Failure analysis main objective is about finding what made a chip break down after it broke down. The cause of the breakdown can be one of numerous reasons. Problems in the wafer factories. Misalignment of machines in the assembly plants, faulty application by customers and many other possibilities. The task of the failure analyst is just like the detectives in the TV series Crime Scene Investigation. Like CSI we collect evidence to prove the customer that the product broke down in a specific way.
A failure analyst is also involved in the product design to make designs such that breakdown of the products is reduced to a minimum thus delivering maximum quality to our customers.
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