Eye Know How provides signal integrity consulting services, including high speed simulation and measurement, power delivery simulation, model generation, and failure analysis. The company was founded in 2009 in Moos, Germany by Hermann Ruckerbauer, who has 15 years of experience in memory development and high speed signaling. Services include consulting for high speed signaling, memory implementation, analog simulation, measurement-based modeling, and PCB design. The company works with various partners and has provided services to customers in the memory, computing, and electronics industries.
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EKH Company Presentation 2010 11
1. Eye Know How
Signal Integrity Consulting
Services and KnowHow
2. Company Facts
Founder:
Dipl. Ing. (FH) Hermann Ruckerbauer
Founded:
March 2009
Location:
Office in Moos (Bavaria), Germany
Network partners in:
Munich (Design, Layout, CAD)
Straubing (EMV)
Deggendorf (Lab)
China (Shandong und Shaanxi): Oulong Consulting
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3. Hermann Ruckerbauer
Background
Study of Micro System Technology at University of Applied
Sciences in Regensburg
Dipl. Ing. (FH) Micro System Technology
15 Years experience in Memory Development and High
Speed Signaling
Siemens: Bench and Production test
Infineon / Qimonda:
High Speed Signaling
Application test
Interface standard definition
Holder of many patents
EEE Publication:
Cascading Techniques for a High-Speed Memory Interface
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4. EKH - Services
Consulting for High Speed Signaling
Consulting for memory implementation
High speed simulation and measurement
Power delivery simulation
Model generation
Logic Analyzer measurements
Failure analysis (esp. on memory interfaces)
PCB Design and Layout
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5. EKH - Cooperation partners
DKH DesignKnowHow: Dr. Abdallah Bacha
PCB Design and Layout
RF Topics
ESFODA: Michael Vogl (www.esfoda.de)
CAD customization and automation
SinePulse: Md Sayfullah (www.sinepulse.com)
IT services (India)
Hardware development (e. g. FPGA)
FH Deggendorf (www.fh-deggendorf.de)
Measurement Lab
PCB X-section
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8. Software Tools
Agilent ADS
Time and Frequency domain simulation
Analog and Digital Simulation
2.5D and 3D field solver
Data evaluation (measurement and simulation)
Power Delivery
Sigrity Power SI
Design and Layout
Cadence Allegro
Mentor Hyperlinx/Pads
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9. Services from
EyeKnowHow
1) Memory System Know How
2) DRAM device Know How
3) Analog Simulation
4) Power Delivery Simulation
5) 2.5D Modeling: PCB Layout
6) 3D Modeling: Package and Connectors
7) Measurement Based Modeling
8) Signal Integrity Correlation Measurement
9) Logic Analyzer Memory Command Trace Evaluation
10) Failure Analysis
11) Design and Layout Services
12) EMC / EMI Measurement and Consulting
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10. 1) Memory System
Know How
Worked in the development of DDR1 / DDR2 / DDR3 / DDR4
Data and Command/Address bus architecture development
Memory Device Specification
Consumer, Mobile, Desktop and Server system understanding
Differences in requirements and boundary conditions
System requirements
Cache line size limitations
Turnaround times, Bandwidth and latency
Power limitations
Clocking
SSC, Random and Deterministic Jitter
Controller functionality
Controller PCI register features (e. g. Delay shift, Driver strength,
digital timings)
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11. 1) Memory System
Know How
DDR1 Motherboard example
DRAM
DIMM
Bus End
Termination
Controller
Register/PLL
Memory
BUS 2 Slot/
1 Connector
System
CLK buffer
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12. 1) Memory System
Know How
DDR1 MBT
DDR2 Testboard Example
DIMMs
DDR2 ODT
Controller
Emulator
Clock
Buffer
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13. 1) Memory System
Know How
DDR3 System example
T
D
D D
D D
D D
D D
D D
D D
D D
D
D
D
D D D
D D D
D D D D
D D D D
CPU
T
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14. 1) Memory System
Know How
Close interaction between system Architecture and DRAM features
IO specification (e. g. Input capacitance, driver and termination linearity)
DLL functionality
Memory Device Specification
DRAM Core / architecture / process limitation
Source for Latency
ODOC package and impact on Architecture
DRAM process and impact on speed and parasitics
DRAM packaging
Planar and stacked DRAM parasitics
Single Die DRAM package
Wirebond and FCIP packaging
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15. 3) Analog Simulation
Time Domain simulation
Spice models (Lumped elements and BSIM Transistor based)
S-Parameter
IBIS
Frequency Domain simulation
S-Parameter model generation
Model comparison
Statistical Data evaluation
Adding Random and deterministic Jitter
Channel characterization by Step Response
Data Eye evaluation
Setup/Hold Data eye generated out of
Timing budget calculation Channel Step response
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16. 3) Analog Simulation
Schematic example: 10 coupled lines on a Desktop PC Motherboard
DIMM socket
DIMM
Controller Package
Controller
Driver T-Branch on
Motherboard
10 Coupled Via
Motherboard Lead In
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17. 3) Analog Simulation
Simulation schematic example: 10 Coupled lines
DRAM load
Package
Stub
Resistor
DIMM Lead In
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18. 4) Power Delivery Simulation
PowerSI Simulation: PDN impedance over frequency
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19. 5) 2.5D Modeling
PCB Layout
Large Logic
Cadence and Mentor to ADS Layout transfer package
Simulation in Momentum
Result: S-Parameter Model
Co-Simulation with ADS time/frequency domain simulation
Signals and Power Supply Integrity
Layout accurate simulation
X-talk (intera- and inter layer)
Reflections
Losses
3 coupled lines of a CA bus on a DIMM
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20. 6) 3D Modeling:
Package / Connector
Package and Connector Modeling
ADS 3D Fieldsolver EMDS
Substrate routing
Bondwires
FBGA Package balls
Signal traces
Power planes
16 Coupled Bondwires: Signal and Power
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22. 7) Measurement based
Modeling
Definition, Design and Layout of Characterization boards
Lumped model fitting Insertion Loss
Blue: Model
Red: Measurement
Testboard for S-Parameter Measurements
FEXT
ADS model fitted to measurement results
NEXT
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23. 7) Measurement based
Modeling
Physical X-sections
Measure what the manufacturer delivers
Create model based on real Hardware
Dielectric
(FR4)
Traces Cross section of PCB with blind and micro vias
(transmission line) Vias
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24. 8) Correlation
Measurements
Dataeye @ 5.3Gb Measured vs. Simulated / Ball vs. Pad
2x65 Ohm (initial Setting)
Measurement @ ball Simulated @ ball Simulated @ pad
2x45 Ohm (matched to the differential PCB Channel impedance)
Measurement @ ball Simulated @ ball Simulated @ pad
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27. 10) Failure analysis
Memory test failure Analyis
Evaluate log files from Software Memory tests
Narrow down failure reason
DQ vs. CA related fail
Single DQ vs. DQS fail
Read vs. Write fail
Device vs. Signal integrity related fail
Vref Margin test implementation
Adjust VREF until fail and evaluate fail behavior
Timing Margin test implementation
Change Controller delays (DQS and CLK) until fail and evaluate fail behavior
12742808 12742822
FAILURE: possible bad address line at offset
FAILURE: possible bad address line at offset 0x00000000 =
0x018A5141 = address 0x062D4504
address 0x099C0038
Expected value F9D2BAFB, Read value 8002BAFB
Expected value F663FFC7, Read value 099C0038
Re-Read:
Re-Read:
Expected value F9D2BAFB, Read value 8002BAFB
Expected value F663FFC7, Read value 099C0038
Expected value F9D2BAFB, Read value 8002BAFB
Expected value F663FFC7, Read value 099C0038
Expected value F9D2BAFB, Read value 8002BAFB
Expected value F663FFC7, Read value 099C0038
Expected value F9D2BAFB, Read value 8002BAFB
Expected value F663FFC7, Read value 099C0038
Skipping to next test...
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