This document summarizes a paper that proposes a new model for LDMOS transistors called the MM20 model. The paper describes the MM20 model structure and its extrinsic and intrinsic components. Validation results are presented showing good agreement between the modeled and measured S-parameters, drain current over varying voltages and temperatures, and output power versus input power. The conclusions are that the new MM20 model is nonlinear, temperature sensitive, optimized from experimental data, and allows for more perfect simulation of LDMOS transistor behavior than previous models.
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A non-linear Electro-thermal scalable Model for High Power RF LDMOS Transistor
1. MM20 vs HVEKV
LDMOS Model DC Only Evaluation
Author: John Wood, Fellow, IEEE, Peter H. Aaen, Member, IEEE, Daren Bridges,
Member, IEEE, Michael Guyonnet, Daniel S. Chan, Member, IEEE, and Nelsy
Monsauret
Source: IEEE transaction on microwave theory and techniques, Vol:57, No:2
February 2009
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Outline
Why LDMOS Transistors
About Models of transistor
New proposed model in above
mentioned paper
Validation of proposed model
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Why LDMOS Transistors
Laterally diffused MOS is
Field effect transistor
High power transistor
Performance & cost
RF frequency
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What is Model
A way to read elements
easily
Is the process of
generating abstract
conceptual analysis
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NLDMOS Structure with Scalable Ldrift
Figure 2. HV-EKV model structure with built in Rdrift.
Scalable Ldrift
0.8[um]~4.8[um]
Figure 1. MM20 model structure with Rdrift VerilogA code.
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Equivalent Electrical Network
Fig 4: New extrinsic network with the cold-FET intrinsic circuit for a transistor
with total gate periphery of 4.8 mm
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S-parameters from Measurement vs Model
Fig 5: Comparison between measured and modeled s-parameters
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Load line under mismatched condition
Fig 6: Load line for a Transistor operating under mismatched conditions
supper-imposed upon the drain current (under pulsed operation)
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ANNs for Function Approximation and
Extrapolation
Fig 7: Illustration of the various regions of the drain current. The measured
characterization data is indicated by region I, while regions II and III
represent the extrapolation and breakdown regions.
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Prediction of device behaviour using
ANNs
Fig 8: Surface plot of the drain current as predicted by the full drain
current model. The thick line indicates the range of voltages over
which the drain current was measured.
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Behaviour of Charge state function
Fig 9: Plot of Qg versus Vds and Vgs. Outside the measured region
indicated by the thick line, the charge surface predicted by the neural
network is smooth and very well behaved, even at extremely high voltages,
which would never experienced in practice, but may be used by the
simulator during convergence.
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Modeled and Measured Drain current and
input power at different temperature
Fig 10: Modeled and measured drain current is
plotted at 25, 75 and 125 degree celsious as a
function of applied gate voltage.
Fig 11: Measured and modeled output power
versus input power for bias current equal to 6
and 9 mA/mm
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Validation of Model
This EM Model -
Is Nonlinear
Is Temperature sensitive
Has Optimized parameter
Is in good agreement with experimental data
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Conclusion
New model is proposed
Model is optimized from experimental data
More perfect simulation is possible
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