Sales, Marketing and Business Development of Semiconductor Packaging Products with New Innovative Technologies. Analytical problem-solver with demonstrated ability to manage projects from planning through execution and completion under the pressure of time-cost sensitive environments.
Specialties:
鈥� Microelectronic Packaging and Manufacturing
鈥� Process / Dispensing for Electronics Packaging & SMT
鈥� BGA / CSP / Flip Chip Materials. 2.5/3D TSV Assembly
鈥� FEA / FEM
Contact Details
Tags
cathetersadhesiveelastomeric sealselectrosurgical toolsneedles and epidural probesmandrels and moldscardiac assist devicesstentshigh precisionconformal coatingmedicalmedical electronics.
We鈥檝e updated our privacy policy so that we are compliant with changing global privacy regulations and to provide you with insight into the limited ways in which we use your data.
You can read the details below. By accepting, you agree to the updated privacy policy.
