3. IC built on silicon substrate:
some structures diffused into substrate;
other structures built on top of substrate.
Substrate regions are doped with n-type and
p-type impurities. (n+ = heavily doped)
Wires made of polycrystalline silicon (poly),
multiple layers of aluminum (metal).
Silicon dioxide (SiO2) is insulator.
16. Use 180 nm parameters. Let W/L = 3/2.
Measure at boundary between linear and
saturation regions.
Vgs = 0.7V:
Id = 0.5k(W/L)(Vgs-Vt)2= 5.3 A
Vgs = 1.2V:
Id = 62 A
17. Gate to substrate, also gate to source/drain.
Source/drain capacitance, resistance.
18. Gate capacitance Cg. Determined by active
area.
Source/drain overlap capacitances Cgs, Cgd.
Determined by source/gate and drain/gate
overlaps. Independent of transistor L.
Cgs = Col W
Gate/bulk overlap capacitance.
19. CMOS ICs have parastic silicon-controlled
rectifiers (SCRs).
When powered up, SCRs can turn on, creating
low-resistance path from power to ground.
Current can destroy chip.
Early CMOS problem. Can be solved with
proper circuit/layout structures.