Personal Information
Organization / Workplace
Orange County, California Area United States
Occupation
Cofounder / President at TransSiP, Inc.
Industry
Electronics / Computer Hardware
About
Heterogeneous 3D integration is not just about size, but leading to "better than book" performance. Our latest article in the PCB007 magazine Oct 2014 unveiled new technologies for IoT and Wearable Technologies.
Throughout my 24 years in delivering solutions and disruptive innovation since from the early years in RF/microwave/GNSS to the most recent IoT and wearable technologies, I am finally able to hear the same vision shared from another professional institute that they also proved substrate embedded 3D heterogeneous integration is a new frontier for "More than Moore". However, it must be noticed that 3D referred heterogeneous integration or 3D PCB, is not simply to make it smaller ...
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