Personal Information
Organization / Workplace
Singapore Singapore
Occupation
Staff QA Engineer at STATS ChipPAC
Industry
Electronics / Computer Hardware
About
• ~3 year experience in Failure Analysis (FA) for both package & die levels with extensive hands-on experience and solid background in electrical & physical failure analysis techniques.
• ~10 years research experience in thin film fabrication & nanomaterials synthesis, micro-structural characterization, devices physics for solar cells and LEDs.
• Ph.D. in Materials Science from University of Oxford, U.K. financially sponsored by the prestigious Clarendon Scholarship and Oversea Research Studentship from British Council.
• Demonstrated leadership and excellent written and oral communication skills.
Contact Details
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