Crimson Direct Plate
Download as PPT, PDF1 like700 views
The document discusses the Crimson Direct Plate Process developed by Dow Chemical for electroplating through-holes in printed circuit boards. The process involves: 1) Creating palladium-tin colloidal particles with a palladium-rich core that are stabilized with negatively charged tin chloride. 2) Adsorbing the palladium-tin colloid onto a substrate pretreated with a cationic surfactant. 3) Rinsing off the tin to leave behind palladium sulfide nanoparticles. 4) Exposing the substrate to a sodium sulfide solution to produce the palladium sulfide nanoparticles, which then allow for immediate copper electroplating through the epoxy substrate.
1 of 10
Download to read offline
Recommended
Muhammad Qasim Presentation of p&c 2 
Muhammad Qasim Presentation of p&c 2 Muhammad Qasim
?
Polycarbonate (PC) is a thermoplastic polymer developed in 1953 by German scientist Hermann Schnell. PC is made through condensation polymerization of bisphenol A and phosgene. It has good impact strength, is easily worked and molded, and has applications in electronics, automotive, aircraft, and bulletproof glass due to its strength and heat resistance. PC can be molded or extruded into final products. While durable, it is susceptible to stress cracking and degradation with extended heat exposure or chemicals.Oxidation--ABU SYED KUET
Oxidation--ABU SYED KUETA. S. M. Jannatul Islam
?
Thermal oxidation is commonly used to grow a thin layer of silicon dioxide (SiO2) on a silicon wafer. There are two main types of thermal oxidation - dry oxidation, which uses oxygen gas, and wet oxidation, which uses water vapor. Dry oxidation grows oxide slower but produces higher quality oxide with better electrical characteristics. Thermal oxidation involves heating cleaned silicon wafers to high temperatures (1000-1200¡ãC) in an oxygen or steam environment to allow a chemical reaction that forms SiO2. The grown oxide layer serves many important functions in integrated circuits like passivation, doping masking, and as the gate dielectric in transistors.Lecture 10
Lecture 10luyenkimnet
?
The document discusses several environmental issues related to technology, including the growing problem of e-waste, toxic sites in Silicon Valley from earlier electronics manufacturing practices, ways to reduce energy consumption through color and materials selection, and alternative energy technologies like solar, wind, and fuel cells. It notes both the challenges and opportunities in developing more sustainable materials and energy solutions.Preparation and properties of polycrystalline YBa2Cu3o7-x and Fe mixtures
Preparation and properties of polycrystalline YBa2Cu3o7-x and Fe mixturesKrzysztof Pomorski
?
The polycrystalline samples of YBa2Cu3O7-x High-Temperature Superconductor (HTS), also called ?YBCO-123¡±, were prepared by mixing (II) oxide (CuO), carbonate (BaCO3) and yttrium (III) oxide (Y2O3) powders and followed by a heat treatment high temperature (900 ¡ãC - 950 ¡ãC) flowing oxygen. The polycrystalline samples of YBCO-Fe composites were prepared by grinding the mixture of single phased YBCO-123 and small of iron (1% and 3% wt.), followed over by a heat treatment . The results of structural (SEM, EDS, Raman spectroscopy), magnetic (AC susceptibility and magnetization measurements) and magneto-transport on produced composites will be presented. Scanning electron microscopy (SEM) for YBCO and Fe mixtures showed iron particles homogeneously placed on YBCO grains boundaries. As the concentration of iron particles increased the critical temperature decreased. The magnetization measurements LN temperature revealed transition from diamagnetic to paramagnetic behaviour of YBCO-Fe samples originated from the iron grains. mahfooz_inhibition of stress corrosion cracking in stainless steels
mahfooz_inhibition of stress corrosion cracking in stainless steelsMahfooz Alam
?
The document discusses stress corrosion cracking (SCC) in stainless steels and methods for its inhibition. SCC occurs due to the combined effect of corrosion and stress and can lead to sudden failure of ductile metals. Austenitic stainless steels are most susceptible to SCC in chloride environments. Methods for inhibiting SCC in stainless steels include lowering stress through heat treatment, controlling corrosive environments, alloying to increase resistance, using protective coatings, and introducing compressive residual stresses through techniques like shot peening, laser peening, and buffing. Cathodic protection is also discussed as an effective method by making the metal a cathode.Chem_IITD_Feb2015_Thin Film Growth with CED
Chem_IITD_Feb2015_Thin Film Growth with CEDIrfan Irfan
?
1) Alameda Applied Sciences Corp. is a small R&D firm focused on pulsed plasma coating technologies, funded by various government contracts.
2) They have developed a cathodic arc coating process called Coaxial Energetic Deposition that uses high voltage pulses to produce uniform, high quality coatings.
3) They have tested coatings for SRF applications and demonstrated good adhesion, high crystalline quality, and compatibility with complex geometries after tests like thermal cycling, pressure washing, and mechanical flexing. Tests were done in partnership with several national laboratories.ION IMPLANTATION
ION IMPLANTATIONAJAL A J
?
Implantation
Sputtering
Etching
Deposition
Physical
Chemical
Others
Arc evaporation
e-beam
Ying poster VO2 07 24-14
Ying poster VO2 07 24-14Ying Qin
?
VO2 is a solid-state material that undergoes an insulator-metal transition at 680¡ãC, accompanied by a structural phase transition. Introducing hydrogen into the monoclinic phase transforms VO2 from an insulator to a conductor and modifies the structure. Infrared absorption spectroscopy of VO2 samples containing hydrogen and deuterium reveals multiple O-H and O-D vibrational lines, indicating multiple hydrogen defect centers. The lines depend on the VO2 sample, suggesting additional impurities or defects may be involved. O-D lines are thermally stable up to 200-250¡ãC.Lecture 08
Lecture 08luyenkimnet
?
The document discusses several advanced materials processing techniques including powder processing, sol-gel processing, thermal oxidation, sputtering, pulsed laser deposition, and chemical vapor deposition. It also discusses applications of these techniques such as coating ceramic outer air seals on gas turbine blades and depositing optical fibers. MEMS applications are explored including uses in biotechnology, chemical detection, adaptive optics, and miniature sensors and actuators.Fabrication of Semiconductors
Fabrication of Semiconductorsaman1312
?
Semiconductors are materials that have electrical conductivity between conductors such as most metals and nonconductors or insulators like ceramics. How much electricity a semiconductor can conduct depends on the material and its mixture content.
Semiconductors can be insulators at low temperatures and conductors at high temperatures. As they are used in the fabrication of electronic devices, semiconductors play an important role in our lives.structural and optical studies of chemically deposited ZnS thin film
structural and optical studies of chemically deposited ZnS thin filmKrishna prasad Patazhi
?
The ZnS thin film is made by a chemical bath method. the structure and optical nature noted from XRD studies and UV studiesFloat Zone, Bridgman Techniques--ABU SYED KUET
Float Zone, Bridgman Techniques--ABU SYED KUETA. S. M. Jannatul Islam
?
The document discusses various crystal growth techniques including Czochralski (CZ), float zone, and Bridgman techniques. It describes the limitations of the CZ method including impurities introduced from the quartz crucible. The float zone technique produces very pure silicon crystals but allows for smaller wafer sizes. The Bridgman technique employs a temperature gradient to slowly cool a melt contained in a crucible to produce a single crystal ingot.Solidification phenomena in nickel base brazes containing boron and silicon
Solidification phenomena in nickel base brazes containing boron and siliconfrograin
?
This document summarizes research on the solidification phenomena in nickel-base brazes containing boron and/or silicon as melting point depressants. Four filler metal systems were investigated: Ni-Cr-Si, Ni-B, Ni-Si-B, and Ni-Cr-Fe-Si-B. Microstructural analysis revealed the formation of intermetallic compounds and allowed deduction of the solidification sequences. For the Ni-Cr-Si system, nickel silicide formed and solidified eutectically with gamma-nickel. The Ni-B system formed nickel boride and a ternary eutectic of gamma-nickel, nickel boride, and chromium boride. Examination ofZinc and zinc alloy plating
Zinc and zinc alloy platingErik Galdames
?
An overview of zinc and zinc alloy plating technology, mainly for automotive industry. A comparison between their properties is made. Fabrication of IC
Fabrication of ICAdani Institute of Infrastructure Engineering College
?
The document summarizes key steps in the fabrication of integrated circuits: thermal oxidation grows a silicon dioxide layer on the wafer for diffusion barriers and insulation; photolithography patterns the oxide layer using a mask, photoresist, and etching; dopant diffusion introduces impurities into the silicon by heating to allow movement; and metal evaporation deposits a thin aluminum film to connect components. These process steps are precisely controlled to build up the circuit structures layer-by-layer on the silicon wafer.Corrosion
CorrosionMohammad Qiasvand
?
Cathodic protection systems are designed to protect metal structures from corrosion by creating a sacrificial anode. However, if the system fails or is not properly maintained, the protective current can find alternative paths that cause unintended corrosion of nearby structures. Three case studies are presented where failed cathodic protection systems resulted in corrosion of underground utilities, electrical shock hazards, and costly pipeline repairs. The document emphasizes the importance of proper installation, maintenance, testing and record-keeping of cathodic protection systems according to industry standards to prevent such issues.IC Fabrication Process
IC Fabrication ProcessSoudip Sinha Roy
?
Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photo lithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.vlsi fabrication
vlsi fabricationSrikanth Vas
?
The document discusses the key process steps in integrated circuit fabrication. It describes (1) preparing silicon wafers through processes like growing silicon crystals from sand and cutting the crystals into wafers, (2) diffusing impurities like boron and phosphorus into the wafers through high-temperature processes to dope the silicon, and (3) implanting ions of desired impurities into the wafers through acceleration and bombardment. The document also covers other important steps like annealing to activate the dopants, oxidizing the silicon to form insulating silicon dioxide layers, and lithography among others.Basics of corrosion_control
Basics of corrosion_controlchiragdeen777
?
Corrosion is the deterioration of metals due to chemical reactions with the environment. It can have serious consequences like structural failure, contamination, and equipment damage. Corrosion occurs via electrochemical reactions where the metal oxidizes (anode) and other reactions reduce (cathode). Factors like galvanic effects, stress, and aggressive ions can accelerate corrosion. Common methods to control corrosion include using coatings, alloying, removing oxygen, adding inhibitors, and electrochemical protection like cathodic protection. Proper prevention strategies can significantly extend the lifetime of metal structures and equipment.Lecture 07
Lecture 07luyenkimnet
?
Cements are made by mixing lime and clay, calcinating, and grinding into a fine powder which bonds through chemical hydration reactions when water is added, forming a strong structural material. Powder processing involves grinding materials into particles, pressing and sintering to densify, with sintering using heat to encourage diffusion and reduce pores without grain growth. Single crystal growth involves melting materials in a crucible and slowly extracting a seed crystal to grow a large, pure single crystal for applications such as semiconductors.Eight forms of corrosion
Eight forms of corrosionGulfam Hussain
?
The document summarizes the 8 main forms of corrosion that can occur in metals. It begins by explaining that corrosion is a natural process that converts refined metals back into more stable forms, driven by thermodynamics. It then describes the key elements that form an electrochemical corrosion cell and discusses various factors that influence corrosion rates. The main types of corrosion covered are uniform corrosion, localized corrosion (including galvanic and crevice corrosion), and stress corrosion cracking. Visual examples of each type of corrosion are provided.Intergranular corrosion in SS tubes
Intergranular corrosion in SS tubesDr. Shagufta K
?
Dr. Shagufta Khan presented on understanding end grain corrosion in austenitic stainless steels. End grain corrosion occurs preferentially at grain boundaries and is caused by segregation of elements like silicon and phosphorus along the boundaries. It is a problem in nuclear reprocessing plants where stainless steel tubing is exposed to highly oxidizing nitric acid. Laser remelting and weld overlays can be used to control end grain corrosion by modifying the microstructure and masking susceptible material, while solution annealing homogenizes the material's structure.Methods to prevent corrosion
Methods to prevent corrosionsourabhrana21
?
Electrochemical Protection or Cathodic Protection uses two methods to protect metal surfaces from corrosion. Sacrificial anodic protection connects the metal to a more reactive metal like zinc or magnesium that corrodes instead of the protected metal. Impressed current cathodic protection uses an electrical current to force the metal to behave as a cathode. There are also several metallic coating methods to apply a protective layer to metals including hot dipping, electroplating, metal spraying, metal cladding, and cementation. Organic coatings like paints, varnishes, enamels, and lacquers provide protection by forming a barrier film on the metal surface.Extended Abstract(PGIS Con)
Extended Abstract(PGIS Con)Aruni Bandara
?
1) Bogala graphite from Sri Lanka was tested as a low-cost alternative to platinum (Pt) as the counter electrode material in dye-sensitized solar cells (DSCs).
2) DSCs using ball-milled Bogala graphite as the counter electrode achieved a power conversion efficiency of 2.12%, lower than the 3.0% efficiency of Pt-based DSCs but still promising given the significantly lower cost of graphite.
3) Scanning electron microscopy and X-ray diffraction characterization showed that the Bogala graphite had a crystalline structure and surface morphology suitable for functioning as the catalytic counter electrode in DSCs.Pvc cmos finale 
Pvc cmos finale Roslina Shariff
?
This document provides an introduction and background on Complementary Metal Oxide Semiconductor (CMOS) technology. It discusses key components of a CMOS circuit including NMOS, PMOS, photolithography, etching, chemical mechanical planarization, shallow trench isolation, contacts, vias, and interlayer dielectrics. The objectives of the project are to identify defects in a defective CMOS sample using electrical testing, scanning laser optical microscopy, passive voltage contrast under SEM, and focused ion beam with EDX to determine the root cause of the defect.Ic fab
Ic fabJohnmar Diamante
?
An integrated circuit is a semiconductor wafer containing thousands of tiny resistors, capacitors and transistors. There are several key steps in the fabrication of integrated circuits:
1. Silicon wafers are created by slicing purified silicon crystals into thin discs.
2. A patterned oxide layer is formed on the wafer through a photolithography process using a mask to transfer circuit patterns to the wafer.
3. The wafer then undergoes several post-processing steps like dicing, die bonding, wire bonding and encapsulation before electrical testing verifies its functioning.Fabrication process flow
Fabrication process flowSudhanshu Janwadkar
?
The document describes the key steps in the fabrication process of integrated circuits, including crystal growth, epitaxial growth, oxidation, doping, deposition, lithography, and etching. Crystal growth involves slowly withdrawing a silicon seed crystal from a melt of polycrystalline silicon to form a single crystal ingot. Epitaxial growth uses chemical vapor deposition or molecular beam epitaxy to form single-crystal layers on a substrate. Oxidation grows silicon dioxide layers via thermal oxidation. Doping introduces impurities via diffusion or ion implantation to modify conductivity. Lithography transfers circuit patterns to photoresist using a mask and photochemical processes.Planar fabrication technology
Planar fabrication technologyPrathamesh Gardi
?
This is one of the fabrication technology used in IC fabrication. This technique is mostly used in flexible electronics. It contains various other subprocesses in it. M McCarthy ALD2016
M McCarthy ALD2016Melissa McCarthy
?
This document summarizes research into depositing electron transport layers (ETLs) for perovskite solar cells using atomic layer deposition (ALD) at low temperatures. TiO2 and SnO2 were deposited as ETLs using thermal ALD at 185¡ãC with and without a plasma pre-clean treatment. XRD analysis found the films were amorphous. XPS showed doping TiO2 with Al2O3 did not change the Ti oxidation state. A plasma pre-clean improved conductivity for TiO2 and SnO2. Wetting of the perovskite layer differed between ETLs, with O2 plasma SnO2 displaying the best wettability despite not having the highest conductivity. FurtherPiezoelectric ceramic
Piezoelectric ceramicbiruk gedif
?
This document discusses piezoelectric ceramics, including their fabrication, processing, applications, and references. Piezoelectric ceramics are made by mixing metal oxide powders, forming them into structures, and firing them to form a crystalline structure. They are then poled by applying an electric field to align dipole moments. Common piezoelectric ceramics include barium titanate and lead zirconate titanate. Applications include sensors, actuators, transducers, generators, and motors that convert mechanical and electrical energy.More Related Content
What's hot (20)
Lecture 08
Lecture 08luyenkimnet
?
The document discusses several advanced materials processing techniques including powder processing, sol-gel processing, thermal oxidation, sputtering, pulsed laser deposition, and chemical vapor deposition. It also discusses applications of these techniques such as coating ceramic outer air seals on gas turbine blades and depositing optical fibers. MEMS applications are explored including uses in biotechnology, chemical detection, adaptive optics, and miniature sensors and actuators.Fabrication of Semiconductors
Fabrication of Semiconductorsaman1312
?
Semiconductors are materials that have electrical conductivity between conductors such as most metals and nonconductors or insulators like ceramics. How much electricity a semiconductor can conduct depends on the material and its mixture content.
Semiconductors can be insulators at low temperatures and conductors at high temperatures. As they are used in the fabrication of electronic devices, semiconductors play an important role in our lives.structural and optical studies of chemically deposited ZnS thin film
structural and optical studies of chemically deposited ZnS thin filmKrishna prasad Patazhi
?
The ZnS thin film is made by a chemical bath method. the structure and optical nature noted from XRD studies and UV studiesFloat Zone, Bridgman Techniques--ABU SYED KUET
Float Zone, Bridgman Techniques--ABU SYED KUETA. S. M. Jannatul Islam
?
The document discusses various crystal growth techniques including Czochralski (CZ), float zone, and Bridgman techniques. It describes the limitations of the CZ method including impurities introduced from the quartz crucible. The float zone technique produces very pure silicon crystals but allows for smaller wafer sizes. The Bridgman technique employs a temperature gradient to slowly cool a melt contained in a crucible to produce a single crystal ingot.Solidification phenomena in nickel base brazes containing boron and silicon
Solidification phenomena in nickel base brazes containing boron and siliconfrograin
?
This document summarizes research on the solidification phenomena in nickel-base brazes containing boron and/or silicon as melting point depressants. Four filler metal systems were investigated: Ni-Cr-Si, Ni-B, Ni-Si-B, and Ni-Cr-Fe-Si-B. Microstructural analysis revealed the formation of intermetallic compounds and allowed deduction of the solidification sequences. For the Ni-Cr-Si system, nickel silicide formed and solidified eutectically with gamma-nickel. The Ni-B system formed nickel boride and a ternary eutectic of gamma-nickel, nickel boride, and chromium boride. Examination ofZinc and zinc alloy plating
Zinc and zinc alloy platingErik Galdames
?
An overview of zinc and zinc alloy plating technology, mainly for automotive industry. A comparison between their properties is made. Fabrication of IC
Fabrication of ICAdani Institute of Infrastructure Engineering College
?
The document summarizes key steps in the fabrication of integrated circuits: thermal oxidation grows a silicon dioxide layer on the wafer for diffusion barriers and insulation; photolithography patterns the oxide layer using a mask, photoresist, and etching; dopant diffusion introduces impurities into the silicon by heating to allow movement; and metal evaporation deposits a thin aluminum film to connect components. These process steps are precisely controlled to build up the circuit structures layer-by-layer on the silicon wafer.Corrosion
CorrosionMohammad Qiasvand
?
Cathodic protection systems are designed to protect metal structures from corrosion by creating a sacrificial anode. However, if the system fails or is not properly maintained, the protective current can find alternative paths that cause unintended corrosion of nearby structures. Three case studies are presented where failed cathodic protection systems resulted in corrosion of underground utilities, electrical shock hazards, and costly pipeline repairs. The document emphasizes the importance of proper installation, maintenance, testing and record-keeping of cathodic protection systems according to industry standards to prevent such issues.IC Fabrication Process
IC Fabrication ProcessSoudip Sinha Roy
?
Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photo lithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.vlsi fabrication
vlsi fabricationSrikanth Vas
?
The document discusses the key process steps in integrated circuit fabrication. It describes (1) preparing silicon wafers through processes like growing silicon crystals from sand and cutting the crystals into wafers, (2) diffusing impurities like boron and phosphorus into the wafers through high-temperature processes to dope the silicon, and (3) implanting ions of desired impurities into the wafers through acceleration and bombardment. The document also covers other important steps like annealing to activate the dopants, oxidizing the silicon to form insulating silicon dioxide layers, and lithography among others.Basics of corrosion_control
Basics of corrosion_controlchiragdeen777
?
Corrosion is the deterioration of metals due to chemical reactions with the environment. It can have serious consequences like structural failure, contamination, and equipment damage. Corrosion occurs via electrochemical reactions where the metal oxidizes (anode) and other reactions reduce (cathode). Factors like galvanic effects, stress, and aggressive ions can accelerate corrosion. Common methods to control corrosion include using coatings, alloying, removing oxygen, adding inhibitors, and electrochemical protection like cathodic protection. Proper prevention strategies can significantly extend the lifetime of metal structures and equipment.Lecture 07
Lecture 07luyenkimnet
?
Cements are made by mixing lime and clay, calcinating, and grinding into a fine powder which bonds through chemical hydration reactions when water is added, forming a strong structural material. Powder processing involves grinding materials into particles, pressing and sintering to densify, with sintering using heat to encourage diffusion and reduce pores without grain growth. Single crystal growth involves melting materials in a crucible and slowly extracting a seed crystal to grow a large, pure single crystal for applications such as semiconductors.Eight forms of corrosion
Eight forms of corrosionGulfam Hussain
?
The document summarizes the 8 main forms of corrosion that can occur in metals. It begins by explaining that corrosion is a natural process that converts refined metals back into more stable forms, driven by thermodynamics. It then describes the key elements that form an electrochemical corrosion cell and discusses various factors that influence corrosion rates. The main types of corrosion covered are uniform corrosion, localized corrosion (including galvanic and crevice corrosion), and stress corrosion cracking. Visual examples of each type of corrosion are provided.Intergranular corrosion in SS tubes
Intergranular corrosion in SS tubesDr. Shagufta K
?
Dr. Shagufta Khan presented on understanding end grain corrosion in austenitic stainless steels. End grain corrosion occurs preferentially at grain boundaries and is caused by segregation of elements like silicon and phosphorus along the boundaries. It is a problem in nuclear reprocessing plants where stainless steel tubing is exposed to highly oxidizing nitric acid. Laser remelting and weld overlays can be used to control end grain corrosion by modifying the microstructure and masking susceptible material, while solution annealing homogenizes the material's structure.Methods to prevent corrosion
Methods to prevent corrosionsourabhrana21
?
Electrochemical Protection or Cathodic Protection uses two methods to protect metal surfaces from corrosion. Sacrificial anodic protection connects the metal to a more reactive metal like zinc or magnesium that corrodes instead of the protected metal. Impressed current cathodic protection uses an electrical current to force the metal to behave as a cathode. There are also several metallic coating methods to apply a protective layer to metals including hot dipping, electroplating, metal spraying, metal cladding, and cementation. Organic coatings like paints, varnishes, enamels, and lacquers provide protection by forming a barrier film on the metal surface.Extended Abstract(PGIS Con)
Extended Abstract(PGIS Con)Aruni Bandara
?
1) Bogala graphite from Sri Lanka was tested as a low-cost alternative to platinum (Pt) as the counter electrode material in dye-sensitized solar cells (DSCs).
2) DSCs using ball-milled Bogala graphite as the counter electrode achieved a power conversion efficiency of 2.12%, lower than the 3.0% efficiency of Pt-based DSCs but still promising given the significantly lower cost of graphite.
3) Scanning electron microscopy and X-ray diffraction characterization showed that the Bogala graphite had a crystalline structure and surface morphology suitable for functioning as the catalytic counter electrode in DSCs.Pvc cmos finale
Pvc cmos finale Roslina Shariff
?
This document provides an introduction and background on Complementary Metal Oxide Semiconductor (CMOS) technology. It discusses key components of a CMOS circuit including NMOS, PMOS, photolithography, etching, chemical mechanical planarization, shallow trench isolation, contacts, vias, and interlayer dielectrics. The objectives of the project are to identify defects in a defective CMOS sample using electrical testing, scanning laser optical microscopy, passive voltage contrast under SEM, and focused ion beam with EDX to determine the root cause of the defect.Ic fab
Ic fabJohnmar Diamante
?
An integrated circuit is a semiconductor wafer containing thousands of tiny resistors, capacitors and transistors. There are several key steps in the fabrication of integrated circuits:
1. Silicon wafers are created by slicing purified silicon crystals into thin discs.
2. A patterned oxide layer is formed on the wafer through a photolithography process using a mask to transfer circuit patterns to the wafer.
3. The wafer then undergoes several post-processing steps like dicing, die bonding, wire bonding and encapsulation before electrical testing verifies its functioning.Fabrication process flow
Fabrication process flowSudhanshu Janwadkar
?
The document describes the key steps in the fabrication process of integrated circuits, including crystal growth, epitaxial growth, oxidation, doping, deposition, lithography, and etching. Crystal growth involves slowly withdrawing a silicon seed crystal from a melt of polycrystalline silicon to form a single crystal ingot. Epitaxial growth uses chemical vapor deposition or molecular beam epitaxy to form single-crystal layers on a substrate. Oxidation grows silicon dioxide layers via thermal oxidation. Doping introduces impurities via diffusion or ion implantation to modify conductivity. Lithography transfers circuit patterns to photoresist using a mask and photochemical processes.Planar fabrication technology
Planar fabrication technologyPrathamesh Gardi
?
This is one of the fabrication technology used in IC fabrication. This technique is mostly used in flexible electronics. It contains various other subprocesses in it. Similar to Crimson Direct Plate (20)
M McCarthy ALD2016
M McCarthy ALD2016Melissa McCarthy
?
This document summarizes research into depositing electron transport layers (ETLs) for perovskite solar cells using atomic layer deposition (ALD) at low temperatures. TiO2 and SnO2 were deposited as ETLs using thermal ALD at 185¡ãC with and without a plasma pre-clean treatment. XRD analysis found the films were amorphous. XPS showed doping TiO2 with Al2O3 did not change the Ti oxidation state. A plasma pre-clean improved conductivity for TiO2 and SnO2. Wetting of the perovskite layer differed between ETLs, with O2 plasma SnO2 displaying the best wettability despite not having the highest conductivity. FurtherPiezoelectric ceramic
Piezoelectric ceramicbiruk gedif
?
This document discusses piezoelectric ceramics, including their fabrication, processing, applications, and references. Piezoelectric ceramics are made by mixing metal oxide powders, forming them into structures, and firing them to form a crystalline structure. They are then poled by applying an electric field to align dipole moments. Common piezoelectric ceramics include barium titanate and lead zirconate titanate. Applications include sensors, actuators, transducers, generators, and motors that convert mechanical and electrical energy.03
03ȪÒã Àî
?
This document summarizes the work of Prof. Yonhua Tzeng's Diamond and Devices Lab, which collaborates with Ulm University in Germany. The lab works on (1) generating hydrogen with transparent boron-doped diamond electrodes on sapphire and silicon membranes, (2) investigating diamond nucleation by comparing nanodiamond deposition and bias enhanced nucleation, and (3) growing aluminum indium nitride on gallium nitride for high electron mobility transistors, with diamond seeding and growth at NCKU and device fabrication at Ulm. The goals are to use diamond for solar water splitting and thermal management of power transistors.Shield Arc Welding Process
Shield Arc Welding ProcessEko Priyanto
?
This document discusses gas tungsten arc welding (GTAW), also known as tungsten inert gas (TIG) welding. It covers the key components of a GTAW system including the power supply, torches, electrodes, and gas regulators. It provides details on setting the arc, welding techniques, and factors that can influence the stability of the arc. The document is intended to explain the GTAW welding process.
Effect of dilution on microstructure and hardness of a nickel-base hardfacing...
Effect of dilution on microstructure and hardness of a nickel-base hardfacing...RAMASUBBU VELAYUTHAM
?
1) The document examines the effect of dilution on the microstructure and hardness of a nickel-base hardfacing alloy deposited on an austenitic stainless steel substrate.
2) Electron probe microanalysis revealed considerable dilution of the hardfacing alloy by the substrate material within the first 2.5mm of the deposit, altering the chemistry, microstructure, and decreasing the hardness in this region.
3) Beyond 2.5mm from the interface, the hardness increases to levels comparable to the undiluted alloy as subsequent deposit layers approach, due to decreasing dilution effects farther from the substrate.Influence of a_partially_oxidized_calcium_cathode_on_the_performance_of_polym...
Influence of a_partially_oxidized_calcium_cathode_on_the_performance_of_polym...ons77777
?
This document summarizes research on the influence of oxygen present during the deposition of a calcium cathode on the performance of polymeric light emitting diodes (pLEDs). The researchers varied the oxygen background pressure during calcium deposition from 10-8 to 10-5 mbar and measured the resulting oxygen concentration profiles and device characteristics. They found that increasing oxygen pressure resulted in decreasing external efficiency and brightness, with the current showing a minimum at intermediate pressures. pLEDs with fully oxidized calcium were non-operational. The best performance was obtained with the lowest possible oxygen concentration during calcium evaporation.Comparative study on structure, corrosion and hardness of Zn-Ni alloy
Comparative study on structure, corrosion and hardness of Zn-Ni alloyUniversidade Federal de Campina Grande
?
The document summarizes a study comparing the structure, corrosion resistance, and hardness of Zn-Ni alloys electrodeposited on aircraft-grade steel under different plating conditions. X-ray diffraction analysis showed the coatings consisted primarily of an orthorhombic NiZn3 phase. Scanning electron microscopy revealed differences in surface morphology between direct current and pulsed electrodeposition. Potentiodynamic polarization and electrochemical impedance spectroscopy indicated coatings from one electrolyte solution exhibited better corrosion resistance than others when deposited using a specific pulsed current technique.New microsoft power point presentation
New microsoft power point presentationPotturi Bhavana
?
This document summarizes the key steps in integrated circuit fabrication: 1) wafer preparation through crystal growth, 2) oxidation, 3) photolithography, 4) diffusion, 5) ion implantation, 6) metallization, 7) testing, 8) passivation, and 9) packaging. It describes processes like Czochralski growth, oxidation, photolithography, diffusion, ion implantation, and metallization. It also discusses semiconductor types, apparatus used, and differences between diffusion, ion implantation, and doping. The document provides an overview of IC fabrication methods and processes.Lezione Metallo Liquido Corrosione 
Lezione Metallo Liquido Corrosione ISTITUTO NAZIONALE FISICA NUCLEARE & University of Padua
?
The document discusses liquid metal cooling applications in nuclear reactors and spallation targets. It describes how liquid metals like lead, lead-bismuth eutectic, sodium, and mercury can be used as coolants due to their good heat transfer properties. However, liquid metals can cause corrosion issues due to liquid metal embrittlement. Hard coatings and thin films are needed to protect structural materials from this type of corrosion.Corrosion Behaviour of Annealed 2205 Duplex Stainless Steel in Sulphuric Acid...
Corrosion Behaviour of Annealed 2205 Duplex Stainless Steel in Sulphuric Acid...The International Journal of Business Management and Technology
?
The document summarizes a study that investigated the corrosion behavior of annealed 2205 duplex stainless steel in sulphuric acid environments. Potentiodynamic polarization tests were conducted on annealed and untreated 2205 duplex stainless steel samples in 0.1M and 3M sulphuric acid. The results showed that the annealed samples exhibited lower corrosion resistance than the untreated samples in both acid environments, indicating that annealing heat treatment reduces the corrosion resistance of 2205 duplex stainless steel in sulphuric acid.Application of Fe3O4 Sphere Doped with Zn for Enhanced Sonocatalytic Removal ...
Application of Fe3O4 Sphere Doped with Zn for Enhanced Sonocatalytic Removal ...ijtsrd
?
The document describes research on using Fe3O4 spheres doped with zinc (Zn) as a sonocatalyst for removing hexavalent chromium (Cr(VI)) from aqueous solutions. Fe3O4 spheres doped with Zn were synthesized using a simple solvothermal method. Characterization showed the Zn was successfully doped into the crystal structure of Fe3O4 spheres. Testing found the doped spheres had high sonocatalytic activity for degrading Cr(VI) under visible light, with 95.8% removal efficiency. The enhanced activity is attributed to the uniform sphere structure and metal doping effect.REM_presentation_ShortForm
REM_presentation_ShortFormTrevor Riedemann
?
The document discusses the Materials Preparation Center (MPC) which prepares high purity rare earth metals. MPC is located at the Ames Laboratory and funded by the US Department of Energy. MPC uses a process called the "Ames Process" to prepare rare earth metals through ion exchange, fluoride preparation, and metallothermic reduction. Impurities are a major concern and can be introduced from the oxides, calcium reductant, crucible material, and atmosphere. High purity inputs and controlled conditions are needed to produce metals suitable for fundamental research.Phillips - Atomic Layer Deposition of NbN Thin Films for Superconducting Radi...
Phillips - Atomic Layer Deposition of NbN Thin Films for Superconducting Radi...thinfilmsworkshop
?
http://www.surfacetreatments.it/thinfilms
Atomic Layer Deposition of NbN thin films for SRF applications (Larry Phillips - 15')
Speaker: Larry Phillips - Jefferson Lab - Newport News - Virginia | Duration: 15 min.
Abstract
Niobium Nitride is a 17K superconductor investigated since early eighthies for Superconducting Radiofrequency applications.
Atomic Layer deposition is instead a technique that only recently starts to be considered for industrial applications. Mh2420342042
Mh2420342042IJERA Editor
?
IJERA (International journal of Engineering Research and Applications) is International online, ... peer reviewed journal. For more detail or submit your article, please visit www.ijera.comElectrolysis and Electroplating
Electrolysis and ElectroplatingAmy Gilewska
?
The document discusses electroplating, which involves using electrolysis to coat a thin layer of one metal onto another. It explains that electroplating can be used to protect against corrosion or improve appearance. It then provides details on the electroplating process, where the metal to be plated is the cathode and connects to the negative terminal, while the metal used for plating is the anode and connects to the positive terminal. Ions of the anode metal dissolve and deposit onto the cathode. Copper plating of other metals like copper is provided as an example.Paint and Conversion Coatings1.pptx
Paint and Conversion Coatings1.pptxssuserd104c2
?
This document discusses various methods for corrosion protection of metals including surface preparation and coatings. Chapter 1 discusses surface preparation for coatings. Chapters 2 through 6 describe different types of organic coatings (paint), anodizing, chromatization, phosphate coating, and oxidation. Corrosion occurs via an electrochemical process where the metal acts as an anode and oxygen is reduced at the cathode. Methods to protect against corrosion include modifying the metal, design, environment, metal potential, using inhibitors, and modifying the surface. Proper design of vessels and components can also help control corrosion. Other techniques mentioned are cathodic protection, anodic protection, and coatings.Nanoparticles and liquid crystals
Nanoparticles and liquid crystalsNitya Singh
?
This document summarizes various methods for synthesizing liquid crystalline nanoparticles and arranging them into organized structures. It discusses techniques like the Brust-Schiffrin method for producing gold nanoparticles, seed-mediated growth for rods and branches, and templating methods using liquid crystals. Reverse templating and self-assembly are described for controlling nanoparticle shape and arrangement. Decorating nanoparticles with liquid crystalline ligands can induce mesophase formation and one-dimensional ordering. The document concludes that tailoring nanoparticle properties through shape, size, composition and self-assembly has applications in areas like sensing, catalysis and drug delivery.Presentation (8).pdf
Presentation (8).pdfsenthilkumar418644
?
Padma Priya's engineering physics report discusses pulsed laser deposition and electro deposition. It explains that pulsed laser deposition uses a high-energy laser to ablate material from a target and deposit it on a substrate, allowing for precise control over film composition and structure. The electro deposition section describes how an electric current drives a redox reaction to deposit a metal coating on an electrode via electrolysis. Both techniques offer advantages for thin film deposition but also have limitations such as deposition rate or introducing stress.
Effect of dilution on microstructure and hardness of a nickel-base hardfacing...
Effect of dilution on microstructure and hardness of a nickel-base hardfacing...RAMASUBBU VELAYUTHAM
?
Comparative study on structure, corrosion and hardness of Zn-Ni alloy
Comparative study on structure, corrosion and hardness of Zn-Ni alloyUniversidade Federal de Campina Grande
?
Corrosion Behaviour of Annealed 2205 Duplex Stainless Steel in Sulphuric Acid...
Corrosion Behaviour of Annealed 2205 Duplex Stainless Steel in Sulphuric Acid...The International Journal of Business Management and Technology
?
More from bladon (6)
Serial Dilution Vs Accuracy
Serial Dilution Vs Accuracybladon
?
Minimizing serial dilution is shown to improve accuracy and reduce cost of expensive reference standards.
Crystalline Structure Of Photoresist Film
Crystalline Structure Of Photoresist Filmbladon
?
This document examines the crystalline structure of pre-cast photoresist film using electron microscopy. It describes how the film sample was prepared by etching it with sodium hydroxide solution to dissolve the more soluble components and leave behind less soluble vertical cylinders. Scanning electron microscopy revealed the dry film is polycrystalline and consists of lamellae that slide over each other during thermal stress, indicating the forces between lamellae are weaker than those between vertically oriented polymer molecules. The document proposes a mechanism for the ordered structure observed in the pre-cast photoresist film.Basics Of Neural Network Analysis
Basics Of Neural Network Analysisbladon
?
This document provides an overview of neural network analysis, including what neural networks are, their advantages and disadvantages, and two common types - multilayer perceptron and Kohonen networks. It describes how neural networks are trained using cases with input and output data, and how the network parameters are adjusted during training to best fit the data. The training process involves using a portion of cases for training, another portion for verification, and the remainder for testing the network.2nd Order Terms in Purity Calculations of Reference Standards
2nd Order Terms in Purity Calculations of Reference Standardsbladon
?
This document discusses the calculation of purity for pharmaceutical reference standards using different analytical methods and accounting for second order terms. It presents two cases - the first considers HPLC purity and water content, while the second adds solvent, inorganic ion, and other measurements. Both cases show how to calculate purity as a function of the different factors using response factors, and how second order terms that account for interactions between factors can improve the accuracy of the calculation. Examples are given to demonstrate the effect of including or omitting the second order terms.Conformation Of Adsorbates
Conformation Of Adsorbatesbladon
?
The conformations of polymers adsorbed onto a substrate is controlled by changes in interaction energies and entropy upon adsorption.Expectation Values & Estimators
Expectation Values & Estimatorsbladon
?
This document discusses statistical concepts including the expectation value of the average, variation, and covariance for a normal distribution. It defines an unbiased estimator as a function whose expectation value is equal to the true average, variation, or covariance. It also cautions about making inferences based on limited information through an anecdote about statisticians on a plane with failing engines.Crimson Direct Plate
- 1. jbladon 1 CONDUCTIVE PALLADIUM SULFIDE The Crimson? Direct Plate Process Crimson? Trademark of Dow Chemical
- 2. jbladon 2 PREPARATION 1. Palladium-tin colloidal particles have a Pd- rich core and are charge-stabilized with negatively charged tin chloride species. 2. Palladium-Tin colloid is adsorbed onto substrate pretreated with cationic surfactant. 3. Tin rinsed off. 4. Substrate is exposed to alkaline solution of sodium sulfide, producing PdS.
- 3. jbladon 3 ? Crimson? Direct Plate Process ? Used to electroplate thru-holes in printed circuit boards ? Adsorbed PdS nanoparticles on epoxy substrate permits immediate copper electroplating. APPLICATION Crimson? Trademark of Dow Chemical
- 4. jbladon 4 ? XAS, XPS and Extended X-ray Absorption Fine Structure (EXAFS) research is published: ? A Palladium Sulfide Catalyst for Electrolytic Plating. Bladon, John J. et al, Electrochem. Soc. (1996), 143(4), 1206-13 ESTABLISHING COMPOSITION AND STRUCTURE
- 5. MEASURING PARTICLE SIZE USING ATOMIC FORCE MICROSCOPY jbladon 5
- 6. PREPARATION OF SAMPLE ? Atomically flat pyrolytic graphite is processed through Crimson? Direct Plate. ? Exposure time is adjusted to avoid multilayer adsorption of colloid. ? Sample is rinsed and air dried. jbladon 6
- 7. jbladon 7 Surface view of PdS nanoparticles
- 8. jbladon 8 Diameter of PdS nanoparticles is about 5 nm
- 9. jbladon 9 Isometric view of PdS nanoparticles
- 10. PATENTS ON CRIMSON? DIRECT PLATE PROCESS ? Electroplating Process. Bladon, John J., (Shipley Co). April 24, 1990; US 4,919,768. ? Method for electroplating nonconductors. Bladon, John J.; Robinson, John N.; Rousseau, Michael. (Shipley Co). April 28, 1990; US 4,952,286. ? Electroplating process. Bladon, John J., (Shipley Co). April 16, 1991; US 5,007,990. ? Printed Circuit Board. Bladon, John J., (Shipley Co). May 21 1991; US 5,017,742. ? Electroplating Process and Composition. Bladon, John J., (Shipley Co). May 4, 1993; US 5,207,888. ? Spray Parameters for Horizontal Processing. Bladon, John J.; Colangelo, Carl; Robinson, John; Rousseau, Michael. (Rohm and Haas). Filed August 9, 1993; US 5,374,346. ? Electroplating Process and Composition. Bladon, John J., (Shipley Co). January 4, 1994; US 5,276,290. jbladon 10