fe-FET transistors and the first 64 kb Fe-NAND flash memory array.
3. He holds a PhD in applied physics from Osaka University where he worked on improving ferroelectric memory properties through surface treatments and developing a tunable photonic crystal filter using PLZT thin films.
This document provides a summary of Abdel-Aleam H Mohamed's qualifications including his education, experience, skills, honors and projects. It outlines his PhD in plasma physics from Old Dominion University and over 10 years experience teaching physics courses. It also details his experience in plasma physics research and developing cold plasma systems, as well as several research projects and patents in this area.
Akhil Ravi Kumar is seeking a position in electrical engineering. He received his Master's degree in electrical engineering from Texas A&M University and his Bachelor's degree from the University of Pune in India. He has work experience as a process engineer at Intel and research experience developing microfabrication techniques and sensors. His skills include microfabrication processes, characterization tools, programming languages, and CAD tools for circuit design.
Eric M. Rehder has over 20 years of experience in materials science, semiconductor device fabrication and characterization. He is currently a Senior Staff Engineer at Spectrolab Inc., where he pursues government funded development programs and identifies innovative manufacturing processes. Previously he held several engineering roles developing solar cells, RF devices, and managing production programs. He has a Ph.D. in Materials Science from University of Wisconsin-Madison and numerous patents and publications in the field.
Computational Nano Technology and Simulation Techniques Applied to Study Silv...IRJET Journal
油
This document discusses computational nanotechnology methods for simulating silver nano dots. It describes three types of nanotechnologies: wet, dry, and computational. Computational nanotechnology uses computer algorithms and simulations to model nanostructures and devices. The document focuses on using software tools like Quantum Dot Lab and molecular dynamics simulations to model the structure, properties, and dynamics of silver quantum dots at the nanoscale. These computational methods allow for faster, more accurate analysis compared to experimental techniques alone. The simulations provide insights into the charged states, light emission, and movement of atoms in silver nano dots over time.
The document discusses several advanced materials processing techniques including powder processing, sol-gel processing, thermal oxidation, sputtering, pulsed laser deposition, and chemical vapor deposition. It also discusses applications of these techniques such as coating ceramic outer air seals on gas turbine blades and depositing optical fibers. MEMS applications are explored including uses in biotechnology, chemical detection, adaptive optics, and miniature sensors and actuators.
Mark Curtis has over 30 years of experience in medical device manufacturing, including positions at several major companies such as Medtronic, Guidant, and Sulzermedica. He has expertise in areas such as process validation, statistical process control, design of experiments, and FDA compliance. Curtis has managed both high-volume plastic consumables lines and lower-volume implantable device manufacturing. He holds an MS in mechanical engineering and has completed numerous process validations across various manufacturing technologies.
The document discusses several topics related to semiconductor manufacturing processes and design for manufacturability (DFM). It summarizes resolution enhancement techniques used in lithography like RET and OPC. It also discusses DFM techniques like process characterization of IP libraries using yield models, addressing systematic and random yield loss mechanisms, and the need for proactive DFM using accurate process models early in the design flow. Finally, it briefly mentions the use of automated test equipment for testing chips after manufacturing.
In recent years, key developments have taken place in computer- aided design, casting design, simulation, rapid tooling, intelligent advisory systems and Internet based engineering and most foundries are presently caught between change and survival. This is especially true in case of the foundries operating in the developing countries
Clayson C. Spackman has extensive experience in 3D printing soft composites and fiber networks. He received his PhD in Mechanical Engineering from Rensselaer Polytechnic Institute where he developed a 3D printing technology for soft composites using inkjet printing and electrospun fibers. His research focused on investigating material failure mechanisms and developing innovative testing protocols. He has published several peer-reviewed articles and led multiple research projects funded by the NSF and DoD involving 3D printing composites, modeling fiber interactions, and developing educational lab modules.
PolyMEMS INAOE, a Surface Micromachining Fabrication Module and the Developm...Jos辿 Andr辿s Alan鱈s Navarro
油
The PolyMEMS INAOE module for surface micromachining has been developed for the fabrication of electrostatic and electrothermal (Joule effect) sensors and actuators. In this module the designer can choose up to 3 Poly silicon layers and aluminum as electrical interconnecting material. A
micromechanical test chip has been fabricated which includes the following. a) Micro test structures for residual stress measurement; cantilever beams, clamped-clamped beams, ring-and-beam structures, diamond-and-beam structures, rotation beams, Vernier gauges, cantilever spirals, double-clamped microgauge, and b) Actuators; torsion and bending mirrors, resonators, single two-arms Joule structures (STA), chevron-like Joule arrays, capacitive array for accelerometers. In this work we are presenting the measured residual stress on our process, by using the clamped-clamped beam and ring-and-beam arrays. The measured compressive stress is in the 21-26 MPa range for both types of microgauges. A maximum typical value for this tensile stress is 50 MPa, which is higher than that obtained in our experimental procedure. From this residual stress measurement technique and other mechanical testing routines we can conclude the following: the thermal load, the polysilicon microstructure, and the releasing technique; all of them result in a reliable process for the fabrication of dynamic and static polysilicon microstructures.
This document is a resume for Kyounkwon Park. It summarizes his education, including a Ph.D. in Electrical Engineering from UCLA in 2014, as well as his technical skills and work experience. Park currently works as a Senior Engineer at Samsung Display Co. designing nanocrystal-based display panels. He has also conducted research at UCLA on topics including quantum dot synthesis and characterization, optical voltage sensing using semiconductor nanoparticles, and nanoscale integrated circuits.
The document summarizes the activities of the Polymer Physics, Elastomers and Energy Department at ICTP. The department focuses on developing new elastomeric materials and conducting polymers for energy applications. It has two main research groups: the Elastomers Group, which studies elastomer structure-property relationships and new elastomers; and the Energy Applications Group, which develops electrodes and electrolytes for batteries, supercapacitors, and fuel cells.
The document discusses several topics related to materials science and engineering including alloy development, coating deposition, tribological assessment, electron microscopy characterization of materials, processing and characterization of photonic glasses, biomaterials development, and bioactive and catalytic surface studies. It also notes that the aerospace industry is a major employer for metallurgical engineers due to the extreme operating environments. Finally, it states that aluminum manufacturing plays a role in many everyday products from light posts to electronics.
Application of non destructive test for structural health monitoring - state ...eSAT Journals
油
Abstract
The concept of non-destructive testing (NDT) is to obtain material properties in place specimens without the destruction of the specimens and to do the structural health monitoring. NDT using Rebound hammer, Ultra pulse velocity, Half-cell potential, core cutter, carbonation depth, rebar locator, Rapid chloride penetration test, electric resistivity meter test and vibration base analysis by data analoger are very popular and highly effective in conducting structural health monitoring. The structure can be investigated by using a visual inspection, NDT, laboratory and field test performance. In this article a review of these tests have been provided to conduct effective structural health monitoring of a RCC structure
Keywords: Non-destructive test, visual inspection, corrosion, compressive strength
First and foremost place for metallurgical engineering jobs is the aerospace industry. This is a field where modern day materials scientists and engineers are always sought after. Because of the extreme environments of operation, materials and metallurgical engineers can always find jobs in the aerospace and defense industry.
For more info to click here: http://www.secat.net/blog/199/Secat_-_The_Beginning_of_Something_BIG!.html
Monitoring of concrete structures by electro mechanical impedance technique IEI GSC
油
By Dr. S.N.Khante Associate Professor & Bhagyashri Sangai
at 31st National Convention of Civil Engineers
organised by
Gujarat State Center, The Institution of Engineers (India) at Ahmedabad
Nanotechnology involves manipulating and controlling materials at the nanoscale, which is approximately 1 to 100 nanometers. It has applications in many areas such as electronics, energy, medicine, and water filtration. Some key benefits of nanotechnology include developing stronger and lighter materials, more effective cancer treatments, and improved solar cells and membranes for water filtration that remove particles down to a few nanometers in size. The future of nanotechnology involves further development of self-assembly techniques to build complex structures at the nanoscale.
The document provides an overview of the state of nanotechnology, including major accomplishments and tools/techniques. In the past 15-20 years, measurements and imaging have improved to picometer precision (1), modeling can successfully simulate molecular interactions (2), and some nanostructure fabrication processes exist (3). A variety of microscopy, metrology, simulation and synthesis tools form the foundation for nanotechnology research. Recent progress includes new microscopy arrays, molecular modeling software, nanomaterials, electronics, and biochip applications. Grand challenges include developing stronger lightweight materials and improving computer and solar cell efficiency.
This document provides information on nanotechnology and methods for characterizing nanomaterials. It begins with definitions of nanotechnology and a nanometer. It then discusses the history and development of nanotechnology, including Richard Feynman's seminal talk in 1959. The document covers various synthesis methods for nanomaterials, including top-down and bottom-up approaches, and specific techniques like ball milling, physical vapor deposition, sol-gel processing, and others. Finally, it summarizes common characterization techniques for analyzing nanomaterials, such as SEM, TEM, XRD, FT-IR spectroscopy, and their basic principles and applications.
This document provides an overview of various nanoscale imaging tools, including optical microscopes, electron microscopes like transmission electron microscopes and scanning electron microscopes, and scanning probe microscopes like scanning tunneling microscopes and atomic force microscopes. It describes key parameters, components, imaging modes and examples of images produced by these different microscopic techniques.
1. Le Van Hai is a postdoc researcher in Japan with experience in materials science, semiconductor processing, and device fabrication.
2. He has experience fabricating some of the world's smallest Fe-FET transistors and the first 64 kb Fe-NAND flash memory array.
3. He holds a PhD in applied physics from Osaka University where he worked on improving ferroelectric memory properties through surface treatments and developing a tunable photonic crystal filter using PLZT thin films.
This document provides a summary of Abdel-Aleam H Mohamed's qualifications including his education, experience, skills, honors and projects. It outlines his PhD in plasma physics from Old Dominion University and over 10 years experience teaching physics courses. It also details his experience in plasma physics research and developing cold plasma systems, as well as several research projects and patents in this area.
Akhil Ravi Kumar is seeking a position in electrical engineering. He received his Master's degree in electrical engineering from Texas A&M University and his Bachelor's degree from the University of Pune in India. He has work experience as a process engineer at Intel and research experience developing microfabrication techniques and sensors. His skills include microfabrication processes, characterization tools, programming languages, and CAD tools for circuit design.
Eric M. Rehder has over 20 years of experience in materials science, semiconductor device fabrication and characterization. He is currently a Senior Staff Engineer at Spectrolab Inc., where he pursues government funded development programs and identifies innovative manufacturing processes. Previously he held several engineering roles developing solar cells, RF devices, and managing production programs. He has a Ph.D. in Materials Science from University of Wisconsin-Madison and numerous patents and publications in the field.
Computational Nano Technology and Simulation Techniques Applied to Study Silv...IRJET Journal
油
This document discusses computational nanotechnology methods for simulating silver nano dots. It describes three types of nanotechnologies: wet, dry, and computational. Computational nanotechnology uses computer algorithms and simulations to model nanostructures and devices. The document focuses on using software tools like Quantum Dot Lab and molecular dynamics simulations to model the structure, properties, and dynamics of silver quantum dots at the nanoscale. These computational methods allow for faster, more accurate analysis compared to experimental techniques alone. The simulations provide insights into the charged states, light emission, and movement of atoms in silver nano dots over time.
The document discusses several advanced materials processing techniques including powder processing, sol-gel processing, thermal oxidation, sputtering, pulsed laser deposition, and chemical vapor deposition. It also discusses applications of these techniques such as coating ceramic outer air seals on gas turbine blades and depositing optical fibers. MEMS applications are explored including uses in biotechnology, chemical detection, adaptive optics, and miniature sensors and actuators.
Mark Curtis has over 30 years of experience in medical device manufacturing, including positions at several major companies such as Medtronic, Guidant, and Sulzermedica. He has expertise in areas such as process validation, statistical process control, design of experiments, and FDA compliance. Curtis has managed both high-volume plastic consumables lines and lower-volume implantable device manufacturing. He holds an MS in mechanical engineering and has completed numerous process validations across various manufacturing technologies.
The document discusses several topics related to semiconductor manufacturing processes and design for manufacturability (DFM). It summarizes resolution enhancement techniques used in lithography like RET and OPC. It also discusses DFM techniques like process characterization of IP libraries using yield models, addressing systematic and random yield loss mechanisms, and the need for proactive DFM using accurate process models early in the design flow. Finally, it briefly mentions the use of automated test equipment for testing chips after manufacturing.
In recent years, key developments have taken place in computer- aided design, casting design, simulation, rapid tooling, intelligent advisory systems and Internet based engineering and most foundries are presently caught between change and survival. This is especially true in case of the foundries operating in the developing countries
Clayson C. Spackman has extensive experience in 3D printing soft composites and fiber networks. He received his PhD in Mechanical Engineering from Rensselaer Polytechnic Institute where he developed a 3D printing technology for soft composites using inkjet printing and electrospun fibers. His research focused on investigating material failure mechanisms and developing innovative testing protocols. He has published several peer-reviewed articles and led multiple research projects funded by the NSF and DoD involving 3D printing composites, modeling fiber interactions, and developing educational lab modules.
PolyMEMS INAOE, a Surface Micromachining Fabrication Module and the Developm...Jos辿 Andr辿s Alan鱈s Navarro
油
The PolyMEMS INAOE module for surface micromachining has been developed for the fabrication of electrostatic and electrothermal (Joule effect) sensors and actuators. In this module the designer can choose up to 3 Poly silicon layers and aluminum as electrical interconnecting material. A
micromechanical test chip has been fabricated which includes the following. a) Micro test structures for residual stress measurement; cantilever beams, clamped-clamped beams, ring-and-beam structures, diamond-and-beam structures, rotation beams, Vernier gauges, cantilever spirals, double-clamped microgauge, and b) Actuators; torsion and bending mirrors, resonators, single two-arms Joule structures (STA), chevron-like Joule arrays, capacitive array for accelerometers. In this work we are presenting the measured residual stress on our process, by using the clamped-clamped beam and ring-and-beam arrays. The measured compressive stress is in the 21-26 MPa range for both types of microgauges. A maximum typical value for this tensile stress is 50 MPa, which is higher than that obtained in our experimental procedure. From this residual stress measurement technique and other mechanical testing routines we can conclude the following: the thermal load, the polysilicon microstructure, and the releasing technique; all of them result in a reliable process for the fabrication of dynamic and static polysilicon microstructures.
This document is a resume for Kyounkwon Park. It summarizes his education, including a Ph.D. in Electrical Engineering from UCLA in 2014, as well as his technical skills and work experience. Park currently works as a Senior Engineer at Samsung Display Co. designing nanocrystal-based display panels. He has also conducted research at UCLA on topics including quantum dot synthesis and characterization, optical voltage sensing using semiconductor nanoparticles, and nanoscale integrated circuits.
The document summarizes the activities of the Polymer Physics, Elastomers and Energy Department at ICTP. The department focuses on developing new elastomeric materials and conducting polymers for energy applications. It has two main research groups: the Elastomers Group, which studies elastomer structure-property relationships and new elastomers; and the Energy Applications Group, which develops electrodes and electrolytes for batteries, supercapacitors, and fuel cells.
The document discusses the Institute of Polymer Science and Technology (ICTP) in Madrid, Spain. The main objective of ICTP is the scientific and technological advancement of polymeric materials through research and development. This is pursued through research projects, scientific advice, training, promotion of polymer science, and technology transfer. ICTP is divided into five research departments covering areas like elastomers, energy applications, polymer physics, polymeric nanomaterials, and applied macromolecular chemistry.
Lab-on-a-chip (LOC) technology allows miniaturized chemical and biological laboratory experiments on a single integrated chip. The document discusses LOC materials, fabrication processes like deposition, etching, and bonding. Nanotechnology plays a role through nanosensors. Advantages include low sample/reagent volumes, fast analysis, and portability. Applications include point-of-care diagnostics, pollution monitoring, and medical/patient databases. Future advancements will depend on microfluidics and molecular biology with nanotechnology enabling integration. LOC technology is becoming increasingly important in medicine and industry.
20 years of development of X-ray imaging instruments for research and industr...argebit
油
The Center for computed tomography has 4 operational CT scanners designed for research and industry applications. They range in size from micrometers to centimeters and can perform 3D tomography, composition mapping, and fluorescence imaging. The center has participated in European nuclear fusion programs and collaborated on superconducting materials. Additional applications include material science, oil and gas, automotive, additive manufacturing, and battery analysis. High resolution imaging allows characterization of microstructures, defects, and mechanical properties without damage.
The Center for computed tomography has 4 operational CT scanners used for research and industry applications. They range in size from micrometers to centimeters and have capabilities including high resolution, high penetration power, and composition mapping. The center provides services like R&D projects, investigations, consulting, and training. It has applications in materials science, oil and gas, automotive, additive manufacturing, and nuclear fusion programs.
1. Tsai resume, 1
Tsungchan Tsai (Cliff Tsai), Ph.D.
Email: tctsai@gmail.com Website: https://clifftsai.wordpress.com/portfolio/ Phone: 979-422-8798
1294 Buckingham Gate Blvd, Cuyahoga Falls, OH 44221 Fully authorized to work in US (green card holder)
HIGHLIGHTS
3+ years of industrial experience in leading/managing R&D projects and working with cross-functional
teams, including experts from marketing, regulatory, chemistry in a startup company.
6+ years of experience in non-thermal plasma technology development and fundamental research (e.g.,
characterization of plasma physical/chemical/optical/electrical properties).
Hands-on experience in ultra-high vacuum system for nanofilm deposition and nanoparticle fabrication.
Thin film/semiconductor fabrication including photolithography, wet etch, PVD, and PECVD.
CMOS-MEMS device design (mask layout), simulation, fabrication, and testing.
Software engineering, including application development, data processing, and GUI design using C++.
Numerical modeling, image processing, controller design, and programming using MATLAB/Simulink.
EDUCATION
Texas A&M University, College Station, TX, USA Dec 2012
Ph.D., Mechanical Engineering (Advisor: Dr. David Staack) GPA: 3.89/4.0
National Tsing Hua University, Hsinchu, Taiwan Jul 2006
Master of Science, Power Mechanical Engineering (Advisor: Dr. Rongshun Chen) GPA: 4.0/4.0
National Chung Cheng University, Chiayi, Taiwan Jun 2004
Bachelor of Science, Mechanical Engineering GPA: 3.5/4.0
EXPERIENCE
Senior Scientist Plasma Engineer, EP Technologies LLC, Akron, OH Dec 2012-present
Founding Team Member
o Joined company as the 2nd
employee, set up the lab, led and participated in hiring processes, and
demonstrated technical feasibilities of key focused areas by intensive hands-on experiments.
o Create intellectual properties for new/unique biomedical devices or applications.
Technical Project Lead
o Led technical team to develop new surface modification and functionalization process on polymers
using atmospheric-pressure cold plasma.
o Lead technical team to develop novel decontamination approaches using plasma technology.
o Work with marketing to define system specification, develop requirement, and test plans.
o Participated in mapping out EPA and FDA regulatory pathways.
Key Technical Contributor
o Invent/develop/scale up various lab prototypes and design/execute studies using the prototypes.
o Investigate the effect of plasma-induced electric field and chemical species on plasmaporation.
o Measure pulsed-driven plasma electrical properties, including voltage/current pulse duration, rising
time, amplitude, frequency, and charge transfer, using high-speed oscilloscope.
o Characterize plasma-produced long-lived and short-lived chemical species using FTIR, UV-Vis,
colorimetric assay, and fluorescent dyes and model the chemical reactions using MATLAB.
o Characterize the adhesion property of plasma-deposited films on polymer parts using tensile testing.
o Evaluate various chemical formulations (e.g., acid/H2O2/NO2 system) for rapid sporicidal efficacy.
o Investigate the interaction between chemical species and cells (mammalian and bacterial cells).
o Developed a Windows desktop application with required algorithm to automatically modify G-code
files for 3D printing using C++ and MFC.
o Incorporated JMP (DOE/Statistics software) in projects to randomize experiments and conduct
significant tests.
Key Accomplishments:
Drove company growth from 4 people to 17 people.
Pioneered rapid sporicidal methods with efficacy 90 times faster than the current technology.
Lead inventor for 1 granted patent & 8 patent applications.
2. Tsai resume, 2
Graduate Research Assistant, Texas A&M University, College Station, TX Dec 2009-Dec 2012
Dissertation: Plasma Enhanced Chemical Vapor Deposition (PECVD) on Living Substrates:
o Developed a new thin-film deposition technique (AP-PECVD) to grow polymer films (e.g., PMMA)
and metal film (e.g., copper) in open air conditions on temperature-sensitive substrates, such as porcine
skin and fingernail, using helium plasma jets.
o Characterized plasma deposited films using SEM, AFM, XPS, and FT-IR and correlated film properties
to plasma processing parameters e.g., gas flow rate, power, and precursor concentration.
o Measured ionization wave propagation, plasma breakdown phenomenon, excited species, and
rotational/vibrational temperature using ICCD camera imaging and optical emission spectroscopy.
o Investigated the effect of the precursor type and reactor configuration on the plasma mode change.
o Performed voltage, current, and charge measurement using high-speed oscilloscope and created
Lissajous curves for plasma power computation.
o Applied plasma jets onto agar cultured with E. coli or B. glumae to study the antimicrobial efficacy and
the bacterial inhibition property.
Other Projects:
o Fabricated carbon nanotubes, nanoparticles, and microstructured metal/polymer composite films.
o Developed multiple plasma systems for continuous or batch processes to disinfect plant seed.
o Modeled argon plasma using COMSOL and calculated particle motion, kinetics, and reaction rate in
non-thermal plasma systems.
o Determined process parameters in photolithography processes for fabrication of ultra-high frequency
plasma switches.
o Developed a GUI using Labview to read plasma-produced ozone concentration in an HVAC system.
Key Accomplishments:
Research results led to 1 granted patent and 4 peer-reviewed journal papers.
Awarded NATEA-Dallas 2011 Scholarship Honorable Mentions.
Full-Time Research Assistant, Institute of Physics, Academia Sinica, Taiwan Jan 2008-Jul 2009
Tool Owner of Ultra-High Vacuum Physical Vapor Deposition (PVD) System
o Dissembled and cleaned a molecular beam epitaxy (MBE) system which had severe oil contamination.
o Upgraded the MBE by purchasing a cryopump and installing it to the system.
o Tested vacuum leakage on all the flanges and baked out the chamber to release the adsorbed particles.
o Troubleshot any issues related to hardware such as manipulator, pump and ion gauge.
Study of Magnetic Properties of Nanomaterials
o Fabricated semiconductor (e.g., silicon, antimony, and bismuth) nanofilms and nanoparticles using e-
beam evaporation and low-temperature K-cells in the MBE system.
o Characterized the dimensions and structures of the nanomaterials using SEM and XRD, and
investigated their room-temperature ferromagnetism using VSM (vibrating sample magnetometer).
Key Accomplishments:
The upgraded MBE can reach down to 10-10
Torr with liquid nitrogen and can be used to grow
materials with low evaporation temperature.
Published 1 journal paper.
Graduate Research Assistant, National Tsing Hua University, Hsinchu, Taiwan Sep 2004-Jul 2006
Thesis: Design and Control of 2D Vertical Comb-Drive Micromirrors in an Optical-Tweezers System
o Designed mask layouts for 2-D CMOS-MEMS vertical comb-drive micromirrors using Cadence.
o Fabricated micromirrors using wet etching processes to remove the sacrificial layers.
o Modeled micro-devices using CoventorWare and ANSYS to simulate their static, dynamic, and
electrostatic performances.
o Analytically modeled the micromirror system and designed and developed its non-linear controller
based on sliding and adaptive control methods using MATLAB/Simulink.
o Designed and developed a GUI software with a real-time image processing function for cell recognition
in the optical-tweezers system using MATLAB.
Key Accomplishments:
MEMS layout designs accepted and implemented by TSMC 0.35袖m 2P4M CMOS MEMS technology.
Honored with 2006 Phi Tau Phi Member (1st
place in Mechanical Engineering masters program).
3. Tsai resume, 3
Undergraduate Researcher, National Chung Cheng University, Taiwan Feb 2003-Dec 2003
Project: Development of an Excimer Laser Based Submicron Fabrication System and Its Application to
Manufacturing of Metallic Free-Form Micro Mold
o Developed a computer-aided manufacturing (CAM) software which can display 3D models, allow
users to zoom in/out and rotate the model, and simulate fabrication processes for an excimer laser
micromachining system using C++/MFC with OpenGL.
Key Accomplishments:
3rd
place in the National Contest of Student Project.
PROFESSIONAL SKILLS
Programming/Design/Modeling Software
C/C++, Python, MATLAB/Simulink,
LabVIEW, Arduino, Cadence Virtuoso,
AutoCAD, Pro-E, COMSOL,
CoventorWare, ANSYS, PSPICE, PartSim
Semiconductor/Thin-Film Process
Mask Design, PECVD, Physical Vapor
Deposition, Molecular Beam Epitaxy
(MBE), Ultra-High Vacuum Technology,
Wet Bench, Photolithography
Metrology
Oscilloscope, High-Speed ICCD Imaging,
Profilometer, SEM, AFM, XRD, FTIR,
XPS, UV-Vis Spectroscopy, Optical
Emission Spectroscopy, Photomultiplier
Relevant Courses/Trainings
Fundamental Material Science Engineering,
Thin Film Science & Technology,
Polymer Physical Properties,
MEMS Design, JMP
PUBLICATIONS
Y.-K. Jo, J. Cho, T.-C. Tsai, D. Staack, et al., A Non-thermal Plasma Seed Treatment Method for
Management of a Seedborne Fungal Pathogen on Rice Seed, Crop Science, vol. 54, pp. 796 (2014).
T.-C. Tsai, J. Cho, K. Mcintyre, Y.-K. Jo, and D. Staack, Polymer Film Deposition on Agar Using a
Dielectric Barrier Discharge Jet and its Bacterial Growth Inhibition, Applied Physics Letters, vol. 101, pp.
074107 (2012).
T.-C. Tsai and D. Staack, Characteristics of Precursor-Dependent Breakdown in Helium Dielectric
Barrier Discharge Jet, IEEE Transactions on Plasma Science, vol. 40, pp. 2931 (2012).
T.-C. Tsai and D. Staack, Low-Temperature Polymer Deposition in Ambient Air Using a Floating-
Electrode Dielectric Barrier Discharge Jet, Plasma Processes and Polymers, vol. 8, pp. 523 (2011).
T.-C. Tsai, Y. M. Lan, Y. C. Chi, M. S. Lee, K. L. You, and Y. Liou, Magnetism in Semiconductor
Nanoparticles: Ge Nanopartilces for Example, Taiwan Nano Newsletter (2009).
PROFESSIONAL RECOGNITION
Reviewer, Cellulose
Guest Reviewer, Journal of Prosthetic Dentistry
PUBLISHED/GRANTED PATENTS
Kalghatgi S, Tsai T, Antonakas D, Gray R, inventers; EP Technologies LLC, assignee. Method and
apparatus for intracellular and intercellular delivery of molecules, drugs, vaccines and the like. United
State patent application, US20150209595 A1. 2014 Jan. 30.
Kalghatgi S, Antonakas D, Tsai T, Gray R, inventers; EP Technologies LLC, assignee. Methods and
apparatus for delivery of molecules across layers of tissue. United State patent application,
US20150094647 A1. 2013 Sep. 27.
Tsai T, Kalghatgi S, Antonakas D, Gray R, inventers; EP Technologies LLC, assignee. Methods and
solutions for rapidly killing or deactivating spores. United State patent application, US20160022850 A1.
2013 Mar 15.
Tsai T, Kalghatgi S, Antonakas D, Gray R, inventers; EP Technologies LLC, assignee. Methods and
solutions for killing or deactivating bacteria. United State patent application, US20140271354 A1. 2013
Mar. 15.
Staack D, Tsai T, inventers; The Texas A&M University System, assignee. Plasma Treatment and Plasma
Enhanced Chemical Vapor Deposition onto Temperature Sensitive Biological Materials. United States
patent, US8920361 B2. 2011 Apr 5.