Latest fabricated rigid pc bs(²úÎï¸üУ©
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This document provides details on latest rigid printed circuit boards (PCBs) from Dongguan HuiXinPu Circuit Co. Ltd. including rigid-flex, multilayer, and specialized PCBs. Key details include board dimensions, layer counts, material types, copper weights, and finishing processes. Board applications include general purpose, high frequency, and carbon printing. Production capabilities include rigid, flex, and rigid-flex circuits up to 4 layers in a variety of sizes.
Latest fabricated rigid pc bs(²úÎï¸üУ©
- 1. Latest fabricated rigid PCBs JF - Overseas Sales Dongguan HuiXinPu Circuit Co. Ltd(HXP Circuit) Tel: 0086-755-32813032 Email: emily@hxpcircuit.com UL number E352848. ISO certificate number Q191203132. Rigid-Flex PCB 3 layer 26.1*16.94 mm 0.4 mm rigid /0.1mm flex Polyimide + FR4 material 2.5/0.5/2.5 oz copper Hard gold plating 5u" Polyimide cover layer on bottom only No silkscreen Different soldermask color 2 layer 311.6*210 mm 48pcs/array 1.0 mm thick FR4 material 1/1 oz copper Hard gold plating 2u" White soldermask on top Green mask on bottom No silkscreen PCB with gold fingers 4 layer 174.7*83.9 mm 1.6 mm thick FR4 material 2.5/2/2/2.5 oz copper HAL + Hard gold plated fingers 20u" Green soldermask White silkscreen
- 2. Carbon print PCB 2 layer 378.46*288.54 mm 2pcs/array 1.6 mm thick FR-4 1.5/1.5 oz copper HAL + carbon print Green soldermask White silkscreen PCB with large gold area 4 layer 102*99 mm 1.0mm thick FR-4 TG170 1/1/1/1 oz copper ENIG Green soldermask on top only No silkscreen High frequency PCB 2 layer 25.82*56.19 mm 0.3mm thick RO4350 10mil 1/1 oz copper ENIG Green soldermask on top only White silkscreen on top only