際際滷shows by User: CraigHillman / http://www.slideshare.net/images/logo.gif 際際滷shows by User: CraigHillman / Tue, 02 Jun 2015 15:11:13 GMT 際際滷Share feed for 際際滷shows by User: CraigHillman Intro to Sherlock_Linkedin /slideshow/intro-to-sherlocklinkedin/48896622 f6cbaeef-a9b1-4471-97f9-407f6c6ea33c-150602151114-lva1-app6891
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Tue, 02 Jun 2015 15:11:13 GMT /slideshow/intro-to-sherlocklinkedin/48896622 CraigHillman@slideshare.net(CraigHillman) Intro to Sherlock_Linkedin CraigHillman <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/f6cbaeef-a9b1-4471-97f9-407f6c6ea33c-150602151114-lva1-app6891-thumbnail.jpg?width=120&amp;height=120&amp;fit=bounds" /><br>
Intro to Sherlock_Linkedin from Craig Hillman
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Simplified vs. Detailed /slideshow/simplified-vs-detailed/48895932 165d99c9-3dcd-4b63-bd69-99837af69211-150602145927-lva1-app6892
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Tue, 02 Jun 2015 14:59:27 GMT /slideshow/simplified-vs-detailed/48895932 CraigHillman@slideshare.net(CraigHillman) Simplified vs. Detailed CraigHillman <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/165d99c9-3dcd-4b63-bd69-99837af69211-150602145927-lva1-app6892-thumbnail.jpg?width=120&amp;height=120&amp;fit=bounds" /><br>
Simplified vs. Detailed from Craig Hillman
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Low Tg Underfill: The Good, The Bad, and The Ugly /slideshow/low-tg-underfill-the-good-the-bad-and-the-ugly/39926342 lowtgunderfill-141006094257-conversion-gate02
Most state of the art component packaging uses underfill to improve assembly and reliability. Unfortunately, most designers and users of component packaging have a poor understanding of what works and what doesn't. In this comprehensive primer, DfR Solutions provides the historical and scientific background for engineers to make practical decisions regarding underfill selection and qualification]]>

Most state of the art component packaging uses underfill to improve assembly and reliability. Unfortunately, most designers and users of component packaging have a poor understanding of what works and what doesn't. In this comprehensive primer, DfR Solutions provides the historical and scientific background for engineers to make practical decisions regarding underfill selection and qualification]]>
Mon, 06 Oct 2014 09:42:57 GMT /slideshow/low-tg-underfill-the-good-the-bad-and-the-ugly/39926342 CraigHillman@slideshare.net(CraigHillman) Low Tg Underfill: The Good, The Bad, and The Ugly CraigHillman Most state of the art component packaging uses underfill to improve assembly and reliability. Unfortunately, most designers and users of component packaging have a poor understanding of what works and what doesn't. In this comprehensive primer, DfR Solutions provides the historical and scientific background for engineers to make practical decisions regarding underfill selection and qualification <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/lowtgunderfill-141006094257-conversion-gate02-thumbnail.jpg?width=120&amp;height=120&amp;fit=bounds" /><br> Most state of the art component packaging uses underfill to improve assembly and reliability. Unfortunately, most designers and users of component packaging have a poor understanding of what works and what doesn&#39;t. In this comprehensive primer, DfR Solutions provides the historical and scientific background for engineers to make practical decisions regarding underfill selection and qualification
Low Tg Underfill: The Good, The Bad, and The Ugly from Craig Hillman
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Alternative Methods for Qualifying EEE Parts for CubeSats /slideshow/alternative-methods-to-qualify-eee-parts-for-small-missions/39474750 alternativemethodstoqualifyeeepartsforsmallmissions-140924084711-phpapp01
CubeSats / Small Missions are an exciting revolution in Space Exploration. However, for them to be viable, a new way of selecting, qualifying, and testing their electronics must be identified. In this enlightening presentation, Dr. Craig Hillman provides insight into some of the limitations of the existing approach, surprises about the quality and reliability of commercial off the shelf electronics, and some critical thoughts on return on investment and the justification for virtual simulations]]>

CubeSats / Small Missions are an exciting revolution in Space Exploration. However, for them to be viable, a new way of selecting, qualifying, and testing their electronics must be identified. In this enlightening presentation, Dr. Craig Hillman provides insight into some of the limitations of the existing approach, surprises about the quality and reliability of commercial off the shelf electronics, and some critical thoughts on return on investment and the justification for virtual simulations]]>
Wed, 24 Sep 2014 08:47:11 GMT /slideshow/alternative-methods-to-qualify-eee-parts-for-small-missions/39474750 CraigHillman@slideshare.net(CraigHillman) Alternative Methods for Qualifying EEE Parts for CubeSats CraigHillman CubeSats / Small Missions are an exciting revolution in Space Exploration. However, for them to be viable, a new way of selecting, qualifying, and testing their electronics must be identified. In this enlightening presentation, Dr. Craig Hillman provides insight into some of the limitations of the existing approach, surprises about the quality and reliability of commercial off the shelf electronics, and some critical thoughts on return on investment and the justification for virtual simulations <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/alternativemethodstoqualifyeeepartsforsmallmissions-140924084711-phpapp01-thumbnail.jpg?width=120&amp;height=120&amp;fit=bounds" /><br> CubeSats / Small Missions are an exciting revolution in Space Exploration. However, for them to be viable, a new way of selecting, qualifying, and testing their electronics must be identified. In this enlightening presentation, Dr. Craig Hillman provides insight into some of the limitations of the existing approach, surprises about the quality and reliability of commercial off the shelf electronics, and some critical thoughts on return on investment and the justification for virtual simulations
Alternative Methods for Qualifying EEE Parts for CubeSats from Craig Hillman
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Alternatives to MTBF /slideshow/altneratives/39096274 dfrsolutionsamc2014rev2-140915073241-phpapp02
MTBF is a common metric among practitioners and users of reliability prediction, safety assurance, and maintenance planning. However, there are a number of significant flaws and limitations with this approach. This presentation goes through those limitations and uses that information to suggest alternatives that may provide much greater insight into product performance. ]]>

MTBF is a common metric among practitioners and users of reliability prediction, safety assurance, and maintenance planning. However, there are a number of significant flaws and limitations with this approach. This presentation goes through those limitations and uses that information to suggest alternatives that may provide much greater insight into product performance. ]]>
Mon, 15 Sep 2014 07:32:41 GMT /slideshow/altneratives/39096274 CraigHillman@slideshare.net(CraigHillman) Alternatives to MTBF CraigHillman MTBF is a common metric among practitioners and users of reliability prediction, safety assurance, and maintenance planning. However, there are a number of significant flaws and limitations with this approach. This presentation goes through those limitations and uses that information to suggest alternatives that may provide much greater insight into product performance. <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/dfrsolutionsamc2014rev2-140915073241-phpapp02-thumbnail.jpg?width=120&amp;height=120&amp;fit=bounds" /><br> MTBF is a common metric among practitioners and users of reliability prediction, safety assurance, and maintenance planning. However, there are a number of significant flaws and limitations with this approach. This presentation goes through those limitations and uses that information to suggest alternatives that may provide much greater insight into product performance.
Alternatives to MTBF from Craig Hillman
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Wearable Electronics and Reliability /slideshow/design-for-reliability-for/38826418 reliabilityofwearableelectronics-final-140908092353-phpapp01
As wearable electronics become increasingly important to our daily lives, it is important that designers, suppliers, manufacturers, and users understand the 'special sauce' that will make this new technology sufficiently robust and reliable for the marketplace]]>

As wearable electronics become increasingly important to our daily lives, it is important that designers, suppliers, manufacturers, and users understand the 'special sauce' that will make this new technology sufficiently robust and reliable for the marketplace]]>
Mon, 08 Sep 2014 09:23:53 GMT /slideshow/design-for-reliability-for/38826418 CraigHillman@slideshare.net(CraigHillman) Wearable Electronics and Reliability CraigHillman As wearable electronics become increasingly important to our daily lives, it is important that designers, suppliers, manufacturers, and users understand the 'special sauce' that will make this new technology sufficiently robust and reliable for the marketplace <img style="border:1px solid #C3E6D8;float:right;" alt="" src="https://cdn.slidesharecdn.com/ss_thumbnails/reliabilityofwearableelectronics-final-140908092353-phpapp01-thumbnail.jpg?width=120&amp;height=120&amp;fit=bounds" /><br> As wearable electronics become increasingly important to our daily lives, it is important that designers, suppliers, manufacturers, and users understand the &#39;special sauce&#39; that will make this new technology sufficiently robust and reliable for the marketplace
Wearable Electronics and Reliability from Craig Hillman
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https://cdn.slidesharecdn.com/profile-photo-CraigHillman-48x48.jpg?cb=1583948383 Supporting customers throughout the product lifecycle through our emphasis on design for reliability (DfR) practices. The principle of DfR is in using a fundamental understanding of how electronics fail to address reliability issues as early in the product design process and as far down the supply chain as possible. Over 650 clients across multiple market verticals, including consumer, computer, mobile, enterprise, telecom, implantable, diagnostic, treatment, industrial controls, commercial avionics, military, space, down hole, power supplies, alternative energy, off-road transportation, automotive, etc. http://www.dfrsolutions.com https://cdn.slidesharecdn.com/ss_thumbnails/f6cbaeef-a9b1-4471-97f9-407f6c6ea33c-150602151114-lva1-app6891-thumbnail.jpg?width=320&height=320&fit=bounds slideshow/intro-to-sherlocklinkedin/48896622 Intro to Sherlock_Link... https://cdn.slidesharecdn.com/ss_thumbnails/165d99c9-3dcd-4b63-bd69-99837af69211-150602145927-lva1-app6892-thumbnail.jpg?width=320&height=320&fit=bounds slideshow/simplified-vs-detailed/48895932 Simplified vs. Detailed https://cdn.slidesharecdn.com/ss_thumbnails/lowtgunderfill-141006094257-conversion-gate02-thumbnail.jpg?width=320&height=320&fit=bounds slideshow/low-tg-underfill-the-good-the-bad-and-the-ugly/39926342 Low Tg Underfill: The ...