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Singapore Singapore

Staff QA Engineer at STATS ChipPAC

Electronics / Computer Hardware

• ~3 year experience in Failure Analysis (FA) for both package & die levels with extensive hands-on experience and solid background in electrical & physical failure analysis techniques. • ~10 years research experience in thin film fabrication & nanomaterials synthesis, micro-structural characterization, devices physics for solar cells and LEDs. • Ph.D. in Materials Science from University of Oxford, U.K. financially sponsored by the prestigious Clarendon Scholarship and Oversea Research Studentship from British Council. • Demonstrated leadership and excellent written and oral communication skills.