Experience:
Automation measurement and test (oscillator phase noise, filter/duplexer nonlinearity test, e.g., 3rd order intercept point,2nd/3rd intermodulation, triple-beat), high-volume manufacturing test setup and optimization.
Filter/duplexer design and evaluation.
RF/Microwave measuring/testing (probe testing, chip wire bonding, chip die bonding, wafer level packaging)
Quality engineering (Taguchi method)
Wafer bonding,
Wet etching,
Photolithography,
Wafer-level chip scale packaging (WL-CSP)
Test&measurement equipments, spectrum analyzer, network analyzer
Coupling-of-mode theory (COM)
Specialties: Software:
AutoCAD,
Agilent VEE,
Agilent EMPro (Electromagnetic simulation),
Agilent AD...