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4s Te Mp 1 S2 Kt3 Ct Sense

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melttemp

1. The document discusses using TeMpTM technology to monitor and control the melt temperature during an injection molding process. 2. Key steps in the process include establishing process-to-product parameters, documenting the process temperature profile, and repeating the process for consistency. 3. TeMpTM sensors monitor the melt temperature throughout injection, packing, and curing stages to ensure the temperature meets set points.

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4s-ձѱ™ 1 Trig F2KtimeC-Vtime 2 1 3
ձѱ™ Q Ktime™ Instantaneous Pack time T VOLUME E M P Time  Melt flow ΔQ (1) Fill (2) Pack “K” (3) -ΔV Hold time 2 Peak Thermal elastic TeMP Trigger ……………………Cure 1 3 Media Pressure Where P • V = T
M M A A R R K K
1  2 - S u r V ձѱ™ 3 Time et p un erify C1 C2 MeltTeMp Peak Pack Time 2 PACK time fill2 Cure time START SCAN 1 3 Set Point  PACK MeltTeMp Trigger time Cure time MeltTeMp Sensor READOUT SetuprunVerifyvent1fill2PKt3curet by MeLtTeMP© Sense
M M A A R R K K
Molding Process Presentation FjB PlasTechnology Copyright 2003 Intellectual Property of Frederick J. Buja, Principal & Owner 1 Process 2 Product ձѱ™ Work Time MAN Set up is a VARIABLE 1 Establish PROCESS to PRODUCT parameters 2 Document PROCESS TeMp © Pack Point TempPress Time Profile 3 Repeat PROCESS to PRODUCT parameter Consistency Melt pressure Hydraulic Pressure Ram Position Injection Time / Flow Rate Melt Volume 1/19/2012 6 185
4s Te Mp 1 S2 Kt3 Ct Sense
Intellectual Property of FjB PlasTechnology© 2005 DID #062905 MeltTemp ProMold CONFIDENTIAL USA Patent #6,649,095 & Patent Pending Applications - Fred Buja Peak Pack Melt Inject Profile ձѱ™ WattWatch™
M M A A R R K K C1 C2
Intellectual Property of FjB PlasTechnology© 2005 DID #062905 MeltTemp ProMold CONFIDENTIAL USA Patent #6,649,095 & Patent Pending Applications - Fred Buja Nozzle MeltTemp Profile Shot Size Inject End

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4s Te Mp 1 S2 Kt3 Ct Sense

  • 1. 4s-ձѱ™ 1 Trig F2KtimeC-Vtime 2 1 3
  • 2. ձѱ™ Q Ktime™ Instantaneous Pack time T VOLUME E M P Time  Melt flow ΔQ (1) Fill (2) Pack “K” (3) -ΔV Hold time 2 Peak Thermal elastic TeMP Trigger ……………………Cure 1 3 Media Pressure Where P • V = T
  • 3. M M A A R R K K
  • 4. 1  2 - S u r V ձѱ™ 3 Time et p un erify C1 C2 MeltTeMp Peak Pack Time 2 PACK time fill2 Cure time START SCAN 1 3 Set Point  PACK MeltTeMp Trigger time Cure time MeltTeMp Sensor READOUT SetuprunVerifyvent1fill2PKt3curet by MeLtTeMP© Sense
  • 5. M M A A R R K K
  • 6. Molding Process Presentation FjB PlasTechnology Copyright 2003 Intellectual Property of Frederick J. Buja, Principal & Owner 1 Process 2 Product ձѱ™ Work Time MAN Set up is a VARIABLE 1 Establish PROCESS to PRODUCT parameters 2 Document PROCESS TeMp © Pack Point TempPress Time Profile 3 Repeat PROCESS to PRODUCT parameter Consistency Melt pressure Hydraulic Pressure Ram Position Injection Time / Flow Rate Melt Volume 1/19/2012 6 185
  • 8. Intellectual Property of FjB PlasTechnology© 2005 DID #062905 MeltTemp ProMold CONFIDENTIAL USA Patent #6,649,095 & Patent Pending Applications - Fred Buja Peak Pack Melt Inject Profile ձѱ™ WattWatch™
  • 9. M M A A R R K K C1 C2
  • 10. Intellectual Property of FjB PlasTechnology© 2005 DID #062905 MeltTemp ProMold CONFIDENTIAL USA Patent #6,649,095 & Patent Pending Applications - Fred Buja Nozzle MeltTemp Profile Shot Size Inject End