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HETEROGENEOUS INTEGRATION:
COMING OF AGE IN 2015
Paul Werbaneth
Contributing Editor, 3D InCites / 3D+
and
Alissa Fitzgerald, PhD
Managing Member, A.M. Fitzgerald & Associates

OUTLINE
• About 3D InCites / 3D+ / A.M. Fitzgerald & Associates
• “15-in15: Analog, MEMS and Sensors Startups to Watch
in 2015”
• Why Integration?
• How Is 3D Heterogeneous Integration Defined?
• Commercial Heterointegration: Coming of Age
• Heterointegration Risks and Challenges
• Conclusion

ABOUT 3D INCITES / 3D+
3D InCites is an online media resource founded in 2009
to stir up interest in 3D IC integration and 3D packaging
technologies. 3D InCites strives to inform key decision
makers about progress in technology development,
design, standards, and infrastructure in order to realize
commercial production of 2.5D and 3D technologies.
http://www.3dincites.com/
Heterogeneous Integration is going to be the next
important commercial story in 3D Integration, and 3D+
is on the scene reporting and offering insights on the
latest developments.
http://www.3dincites.com/3d/

About A.M. Fitzgerald & Associates
© AMFitzgerald 2015
Page 4
Your Partner in MEMS Development
Since 2003, AMFitzgerald has been a key development partner to over 125 clients
around the world, ranging in size from startups to Fortune 100 companies. Our team
of experts develops all types of MEMS sensors and actuators for applications in the
consumer electronics, medical devices, industrial, aerospace, and scientific markets.
We also help shape our customers' business and product strategies by leveraging
our deep technical knowledge and unique industry insight.
We are well known in the MEMS industry for our technical expertise, practical
approach to manufacturing, and forthright assessment of risk. Our customers trust us
with their most critical projects and return to us year after year.
http://amfitzgerald.com/

15-IN-15: ANALOG,MEMS AND SENSOR STARTUPS TO WATCHIN
2015
“Here are fifteen startups that are eager
to change the world of electronics and
that we think are worth keeping an eye on
in 2015 if you are interested in analog,
MEMS and sensors.”
[Peter Clarke in EETimes, 02 January 2015.]

HETEROINTEGRATION SPOOR IN MEMS AND SENSOR START-UPS
Definition of SPOOR
1: a track, a trail, a scent, or droppings
especially of a wild animal
2: a trace by which the progress of
someone or something may be followed
What would we find, I thought to myself, were
we to look for heterointegration spoor
amongst these 15 notable start-ups?
[3D+, 23 February 2015]

Page 7
• Enables sophisticated
capabilities in small form
factor:
– Multiple sensors
– Signal processing and analysis
– Telemetry capability
– Low power
• Methods
– Wafer-level bonding
– Epi-poly seal
– TSV
Why integration is exciting
Integrated Pressure Sensor
Source: IMD
MEMS
sensor
Stacked MEMS
and ASIC chips,
wirebonded
Source: Chipworks/Kionix

Page 8
Integration using epi-poly: SiTime MEMS oscillator
Hermetic
encapsulation using
thick epi-poly
“MEMS first” process,
CMOS can be added
later

Medical applications: integration improves packaging
Page 9
Larger die needed
for bond pad area
Substrate for
electrical
interconnect
Wirebonds make
hermetic sealing
difficult
Wire pigtail
Direct chip-to-flex bond
Can be surface mounted,
no wire bonding
With TSV
Traditional assembly
TSV reduces device size
• Critical for invasive or implantable use

HOW IS HETEROGENEOUS 3D INTEGRATION DEFINED?
“There are certainly different understandings in the microelectronics
community regarding the definition of heterogeneous 3D integration.”
1) Integration of different devices such as a CMOS processor
and a memory
2) Integration of different substrate materials necessary for the
condition (e.g. GaAs / silicon)
3) Integration of components with significant different device
technologies as e.g. CMOS and MEMS
[Peter Ramm, PhD, Fraunhofer EMFT, in 3D InCites, 16 January 2015]

UNDERSTANDING HETEROGENEOUS INTEGRATION
“I know it when I see it.”
U.S. Supreme Court Justice Potter Stewart,
Jacobellis v. Ohio, 378 U.S. 184, 1964.

HETEROINTEGRATION: CMOS IMAGE SENSORS
IFTLE 172 Sony TSV Stacked CMOS Image Sensors Finally Arrive in 2013
“Many of us can recall 2008 when Toshiba commercialized the first CMOS image
sensor with TSV last /backside. We called these the first 3DIC products, when in
reality they were only 1 layer devices.
The Sony ISX014 8MP sensor features 1.12um pixels and integrated high speed ISP.
The pixel layer and logic layer part are manufactured as separate chips and stacked
by using TSVs. Previously the pixel and logic circuit of Sony’s back side illuminated
(BSI) CMOS image sensor were formed during the same fabrication process.”
[Phil Garrou, PhD, Solid State Technology, 09 December 2013]
Q4 2014 iPhone 6 sales 75M Units

HETEROINTEGRATION: CMOS IMAGE SENSORS (2)
Joint venture of Dual Aperture, Inc. and the Center for
Integrated Smart Sensors (CISS) supported by the Korea
Advanced Institute of Science and Technology (KAIST).
Working on smart sensor technology on multiple platforms
and devices.
Design house located in Changchun, China, specializing in
providing high-end CMOS image sensor solutions for
industrial, medical and scientific applications.
Startup working on image processing, advanced sensor and
optics technology.

HETEROINTEGRATION: CAMBRIDGE CMOS SENSORS
About CCS:
Industry leader in advanced sensor solutions and
sensor technology for monitoring indoor air
quality (IAQ), including VOCs and hazardous
gases (such as CO), outdoor air pollution levels,
and breath analysis. CCS is a fabless
semiconductor company; the sensors
themselves are fabricated on a standard CMOS
MEMS process.
The CCS family of MOX gas sensors enable ultra-
low power consumption (<10mW) for gas
sensing, which means the CSS sensors can find
practical use in battery operated portable
devices such as smartphones and wearables.
About the Market:
>7.2B human beings March 2015
>1.4B households worldwide
1.3B smartphone shipments CY2014
86M global automotive sales CY2014
About CCS and Heterointegration:
CSS is a member of the MSP Project - Multi Sensor
Platform for Smart Building Management.
The MSP Project “… is focused on the development
of highly innovative components and sensors based
on Key Enabling Technologies (KETs). The MSP-
project employs Through-Silicon-Via (TSV)
technology for 3D-integration of these devices on
CMOS electronic platform chips to innovative smart
systems capable for indoor and outdoor
environmental monitoring.”
CCS Micro-Hotplate

HETEROINTEGRATION: INVISAGE
About InVisage:
“Harnessing the power of custom—designed
nanoscale materials, InVisage has created a new
generation of QuantumFilm™ based image
sensors that puts the camera in a whole new
light.”
“QuantumFilm was designed to absorb 100% of
the light we see with our own eyes and do so in a
film whose thickness is measured in
nanometers. We took the magic of photographic
film … and integrated it intimately onto a silicon
chip.” Target markets: mobile devices such as
camera phones and digital cameras.
About the Market:
100M digital camera shipments CY2012
About InVisage and Heterointegration:
QuantumFilm is “made from materials similar to
conventional film—a polymer with embedded
particles—instead of silver grains like photographic
film the embedded particles are quantum dots.”
The QuantumFilm is painted “… atop a low-cost
wafer that has the electrode array for super-dense
high-pixel-count images, but without any of the
expensive CMOS photodetectors that make up the
bulk of conventional digital camera sensors.”
[R. Colin Johnson, EETimes, 22 March 2010]
InVisage QuantumFilm

HETEROINTEGRATION: ISORG
About ISORG:
ISORG converts plastic and glass surfaces into
smart surfaces,” offering “a new generation of
high performance opto-electronic sensors with
3D product integration capability recognizing any
shapes and form factors.”
Target markets include medical equipment;
health care and life sciences; industry 4.0 and
Internet-Of-Things; consumer electronics; home
appliances; smart building and lighting; safety
and security; environment; and toys and
education.
About the Market:
>40B lamp sockets in CY2014
>10B annual bulb shipments CY2015
6.9B RFID Tags sold CY2014
About ISORG and Heterointegration:
The ISORG process is “compatible with system-on-
foil integration (co-integration of printed sensors
with discrete components and integrated circuits on
plastic).” Current manufacturing is being done on
the ISORG pilot manufacturing line, Grenoble, on
32cm x 38cm plastic foils; a mass production
demonstrator is planned for 2015-end, on 60cm x
70cm plastic foils.
ISORG Large Area Image Sensor

HETEROINTEGRATION: MCUBE
About mCube:
“mCube makes the smallest motion sensors in
the world. As a technology leader, mCube
aspires to be the enabler for the Internet of
Moving Things by putting a MEMS motion sensor
on anything that moves, improving the way
consumers live and interact with technology.”
Other target markets include wearables,
smartphones and tablets, and gaming and
virtual reality applications.
About the Market:
>7.2B human beings March 2015
6.9B RFID Tags sold CY2014
About mCube and Heterointegration:
mCube “has developed a method for integrating
MEMS motion sensors above electronic circuitry in a
standard CMOS wafer fab using through-silicon via
connections.”
It’s monolithic MEMS on CMOS IC. Advantages of
this monolithic approach by mCube are said to be
smaller size, higher performance, lower cost, and
the ability to integrate multiple sensors onto a
single-silicon chip.
mCube Monolithic MEMS Process

HETEROINTEGRATION: NEXTINPUT
About NextInput:
NextInput Inc. is a Georgia Tech spin-off with two
important MEMS fathers, Steve Nasiri (founder
of InvenSense), and Kurt Petersen (“Silicon as a
Mechanical Material”) advising it.
“NextInput is … focused on creating new
methods of human-machine interaction.
NextInput’s patent-pending technology provides
a tactile, force or pressure sensitive method of
interfacing with virtually any electronic device
About the Market:
100M digital camera shipments CY2012
About NextInput and Heterointegration:
“NextInput has developed force and pressure
sensitive touch technologies based on MEMS
sensors, an innovative new way of interacting with
electronic devices.
The technology, ForceTouch, positions sensors in an
array beneath a device’s display, with no impact on
optical clarity; NextInput says “a ForceTouch
touchscreen provides the same degree of resolution
as a capacitive touchscreen at lower cost and lower
power.”
.
NextInput ForceTouch

Page 19
MEMS integration risks and challenges
• Yield loss in wafer-level integration
– Good CMOS bonded to bad MEMS
 CMOS yield > 95%
 MEMS yield 70-90%
• Mechanical reliability problems
– CTE mismatch: cracking, delamination
– Stress: warping, shifted sensor offsets
• For some products, package-level integration will persist
until MEMS yields improve

CONCLUSION: THIS TALK AS A WORD CLOUD

Thank you for your attention!
Paul Werbaneth
3D InCites / 3D+
paul@3Dincites.com
+1 707-338-2837
www.linkedin.com/in/paulwerbaneth/en
@PFWerbaneth

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Heterointegration Coming of Age in 2015 - MEF 2015

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