This document contains exam questions and answers about integrated circuits and microelectromechanical systems (MEMS) fabrication processes. Question 1 asks about (a) Gordon Moore's predictions for increasing computing productivity and cost, (b) classifications of integrated circuits based on circuit function, and (c) the differences between bulk micromachining, surface micromachining, and LIGA MEMS fabrication processes.
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Newdee6113 cmos
1. DEE6113 CMOS
FINAL EXAM JUN 2016
Question 1 (a),(b),(c)
JAMES ADEMS JELSON 07DEP14F1041
ROJHOS MICHAL 07DEP14F1044
JANSEN MARSHAL JUSTINUS 07DEP14F21
MATHEW PERRY LIM 07DEP14F1010
MOHD NOH BIN MATALI 07DEP14F1027
2. Question 1
a) state two(2) predictions made by Gordon E. Moore to
increase the productivity, cheap and computing .
states that processor speeds, or overall processing power for
computers will double every two years.
stated that the number of transistors on an affordable CPU would
double every two years
3. b) intergrated circuit (IC) can be classified into three categories which
are fabrication method,transistor type and circuit function Explain
intergrated circuit classification based on the circuit function
Analog circuits are circuits dealing with signals free to vary from zero
to full power supply voltage. This stands in contrast to digital circuits,
which almost exclusively employ all or nothing signals: voltages
restricted to values of zero and full supply voltage, with no valid state
in between those extreme limits.
Digital circuits are circuits dealing with signals restricted to the
extreme limits of zero and some full amount
4. c) differentiate between the three of MEMS fabricaton process (Bulk
micromachining, surface micromachining and LIGA.
Bulk micromachining
Can be done much faster
Can make high aspect ratio parts
Cheaper
surface micromachining
Mechanical properties of most thin- films are usually unknown and
must be measured
Reproducibility of mechanical properties can be difficult
More expensive
5. Lithographie Galvanoformung Abformung (LIGA)
Relatively new technology
Enables very high aspect ratio etches
Uses high density plasma to alternately etch and deposit etch
resistant polymer on sidewalls