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PHYSICS OF TABLET COMPRESSION
Presented By
Mr. Shubham Radhesham Biyani
M. Pharmacy (pharmaceutics)
Guided By
Prof. Mr. Chate sir
SCHOOL OF PHARMACY S R T M UNIVERSITY NANDED
430616
CONTENTS
I. Introduction
II. Difference between compression consolidation
III. Properties of powder/granule
IV. Compression cycle / process of compression
V. Forces involved in compression
VI. Compaction profile
VII. Equation for compression study
VIII. references
INTRODUCTION
? It is also known as ¡® physics of compaction¡¯ .
? It may be stated as compression- consolidation of two
phases (solid - gas) .
? compression:-
? It is the reduction in bulk volume of material due to
displacement of gaseous phase .
? Consolidation :-
? It is increase in mechanical strength of material due particle
¨C particle interaction .
DIFFERENCE BETWEEN COMPRESSION
CONSOLIDATION
compaction consolidation
1. It is defines as the formation of solid
specimen of defined geometry by
powder compression.
1 It is increase in mechanical strength of
material from particle ¨C particle
interaction .
2. The compression takes place in a die
by the action of two punches , the lower
and upper by which compression force is
applied .
PROPERTIES OF POWDER/GRANULE
? While studying physics of compression considering
following ¡®s factor :¨C
1. Angle of repose
2. Bulk density
3. Tapped density
4. Hausner ratio
5. carr¡¯s index or percentage compressibility
etc of material¡­.
COMPRESSION CYCLE / PROCESS OF
COMPRESSION
In pharmaceutical tableting , an appropriate volume of
granules in die cavity is compressed between an upper &
lower punch to consolidate the material into a single solid
matrix , which is finally ejected from die cavity as a tablet ¡­.
EVENTS IN PROCESS OF COMPRESSION
1. transitional repacking or particle rearrangement
2. Deformation at point of contact
3. Fragmentation
4. Bonding
5. Decompression
6. Ejection
TRANSITIONAL REPACKING OR PARTICLE
REARRANGEMENT
? Particle size distribution determines initial repacking..
? During initial stage of compression , particle subjected to low pressure , during
this particle moves with respect to each other & smaller particle enters in voids
between larger particle..
? As result volume decreases & density increases spherical particle undergoes
lesser rearrangement than irregular particle¡­
DEFORMATION AT POINT OF CONTACT
? When a force is applied on a material deformation occur .
? If the deformation disappear completely (return to original
shape) upon release of stress , it is said to be ¡® elastic
deformation¡¯
? A deformation that not recover completely after removal of
stress known as ¡®plastic deformation¡¯.
? The force required initial plastic deformation is known as
¡®yield stress¡¯
? When granule particle so closely no further filling voids
occurs ,hence further increase of compression force cause
deformation at point of contact ¡­
FRAGMENTATION
? Compression forces increases particle starts
fragmentation because of high load , particle
breaks into smaller fragment leading to formation of
new bonding area.
? Fragmentation undergoes densification & infiltration
of small fragments into voids .
BONDING
cold welding :-
When particle approach each other unsatisfied forces present on their
surface leads formation of strong attractive forces called ¡®cold
welding¡¯..
Fusion bonding:-
Particle irregular in shape heat transmission leads increase
mechanical strength .
Factor affecting bonding:-
i. Chemical nature of material
ii. Available surface
iii. Presence of surface contaminant
DECOMPRESSION
? The success or failure of intact tablet depends on stress induced by
¡®elastic rebounds¡¯ & the association deformation produced during
decompression & ejection .
Capping is due to unaxial relaxation in die cavity ..
Ejectio
nAs the lower punch rises & pushed tablet upward , there is continues
residual die wall pressure & energy may be expanded due to die wall
friction.
FORCES INVOLVED IN COMPRESSION
A. Frictional forces
B. Distribution forces
C. Radial forces
D. Ejection forces
COMPACTION PROFILE
1. Force ¨Ctime profile
2. Force ¨C displacement profile
3. Die wall force profile
EQUATION FOR COMPRESSION STUDY
REFERENCES
? Aulton, M. E. (2007). Alton's pharmaceutics:
The design and manufacture of medicines.
Edinburgh: Churchill Livingstone.
? Pharmaceutical dosage forms: Tablets. Vol. I.
Edited by HH Lieberman ...
Physics of tablet compression

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Physics of tablet compression

  • 1. PHYSICS OF TABLET COMPRESSION Presented By Mr. Shubham Radhesham Biyani M. Pharmacy (pharmaceutics) Guided By Prof. Mr. Chate sir SCHOOL OF PHARMACY S R T M UNIVERSITY NANDED 430616
  • 2. CONTENTS I. Introduction II. Difference between compression consolidation III. Properties of powder/granule IV. Compression cycle / process of compression V. Forces involved in compression VI. Compaction profile VII. Equation for compression study VIII. references
  • 3. INTRODUCTION ? It is also known as ¡® physics of compaction¡¯ . ? It may be stated as compression- consolidation of two phases (solid - gas) . ? compression:- ? It is the reduction in bulk volume of material due to displacement of gaseous phase . ? Consolidation :- ? It is increase in mechanical strength of material due particle ¨C particle interaction .
  • 4. DIFFERENCE BETWEEN COMPRESSION CONSOLIDATION compaction consolidation 1. It is defines as the formation of solid specimen of defined geometry by powder compression. 1 It is increase in mechanical strength of material from particle ¨C particle interaction . 2. The compression takes place in a die by the action of two punches , the lower and upper by which compression force is applied .
  • 5. PROPERTIES OF POWDER/GRANULE ? While studying physics of compression considering following ¡®s factor :¨C 1. Angle of repose 2. Bulk density 3. Tapped density 4. Hausner ratio 5. carr¡¯s index or percentage compressibility etc of material¡­.
  • 6. COMPRESSION CYCLE / PROCESS OF COMPRESSION In pharmaceutical tableting , an appropriate volume of granules in die cavity is compressed between an upper & lower punch to consolidate the material into a single solid matrix , which is finally ejected from die cavity as a tablet ¡­.
  • 7. EVENTS IN PROCESS OF COMPRESSION 1. transitional repacking or particle rearrangement 2. Deformation at point of contact 3. Fragmentation 4. Bonding 5. Decompression 6. Ejection
  • 8. TRANSITIONAL REPACKING OR PARTICLE REARRANGEMENT ? Particle size distribution determines initial repacking.. ? During initial stage of compression , particle subjected to low pressure , during this particle moves with respect to each other & smaller particle enters in voids between larger particle.. ? As result volume decreases & density increases spherical particle undergoes lesser rearrangement than irregular particle¡­
  • 9. DEFORMATION AT POINT OF CONTACT ? When a force is applied on a material deformation occur . ? If the deformation disappear completely (return to original shape) upon release of stress , it is said to be ¡® elastic deformation¡¯ ? A deformation that not recover completely after removal of stress known as ¡®plastic deformation¡¯. ? The force required initial plastic deformation is known as ¡®yield stress¡¯ ? When granule particle so closely no further filling voids occurs ,hence further increase of compression force cause deformation at point of contact ¡­
  • 10. FRAGMENTATION ? Compression forces increases particle starts fragmentation because of high load , particle breaks into smaller fragment leading to formation of new bonding area. ? Fragmentation undergoes densification & infiltration of small fragments into voids .
  • 11. BONDING cold welding :- When particle approach each other unsatisfied forces present on their surface leads formation of strong attractive forces called ¡®cold welding¡¯.. Fusion bonding:- Particle irregular in shape heat transmission leads increase mechanical strength . Factor affecting bonding:- i. Chemical nature of material ii. Available surface iii. Presence of surface contaminant
  • 12. DECOMPRESSION ? The success or failure of intact tablet depends on stress induced by ¡®elastic rebounds¡¯ & the association deformation produced during decompression & ejection . Capping is due to unaxial relaxation in die cavity .. Ejectio nAs the lower punch rises & pushed tablet upward , there is continues residual die wall pressure & energy may be expanded due to die wall friction.
  • 13. FORCES INVOLVED IN COMPRESSION A. Frictional forces B. Distribution forces C. Radial forces D. Ejection forces
  • 14. COMPACTION PROFILE 1. Force ¨Ctime profile 2. Force ¨C displacement profile 3. Die wall force profile
  • 16. REFERENCES ? Aulton, M. E. (2007). Alton's pharmaceutics: The design and manufacture of medicines. Edinburgh: Churchill Livingstone. ? Pharmaceutical dosage forms: Tablets. Vol. I. Edited by HH Lieberman ...