Suraj prasad kushwaha
•Download as PPTX, PDF•
0 likes•57 views
The document outlines the company milestones of Kaynes Technology India Pvt. Ltd. from 1988 to 2016. It established in 1988 as an EMS company and grew over the years, obtaining certifications, expanding facilities, and increasing exports. It also introduces Suraj, who joined Kaynes in 2015 after diploma studies and works in production line, learning various processes like masking, hardware fixing, forming, stuffing, wave soldering, lead cutting, touch up, and functional circuit inspection.
Suraj prasad kushwaha
- 2. Company Milestone  1988- Established in 1988 as a sole proprietorship EMS company operating on a consignment model. Commenced operations in a small rented facility without any SMT line.  1991- Moved to a new 6000 sq ft facility in 1991 with an employee count of 35.  1995- Obtained ISO 9000 certification in 1995. Strengthened presence in domestic market.  2001- Grew to 80 people. Added a new SMT line and forayed into turnkey manufacturing. Started exports in 2001 and acquired first export client Analog Devices.  2004- Established 2nd manufacturing unit at Parwanoo, HP. Commenced exports to Europe and South East Asia. Established full fledged manufacturing line with SMT and TH assembly and upgraded facility at Mysore plant.  2015- Kaynes Approved as R&D center. ANSI/ESD S20.20 2007 and IEC 61340-5-1.0 2007-08 Certified MSIPZ approval for new facility.  2016- Obtained NADCAP certification for Mysore facility IT Exports Award under the category "High growth - Electronic Hardware
- 3. INTRODUCTIONI am Suraj. I have done Diploma in Electrical Engg. From Shaheed Bhagat Singh State Technical Campus in May 2015. I have joined Kaynes Technology India Pvt. Ltd. ( Himachal Pardesh) by campus placement in 16th November 2015 in production line in department of POWER ELECTRONICS.
- 4.  Masking  Hardware Fixing  Forming  Stuffing  Wave Soldering  Lead Cutting  Touch Up  Hand Soldering  FCI  FSI  Functional Testing  OQC  Packing  Boxes Tapping
- 5. Masking ï‚— There are two methods to fixing SMD Components i.e. i) By using Glue ii) By using Paste ï‚— Main purpose of masking is to protect SMD components during passing in wave solder in that PCB where paste are using. ï‚— Second purpose is to protect hole flow.
- 6. Stuffing ï‚— All TH Components are assemble in stuffing line. Some components have polarity so need to concentration to assemble in right direction. Forming ï‚— According to pitch and lead length
- 7. Wave Soldering ï‚— After assemble all TH components in stuffing line, it pass to wave solder for soldering purpose. There is 2 preheaters, a IR zone. Heat is divided in step by step by using preheaters and IR zone for prevention of components failure and then a solder pot is there and all components will be soldered.
- 8. Lead Cutting ï‚— In forming stage lead length of components is not equal so cutting stage is required. In cutting stage, according to requirement lead of components will trimming. Maskin is also removed in cutting stage.
- 9. Touch Up ï‚— After passing wave solder some components will not soldered properly. In touchup stage all soldering issue will
- 10. I have joined Kaynes as a Testing Engg. in the department of Power Electronics. After sometime I learnt Touch Up & Hand soldering by taking proper trainings. After that QA and Production Head give me training for FCI.