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Flexible Electronics for Pakistan by DPE

Abdullah Saqib
Abdullah Saqib

The first of its kind, this project seeks to design and implement a low-cost spin coater specifically for multi-layer all-printed device fabrication. The proposed method involved layering and patterning on flexible substrates and to ensure cost-effectiveness, we used an HDD base to form the foundation for spin coating required in this quest to establish the flexible electronics industry in developing countries like Pakistan.

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Flexible Electronics for Pakistan by DPE
Dr. Ahsan Rahman (Supervisor) Mr. Azhar Rauf (Co-Supervisor) Abdullah Saqib Taimoor Naveed Saad Nayyer
Background Introduction Problem Statement Phase I Proposed Phase II Solution Deliverables Block Diagram Project Plan Architecture Flow Chart Cost Assessment Scheduling Time Schedule Applications Conclusion Technological Development
To design, simulate and implement an idea that has the potential to transform the normal understanding of reality. An idea that produces: 1. Hardware 2. Software 3. Research
Flexible Electronics for Pakistan by DPE
Beyond Moores Law More Moore, More than Moore Beyond CMOS. (Electronics Everywhere) Search for an alternative Cheap Flexible Efficient (Electronics Everywhere)
Flexible Electronics for Pakistan by DPE
Printed electronics is a set of printing methods used to create electrical devices. Single & Multi-Layer Devices Examples: Capacitors, Memristors, TFTs PROCEDURE 1. Layering (Spin-Coating) 2. Patterning (Printing Methods) 3. Device Characterization
Flexible Electronics for Pakistan by DPE
Literature Review & SpinCoater System Spin Testing with Market Design Implementation focus on layer thickness Survey Literature Device Layout Device Review for and Experimentation Characterization & Device Fabrication Thesis
A process in which solution is spread evenly over a surface using centripetal force. Spin coating is an important way of creating thin films in the microelectronics industry. PHYSICS OF SPIN COATING Centripetal force is responsible for the spread of liquid across the wafer. THICKNESS -> SPIN SPEED + SPIN TIME COMMON SPIN-COATER SCHEMATIC i. Wafer is held to chuck with vacuum pump. ii. Lid is placed over spinning basin before spin is initiated.
Components 1. Microcontroller 2. RPM Meter 3. Power Supply 4. Brushless DC motor 5. Control & Driver Circuit 6. Mechanical Structure Spin Coater Input Output Controller Devices Devices RPM Meter Keypad LCD BLDC motor
Second step = Patterning Using any printing method, the required pattern is formed. System Design for Printed Electronics 07-0047, 07-00242, 07-00262 Third step = Device Characterization After printing the device, we must experiment and explore the characteristics of the device such as I-V graphs etc. and compare it with theory as proof. DELIVERABLES 1. Microcontroller-based Spin Coater with brushless dc motor. 2. All-printed multi-layer device. 3. Device Characterization report.
Overview of Printed Electronics [1] S. E. Molesa, Ultra-Low-Cost Printed Electronics, Electrical Engineering and Computer Sciences Univ. of California at Berkeley, Technical Report No. UCB/EECS-2006-55, 15 May 2006. [2] Printed electronics, www.en.wikipedia.org/wiki/Printed_electronics [3] Ben Rooney, When Moores Law fails, TechEurope, 2011 Applications [3] R. S. Williams, How We Found the Missing Memristor, IEEE Spectrum, vol. 45, no. 12, 2008, pp. 28-35. [4] Flexible Solar Panels, www.nanosolar.com/nanosolar-technology-overview Spin-coater design [5] Spin Coating Theory, www.clean.cise.columbia.edu/process/spintheory.pdf [6] J.P.H Lima, Spin Coater based on brushless DC motor of Hard disk drivers, Elsevier B.V, Science Direct, 2006 Printing Methods [7] Dan Fenner, Applications and Material Sets for Printed Electronics, Henkel Electronic Materials [8] Alan Hodgson, The role of paper in the future of printed electronics, Alan Hodgson Consultancy Device Characterization illustration [9] Antonio S. Oblea, Achyut Timilsina, David Moore, and Kristy A. Campbell, "Silver Chalcogenide Based Memristor Devices", The 2010 International Joint Conference on Neural Networks (IJCNN) (2010): 1-3 (IEEE) Future Scope and Market Analysis [10] Opportunities in Materials for Printable Electronics: 2007 & Beyond. Market research report from Nanomarkets, January 2007
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Flexible Electronics for Pakistan by DPE

  • 2. Dr. Ahsan Rahman (Supervisor) Mr. Azhar Rauf (Co-Supervisor) Abdullah Saqib Taimoor Naveed Saad Nayyer
  • 3. Background Introduction Problem Statement Phase I Proposed Phase II Solution Deliverables Block Diagram Project Plan Architecture Flow Chart Cost Assessment Scheduling Time Schedule Applications Conclusion Technological Development
  • 4. To design, simulate and implement an idea that has the potential to transform the normal understanding of reality. An idea that produces: 1. Hardware 2. Software 3. Research
  • 6. Beyond Moores Law More Moore, More than Moore Beyond CMOS. (Electronics Everywhere) Search for an alternative Cheap Flexible Efficient (Electronics Everywhere)
  • 8. Printed electronics is a set of printing methods used to create electrical devices. Single & Multi-Layer Devices Examples: Capacitors, Memristors, TFTs PROCEDURE 1. Layering (Spin-Coating) 2. Patterning (Printing Methods) 3. Device Characterization
  • 10. Literature Review & SpinCoater System Spin Testing with Market Design Implementation focus on layer thickness Survey Literature Device Layout Device Review for and Experimentation Characterization & Device Fabrication Thesis
  • 11. A process in which solution is spread evenly over a surface using centripetal force. Spin coating is an important way of creating thin films in the microelectronics industry. PHYSICS OF SPIN COATING Centripetal force is responsible for the spread of liquid across the wafer. THICKNESS -> SPIN SPEED + SPIN TIME COMMON SPIN-COATER SCHEMATIC i. Wafer is held to chuck with vacuum pump. ii. Lid is placed over spinning basin before spin is initiated.
  • 12. Components 1. Microcontroller 2. RPM Meter 3. Power Supply 4. Brushless DC motor 5. Control & Driver Circuit 6. Mechanical Structure Spin Coater Input Output Controller Devices Devices RPM Meter Keypad LCD BLDC motor
  • 13. Second step = Patterning Using any printing method, the required pattern is formed. System Design for Printed Electronics 07-0047, 07-00242, 07-00262 Third step = Device Characterization After printing the device, we must experiment and explore the characteristics of the device such as I-V graphs etc. and compare it with theory as proof. DELIVERABLES 1. Microcontroller-based Spin Coater with brushless dc motor. 2. All-printed multi-layer device. 3. Device Characterization report.
  • 14. Overview of Printed Electronics [1] S. E. Molesa, Ultra-Low-Cost Printed Electronics, Electrical Engineering and Computer Sciences Univ. of California at Berkeley, Technical Report No. UCB/EECS-2006-55, 15 May 2006. [2] Printed electronics, www.en.wikipedia.org/wiki/Printed_electronics [3] Ben Rooney, When Moores Law fails, TechEurope, 2011 Applications [3] R. S. Williams, How We Found the Missing Memristor, IEEE Spectrum, vol. 45, no. 12, 2008, pp. 28-35. [4] Flexible Solar Panels, www.nanosolar.com/nanosolar-technology-overview Spin-coater design [5] Spin Coating Theory, www.clean.cise.columbia.edu/process/spintheory.pdf [6] J.P.H Lima, Spin Coater based on brushless DC motor of Hard disk drivers, Elsevier B.V, Science Direct, 2006 Printing Methods [7] Dan Fenner, Applications and Material Sets for Printed Electronics, Henkel Electronic Materials [8] Alan Hodgson, The role of paper in the future of printed electronics, Alan Hodgson Consultancy Device Characterization illustration [9] Antonio S. Oblea, Achyut Timilsina, David Moore, and Kristy A. Campbell, "Silver Chalcogenide Based Memristor Devices", The 2010 International Joint Conference on Neural Networks (IJCNN) (2010): 1-3 (IEEE) Future Scope and Market Analysis [10] Opportunities in Materials for Printable Electronics: 2007 & Beyond. Market research report from Nanomarkets, January 2007

Editor's Notes

  • #7: Figure(above) http://qa.electroiq.com/etc/medialib/new-lib/solid-state-technology/online-articles/2011/1.Par.33617.Image.565.377.1.gifIndustry estimates project that by the end of 2010, printed electronics will be 35 percent of a $1.92 billion printed, thin film and organic electronics market. By 2020, the market could grow to $55.1 billion with 71 percent printed electronics. While the development of printed electronics is in the early stages, it is evident that it has the potential to change the electronics industry.
  • #9: Electronics printed on organic material is called organic electronics
  • #12: Four main processing steps:Step1. Deposit fluid onto substrate.Step2. Accelerate wafer to final radial velocity.Step 3. The coating thins at a rate that depends on the velocity at which the wafer is spinning and the viscosity of the fluid.Step 4. Solvent is evaporated from the film, resulting in further thinning.