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Reliability of Wearable Electronics
June 11-12, 2014 TechSearch International Austin, TX
? 2004 -–2200011907000 0 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

Who is DfR Solutions?
The Industry Leader in
Quality-Reliability-
Durability
of Electronics
50 Fastest Growing Companies in the Electronics Industry
- Inc Magazine
Best Design Verification Tool
2012 Global Technology Award Winner
? 2004 - 2001907000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
- Printed Circuit Design

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ooooffff tttthhhheeee SSSSuuuuppppppppllllyyyy CCCChhhhaaaaiiiinnnn

What is Reliability?
o Reliability is the measure of a product’s ability to
o …perform the specified function
o …at the customer (with their use environment)
o …over the desired lifetime
o To ensure reliability, we have to think about
o What is the product supposed to do?
o Where is going to be used?
o How long should it last?

What are Wearable Electronics?
o Wikipedia: “…miniature electronic devices that
are worn by the bearer under, with or on top of
clothing.”
o That’s It?!
o Alternative Definition
o Technology attached to the human body or clothing that
allows the wearer to monitor, engage with, and control
devices, themselves, or their social network

What are Wearable Electronics (cont.)

Wearable Electronics Use Next
Generation Technology
o What is ‘Next Generation’ Technology?
o Materials or designs currently
being used, but not widely adopted
(especially among hi reliability
manufacturers)
o Carbon nanotubes are not
‘Next Generation’
o Not used in electronic applications
o Ball grid array (BGA) is not
‘Next Generation’
o Widely adopted

Next Generation Technology (cont.)
o Why is knowing about ‘Next
Generation’ Technologies important?
o These are the technologies that you
or your supply chain will use to
improve your product
o Cheaper, Faster, Stronger,
‘Environmentally-Friendly’, etc.
o However…

Reliability and Next Gen Technologies
o One of the most common drivers for failure is inappropriate
adoption of new technologies
o The path from consumer (high volume, short lifetime) to high rel is not
always clear
o Obtaining relevant information
can be difficult
o Information is often segmented
o Focus on opportunity, not risks
o Sources are either marketing
mush or confusing, scientific
studies
o Where is the practical advice?

NextGen Technologies: The Reality
o Market studies and mobile phone markets can skew
reality of market adoption
o Annual sales of >100 million may be due to one or two
customers
o Mobile phone requirements may not match the needs
of wearable electronics
o Market studies exclusively focused on volume
o More relevant may be number of customers
o Example: 0201 capacitors

“The Smaller the Better” - 0201 Ceramic Capacitors
Metric English
0402 01005
0603 0201
1005 0402
1608 0603
2012 0805
3216 1206
MLCC Annual Production ~0.5 Trillion
o Based on volume, 0201 capacitors were 25% of the
multilayer ceramic capacitor (MLCC) market in 2010

0201 Ceramic Capacitors: The Reality
o Actual high usage applications
o Ultra small modules (primarily hearing aids) / high frequency
o Major users were limited to approximately 8 to 10
high volume companies in very benign environments
and very limited lifetimes
o Attempts to integrate 0201 capacitor technology into
more demanding applications, such as medical
implants, resulted in quality issues, unexpected
degradation, and major warranty returns

Examples of Next Gen Technologies in Wearables
o Embedded components
o Ultra-small components (i.e., 01005 capacitors)
o New substrate materials
o Polyethersulfone, polyethylene terephthalate (PET), polyethylene
napthalate (PEN)
o Polyimide is not a next gen technology
o Printed connections
o Silver inks, copper inks, nanosolders, conductive polymers
o Organic displays
o Power Via Supercapacitors

Why Care About Reliability? A Warning Lesson for Wearables
o “Durability”
o Case Study: Compact Fluorescent Lamps (CFLs)
Market Share has Dropped by >25%
CFL Market Profile: Data Trends and Market Insights, US Dept. of Energy, September 2010

CFL Reliability: Perception and Reality
o Prof. Siminovitch of UC –
Davis has identified three
(3) areas of dissatisfaction
o Color quality
o Dimming
o Product longevity
o Numerous other websites
/ blogs have reported
issues with CFL reliability
o Rensselaer Polytechnic
Institute (RPI) found early
failure rates of CFLs
between 2 to 13 percent
o Returns higher in thermally
challenging environments
(reflectors, high switching)
o Indications that power
supplies play a major role
in failures
green.blogs.nytimes.com/2009/01/27/why-efficient-light-bulbs-
fail-to-thrive/, Jan. 27, 2009, New York Times
Will LED Light Bulbs Best Your CFLs and
Incandescents?, Popular Mechanics, August 4, 2010,
http://www.popularmechanics.com/science/environme
nt/will-led-light-bulbs-best-cfls-and-incandescents

Ensuring Wearable Electronics Reliability
o DfR at Concept / Block-Diagram Stage
o Specifications
o Part Selection
o Derating and uprating
o Design for Manufacturability
o Reliability is only as good as what you make
o Wearout Mechanisms and Physics of Failure
o Predicting degradation in today’s electronics

Specifications
o Two key specifications important to capture at
concept/contract stage that influence reliability
Reliability expectations
Use environment

Reliability Goals
o Identify and document two metrics
o Desired lifetime
o Product performance
o Desired lifetime
o Defined as when the customer will be satisfied
o Should be actively used in development of part and product qualification
o Product performance
o Returns during the warranty period
o Survivability over lifetime at a set confidence level
o MTBF or MTTF calculation should be primarily an administrative or
marketing exercise (response to customer demands)

Desired Lifetime and Wearable
Electronics
o What is the desired lifetime of wearable electronics?
o Rough equivalents: Clothes, shoes, watches, glasses, cell
phones
o Clothes: ??
o Shoes: 3 months to 5 years (600 miles)
o Watches: 3 to 20 years
o Glasses: 2 to 5 years
o Cell phones: 12 to 36 months
o With a new technology, there is an opportunity to
influence expectations

Product Performance: Warranty Returns
o Consumer Electronics
o 5-25%
o Low Volume, Non Hi-Rel
o 1 to 2%
o Industrial Controls
o 500 to 2000 ppm (1st Year)
o Depends on complexity,
production volumes, and risk
sensitivity
o Automotive
o 1 to 5% (Electrical, 1st Year)
o Can also be reported as
problems per 100 vehicles

Product Performance: Warranty Returns
(cont.)
o Square Trade

Product Performance: Class III Medical
Electronics
Family
Cumulative
Failures
Duration
(yrs)
Lifetime
(yrs)
Units
Therapy
Comprised
Therapy
Uncomprised
Probability
Device-Year
(Hazard)
SecuraDR 0.0% 1 10 14000 0 0 0.00%
SecuraVR 0.0% 1 10 6000 0 0 0.00%
Maximo DR 0.1% 6 8 37000 8 26 0.02%
VirtuosoDR 0.1% 4 10 71000 19 15 0.03%
GEM III VR 0.3% 10 10 17000 9 27 0.03%
Intrinsic 0.2% 6 10 31000 7 36 0.03%
Maximo VR 0.2% 6 10 43000 12 33 0.03%
VirtuosoVR 0.1% 3 10 32000 9 4 0.03%
GEM III DR 0.3% 7 7 20000 11 27 0.04%
Marquis VR 0.4% 7 10 19000 15 27 0.06%
EntrustDR 0.3% 5 10 28000 6 37 0.06%
EntrustVR 0.3% 5 10 14000 5 21 0.06%
Marquis DR 0.8% 7 7 48000 100 79 0.11%
Onyx 0.5% 5 10 1000 1 3 0.10%
GEM 1.0% 10 10 22000 N/A N/A 0.10%
GEM DR 1.2% 10 10 15000 N/A N/A 0.12%
EntrustDR 2.8% 5 10 500 1 6 0.56%
VirtuosoDR (advisory) 28.3% 4 10 4000 2 490 7.08%

Product Performance: Survivability
o Some companies set reliability goals based on
survivability
o Often bounded by confidence levels
o Example: 95% reliability with 90% confidence over 15
years
o Advantages
o Helps set bounds on test time and sample size
o Does not assume a failure rate behavior (decreasing,
increasing, steady-state)

Identify and Quantify Failure Inducing
Loads
o Temperature Cycling
o Tmax, Tmin, dwell, ramp times
o Sustained Temperature
o T and exposure time
o Humidity
o Controlled, condensation
o Corrosion
o Salt, corrosive gases (Cl2, etc.), UV
o Power cycling
o Duty cycles, power dissipation
o Electrical Loads
o Voltage, current, current density
o Static and transient
o Electrical Noise
o Mechanical Bending (Static and Cyclic)
o Board-level strain
o Random Vibration
o PSD, exposure time, kurtosis
o Harmonic Vibration
o G and frequency
o Mechanical shock
o G, wave form, # of events

Identify Environment: Standards
o Usually, the first approach is
to use standards
o However, existing standards
do not work well with
wearable electronics
o More geared towards
permanent installations
MIL HDBK310
IPC SM785

o Maximum
temperatures likely
not a significant
concern
o Typically far
below ratings
Field Environment: Temperature
o However, very
cold temperatures
(below -20C) could
be a challenge
o Especially in
combination with a
mechanical load

Field Environment: Mechanical
o Vibration
o Not typically affiliated with human body, but outliers can occur
(especially with tools, transportation)
o Examples: Jackhammer, reciprocating saw
o Have induced failures in rigid medical devices
o Mechanical Shock
o Drop loads can reach
1500g for mobile phone
(some OEMs evaluate up
to 10,000g)
o Likely to be lower for lighter
wearables, but could be
repeated (i.e., affiliated with
shoes)

Field Environment: Mechanical (cont.)
o Bending (Cyclic / Overstress)
o Often considered one of the biggest risks in regards to
wearables
o Certain human movements that induce bending (flexing of the
knee) can occur over 1,000/day
o Case Study
o There is indication that next-gen
substrate materials experience
a change in electrical properties
after exposure to bending
o Can be exacerbated by
elevated temperature

Corrosion: Handling / Sweat
o Composition of dissolved salts in water
o Can include other biological molecules.
o Main constituents, after the solvent (water),
o Chloride, sodium, potassium, calcium, magnesium, lactate, and urea.
o Chloride and sodium dominate.
o To a lesser but highly variable extent, iron, copper, urocanate (and the
parent molecule histidine), and other metals, proteins, and enzymes are
also present.
o The main concern regarding sweat is as a source of chloride

Handling / Sweat (cont.)
160
140
120
100
80
60
40
20
0
SO4
(μg/in2)
PO4
(μg/in2)
NO3
(μg/in2)
Br
(μg/in2)
NO2
(μg/in2)
Cl
(μg/in2)
F
(μg/in2)
ID
1 Raw stock aluminum 0.00 2.14 0.43 0.00 0.26 1.00 0.07
2 After polish and clean 0.00 0.47 0.45 0.00 0.21 1.07 0.09
3 Handling (office environment) 0.00 14.35 0.49 0.00 0.41 1.30 0.10
4 Handling (after exercise) 0.00 25.63 0.39 0.00 0.41 0.92 0.09
Raw stock After Cleaning Handling (office) Handling
(exercise)
Handling (brow)
Type of Exposure
Contamination Extracted (μg)
Chloride
Sodium
Potassium
Calcium
Magnesium
Lactic acid
5 Handling (after wiping brow) 0.00 46.61 0.39 0.00 0.36 1.20 0.14

Influence of Pollutants: Creepage
Corrosion
o Recent field issues with printed circuit boards (PCBs)
plated with immersion silver
o Sulfur-based creepage corrosion
o Failures in customer locations with elevated levels of
sulfur-based gases
o Rubber manufacturing
o Sewage/waste-water treatment plants
o Vehicle exhaust fumes (exit / entrance ramps)
o Petroleum refineries
o Coal-generation power plants
o Paper mills
o Landfills
o Large-scale farms
o Automotive modeling studios
o Swamps
o Fast Food Restaurants
o “Silicone is being used because it is
soft and smooth”
P. Mazurkiewicz , ISTFA 2006

Sulfur Attack of Encapsulated Hybrid
o Silicone encapsulant,
ceramic hybrid
o Used in industrial controls
o Customer reported failures
after a few months in the field
o X-ray identified several separations
‘Good’
hybrid
‘Bad’
hybrid

SMT Resistors-Sulfidation from Sulfur Exposure
o Sulfur attack of silver occurs at the abutment
of the glass passivation layer and the
resistor termination
o Cracks or openings can allow the ingress
of corrosive gases,
o Reaction with the silver to form silver
sulfide (Ag2S)
o Large change in resistance
o rAg = 10-8 ohm-m;
rAg2S = 10 ohm-m
o Up 20K ohms (0.01 x 0.01 x 0.5mm)
o Manufacturers’ solutions
o Sulfur tolerant – silver alloys
o Sulfur resistant – silver replacement

Corrosion: UV Exposure
o Exposure to ultraviolet (UV) is typically not
sufficient to induce degradation in electronic
materials
o However, a combination of temperature, moisture,
and UV can induce scission in polymeric chains
o Exact combination, and specific portion of the UV
spectrum, is not always well characterized
o It has been documented that stress corrosion
cracking has been caused by sun tan lotion

UV Exposure
Annual UV Energy Calculations by City
City Latitude
Annual UV Intensity – Global Picture
o Of Cities listed, Phoenix has highest avg annual exposure. Note: Model is isolated to UV. Humidity is not included.
Average Total
Energy at 340nm
(W*hr/m^2/nm)
Average Annual Total
Radiant Dose at 340nm
(kJ/m^2/nm)
Singapore 1 426 1532
Paris, France 48 499 1796
Sao Paulo, Brazil 22 553 1991
Tokyo, Japan 35 570 2053
Guatemala 14 648 2334
Miami, FL 25 661 2380
New York NY 40 661 2381
Barcelona, Spain 41 662 2382
Brasilia, Brazil 15 662 2383
Melbourne,
Australia 37 708 2549
Buenos Aires,
Argentina 34 727 2618
Baghdad, Iraq 33 732 2634
Minneapolis, MN 44 735 2647
Townsville, Australia 19 743 2673
Madrid, Spain 40 748 2694
LA, CA 34 767 2761
Phoenix, AZ 33 869 3129
http://www.drb-mattech.co.uk/uv%20map.html

Other Challenging Environments for
Wearables
o Washer / Dryer
o Cleaning fluids
o Mud / Dust / Water

Environment (Best Practice)
o Use standards when…
o Certain aspects of your environment are common
o No access to use environment
o Measure when…
o Certain aspects of your environment are unique
o Strong relationship with customer
o Do not mistake test specifications for the actual use
environment
o Common mistake with mechanical loads

How Have Wearable Consumer Electronics Failed?
o Sweat
o It has been documented in blogs that Apple iPOD Nano’s have shorted
out due to sweat
o Strain relief
o Wearable on clothing, attached by a cord to power device, failed
prematurely due to a lack of strain relief
o Plasticizer
o First-generation of Amazon Kindle wiring insulation cracked/crumbled
due to the use of non-optimized plasticizer formulation
o Cyclic Fatigue
o Initial video game controllers experienced fatigue of solder joints on
components attached to the backside of the push buttons

Follow the Toyota Example (Case Study)
o Traditional approach: Design radiator for a specific
vehicle based on mechanical specifications written for that
vehicle
o Toyota considers a range of radiator solutions based on
cooling capacities and the cooling demands of various
engines that might be used.
o How the radiator actually fits into a vehicle would be kept loose so
that Toyota's knowledge of radiator technology could be used to
create the optimum design
o Toyota's system is "test & design" rather than the traditional
"design & test."
o Toyota engineers test at the fundamental knowledge level so they
don't have to test at the later, more expensive stages of design and
prototyping

Conclusion
o Wearable electronics are an exciting revolution in our
engagement with ourselves and the world around us
o However, there are clear risks
o Wearables will be using new technology that has not been fully
characterized
o They will be placed in environments that are not fully considered by
the designer
o There will be unexpected failures, resulting in delays in
product launch and potential advisory notices, if wearable
manufacturers do not use industry best practices and
physics of failure to qualify their technology

Thanks!!
Greg Caswell Cheryl Tulkoff
Sr. Member of the Technical Staff Sr. Member of the Technical Staff
DfR Solutions DfR Solutions
301-640-5825 (office) 301-640-5824 (office)
443-834-9284 (cell) 512-913-8624
gcaswell@dfrsolutions.com ctulkoff@dfrsolutions.com

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