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Providence, Rhode Island Area United States

Global Product Manager, Solar and Semiconductor Technology at Technic Inc

Chemicals

With the rapid growth of smart phones and tablets, semiconductor packaging is being pushed to innovate their designs to meet the needs of this technology segment. One of the fastest growing technologies is copper pillar bumping. Technic with its copper plating, tin-silver, resist stripping and copper seed layer etch products can offer big advantages to the advanced packaging segment. The Technic copper pillar plating bath has been proven to plate faster than any other bath on the market. 4 microns/minute can be easily achieved through the use of very unique organic additives. Technic supplies a full portfolio of electroplating products to the back-end semiconductor segment. These se...