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Microsoft word s13623-ds-scratch pad discolor-failure analysis report

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Park SangHee
Park SangHee

This failure analysis report summarizes an issue where a customer found scratches and discolored pads on some NB chips. Through analysis, Tekcore determined that 1) the pad discolor was likely due to minor surface roughness differences from etching, but did not affect performance, and 2) scratches would only be an issue if they were over 1/10 the chip area, so more samples are needed from the customer. Corrective actions included improving chip identification and pad appearance.

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FAILURE ANALYSIS REPORT FAILURE ANALYSIS REPORT CUSTOMER : DS DEVICE : NB Chip CheckedsVincent Wu ReportedsHarry Wang
FAILURE ANALYSIS REPORT Part 1 : Applicant Information Customer : DS Open date : 2012/07/10 Customer Ref. : S13623 Customer Part No. : NA Sales Thomas Hsiao Sample Qty : NA Device Type : NB Lot No. : NA Part No. : NA Lot Size : 57,938ea Date Code : NA Failure Rate : 5.8% Part 2 : 8D Report Content D1: ESTABLISH TEAMS Team Leader: Vincent Wu Members : SD/Thomas Hsiao, EPI/ Shay Wang, MFG/ Dylan Liu, QC/ Vincent Wu, FA/ Harry Wang D2: PROBLEM DESCRIPTION Defect Phenomena Scratch, Pad Discolor Defect Occurred at ＊ IQA ＆ PQC ＆ FQA ＆ End User Customer DS found scratch, pad discolor issue in NB chips, and then intended to return 58K chips for rejecting. The rejected Tape lists are shown as below. D3: CONTAINMENT ACTIONS Tekcore will check the offered samples and find the root cause immediately. D4: ROOT CAUSE I. Pad Discolor : Due to customer had no provided the defective samples for further analyzing, so we check our warehouse products (NB) firstly.
FAILURE ANALYSIS REPORT 1. Through ICP etching process, the LED chip surface roughness will slightly different, which might affect the microscope by visual inspection, it will cause pad color differences. But this phenomenon wouldn¨t affect to LED¨ optical electrical characteristics. 2. Since Tekcore¨ experience, if CCD (Charge Coupled Device) identification machines installed "Side Optical System", and trimmer machine parameter from the ring of light (Ring Light) with coaxial light (Coxial Light) can effectively improve the situation of chip identification.
FAILURE ANALYSIS REPORT 3. Further, we took 3ea chip (picked from lead frame) to investigate in CCD identification machine, and trimmer machine parameter from ring (Ring Light) with coaxial light (Coxial Light). By the test results can be effective in improving the situation of chip identification. NB Chips Ring Light Intensity : 9% Coxial Light Intensity : 27% Ring Light Intensity : 34% Coxial Light Intensity : 33% II. Chip Scratch : In Tekcore¨ inspection specification, it would be unacceptable if scratch area >1/10 chip area. We expect customer could provide the defective samples for detailed check.
FAILURE ANALYSIS REPORT a瞳zk隈 (Appearance standard of GaN Chips) QA-3003 <Conclusion> I. Pad Discolor Through ICP etching process, the LED chip surface roughness will slightly different, which might affect the microscope by visual inspection, it will cause pad color differences. But this phenomenon wouldn¨t affect to LED¨ optical electrical characteristics. II. Chip Scratch In Tekcore¨ inspection specification, it would be unacceptable if scratch area >1/10 chip area. We expect customer could provide the defective samples for detailed check. D5: CORRECTIVE ACTIONS 1. Tekcore suggest customer installed "Side Optical System" or trimmer machine parameter from the ring of light (Ring Light) with coaxial light (Coxial Light) can effectively improve the situation of chip identification. 2. MFG department will continue to make improvements in order to improve the appearance of metal pad of different colors. D6: IMPLEMENT CORRECTIVE ACTIONS N/A D7: PREVENT RECURRENCE N/A D8: CONGRATULATE Champion :Vincent Wu Team Leader : Vincent Wu Members : SD/Thomas Hsiao, EPI/ Shay Wang, MFG/ Dylan Liu, QC/ Vincent Wu, FA/ Harry Wang
FAILURE ANALYSIS REPORT Confirm and apply by customer 人指顕_J式吭) 人指顕_J式吭 (人指顕_J式吭 人兆 (Signature) : 指晩豚 (Date) : CUSTOMER COMMENT (人吭 人吭) 人吭 ＆ M吭 (Satisfaction) ＆ ]嗤吭 (No Comment) ＆ 音M吭 (Dissatisfaction) 音M吭尖喇式吭(Dissatisfaction Reason and Suggestion) 豢辺欺緩芸 F.A. report 瘁 7 晩隼惴禍瞎飛階^ 7 晩隆指顕揖艇揖吭 緩芸 F.A. report Y。 (Please reply this failure analysis report within 7 days, if no response more than 7 days we will deem that you agree the conclusion of failure analysis report.)

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Microsoft word s13623-ds-scratch pad discolor-failure analysis report

  • 1. FAILURE ANALYSIS REPORT FAILURE ANALYSIS REPORT CUSTOMER : DS DEVICE : NB Chip CheckedsVincent Wu ReportedsHarry Wang
  • 2. FAILURE ANALYSIS REPORT Part 1 : Applicant Information Customer : DS Open date : 2012/07/10 Customer Ref. : S13623 Customer Part No. : NA Sales Thomas Hsiao Sample Qty : NA Device Type : NB Lot No. : NA Part No. : NA Lot Size : 57,938ea Date Code : NA Failure Rate : 5.8% Part 2 : 8D Report Content D1: ESTABLISH TEAMS Team Leader: Vincent Wu Members : SD/Thomas Hsiao, EPI/ Shay Wang, MFG/ Dylan Liu, QC/ Vincent Wu, FA/ Harry Wang D2: PROBLEM DESCRIPTION Defect Phenomena Scratch, Pad Discolor Defect Occurred at ＊ IQA ＆ PQC ＆ FQA ＆ End User Customer DS found scratch, pad discolor issue in NB chips, and then intended to return 58K chips for rejecting. The rejected Tape lists are shown as below. D3: CONTAINMENT ACTIONS Tekcore will check the offered samples and find the root cause immediately. D4: ROOT CAUSE I. Pad Discolor : Due to customer had no provided the defective samples for further analyzing, so we check our warehouse products (NB) firstly.
  • 3. FAILURE ANALYSIS REPORT 1. Through ICP etching process, the LED chip surface roughness will slightly different, which might affect the microscope by visual inspection, it will cause pad color differences. But this phenomenon wouldn¨t affect to LED¨ optical electrical characteristics. 2. Since Tekcore¨ experience, if CCD (Charge Coupled Device) identification machines installed "Side Optical System", and trimmer machine parameter from the ring of light (Ring Light) with coaxial light (Coxial Light) can effectively improve the situation of chip identification.
  • 4. FAILURE ANALYSIS REPORT 3. Further, we took 3ea chip (picked from lead frame) to investigate in CCD identification machine, and trimmer machine parameter from ring (Ring Light) with coaxial light (Coxial Light). By the test results can be effective in improving the situation of chip identification. NB Chips Ring Light Intensity : 9% Coxial Light Intensity : 27% Ring Light Intensity : 34% Coxial Light Intensity : 33% II. Chip Scratch : In Tekcore¨ inspection specification, it would be unacceptable if scratch area >1/10 chip area. We expect customer could provide the defective samples for detailed check.
  • 5. FAILURE ANALYSIS REPORT a瞳zk隈 (Appearance standard of GaN Chips) QA-3003 <Conclusion> I. Pad Discolor Through ICP etching process, the LED chip surface roughness will slightly different, which might affect the microscope by visual inspection, it will cause pad color differences. But this phenomenon wouldn¨t affect to LED¨ optical electrical characteristics. II. Chip Scratch In Tekcore¨ inspection specification, it would be unacceptable if scratch area >1/10 chip area. We expect customer could provide the defective samples for detailed check. D5: CORRECTIVE ACTIONS 1. Tekcore suggest customer installed "Side Optical System" or trimmer machine parameter from the ring of light (Ring Light) with coaxial light (Coxial Light) can effectively improve the situation of chip identification. 2. MFG department will continue to make improvements in order to improve the appearance of metal pad of different colors. D6: IMPLEMENT CORRECTIVE ACTIONS N/A D7: PREVENT RECURRENCE N/A D8: CONGRATULATE Champion :Vincent Wu Team Leader : Vincent Wu Members : SD/Thomas Hsiao, EPI/ Shay Wang, MFG/ Dylan Liu, QC/ Vincent Wu, FA/ Harry Wang
  • 6. FAILURE ANALYSIS REPORT Confirm and apply by customer 人指顕_J式吭) 人指顕_J式吭 (人指顕_J式吭 人兆 (Signature) : 指晩豚 (Date) : CUSTOMER COMMENT (人吭 人吭) 人吭 ＆ M吭 (Satisfaction) ＆ ]嗤吭 (No Comment) ＆ 音M吭 (Dissatisfaction) 音M吭尖喇式吭(Dissatisfaction Reason and Suggestion) 豢辺欺緩芸 F.A. report 瘁 7 晩隼惴禍瞎飛階^ 7 晩隆指顕揖艇揖吭 緩芸 F.A. report Y。 (Please reply this failure analysis report within 7 days, if no response more than 7 days we will deem that you agree the conclusion of failure analysis report.)