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TIm Hösel

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Themadagen

The document discusses optimizing process combinations for micro and nano manufacturing. It presents various shaping and replication techniques including lithography, micro milling, EDM, ECM, micro injection molding, hot embossing, and nanoimprint lithography. These techniques can be combined to leverage the advantages of each, for applications such as product anti-piracy and large-scale micro/nano integration. Examples are given of combining techniques like interference lithography with nanoimprint lithography or hot embossing to replicate nanostructures over large areas. The goal is to establish standardized process flows and in-process control for high-accuracy micro/nano manufacturing.

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Optimised Process Combination: Lithography, Micro Milling, EDM, ECM Tim Hösel, Dr. Claas Müller Laboratory for Process Technology Department of Microsystems Engineering - IMTEK University of Freiburg, Germany 18.05.2010 Tim Hösel - 2 - Introduction Motivation ƒ High demand of miniaturisation and large scale replication ƒ Silicon based processes ideal for micro and nano structuring ¾ Expensive cleanroom equipment necessary ƒ Shaping and replication with non-silicon based techniques ¾ High material flexibility ¾ Real 3-D structuring ¾ Accuracy critical Solution ƒ Combination of silicon with non-silicon processes leads to innovative process chains by using advantages of both
18.05.2010 Tim Hösel - 3 - Shaping methods Lithography ƒ Different pos./neg. resist systems ƒ SU-8 for high aspect ratio structuring ƒ Dry resists for multiple layer structuring ƒ Buried channels for micro fluidic devices ƒ Interference lithography for nano structuring Additive Subtractive 18.05.2010 Tim Hösel - 4 - Shaping methods Ultra Precision Milling (UPM) ƒ Turning, milling and fly-cutting ƒ Surface quality: Ra<10 nm ƒ Tool: shaped diamonds ƒ Materials: ¾ Nonferrous metals ¾ Semiconductors ¾ Polymers
18.05.2010 Tim Hösel - 5 - Ultra Precision Milling Examples ƒ Lens mould insert for hot embossing ƒ Freeform surface ƒ Spherical retroreflector (outer diameter 80 mm) Shaping methods 18.05.2010 Tim Hösel - 6 - Shaping methods Electrical Discharge Machining (EDM) ƒ Different technologies available ¾ Wire cutting (RoboFil2020) ¾ Sinking (RoboForm35) ¾ Milling (SARIX SA200HP) ƒ Research on nonconductive materials e.g. ZrO2 ƒ Micro structuring in non-conductive ZrO2 with AR>10
18.05.2010 Tim Hösel - 7 - Shaping methods Electro Chemical Machining (ECM) ƒ Anodic metal dissolving ƒ Tool: pre-machined metals, alloys ƒ Materials: ¾ Hardened steels ¾ Titan ¾ Alloys ƒ Minimizing tool geometry: ¾ Carbon fibres as tool (Ø < 10 µm) ƒ Minimizing gap size: ¾ Oscillating electrode (PECM) ƒ Sinking and wire cutting Funded by 18.05.2010 Tim Hösel - 8 - Replication methods Micro Injection Moulding (µIM) ƒ High throughput replication ƒ Battenfeld Microsystem 50 ƒ Materials: ¾ Thermoplastic polymers ¾ Thermoplastic elastomers ƒ Minimal part weight 0.01 mg ƒ Insert technique ƒ MIM, CIM possible 5 mm
18.05.2010 Tim Hösel - 9 - Replication methods Hot Embossing (HE) ƒ Large area replication for prototyping and small series production ƒ HEX04 unit from Jenoptik ¾ Sample diameter: up to 300 mm ¾ Tmax = 350°C ¾ Fpress ≤ 400kN ƒ Materials: ¾ Thermoplastic polymers ¾ Thermoplastic elastomers ƒ Beneficial for optics due to low internal stresses 18.05.2010 Tim Hösel - 10 - Replication methods Nano Imprint Lithography (NIL) ƒ Replication of micro and nano structures ƒ Large scale surface structuring via stamp technology ƒ Different strategies Nano Imprint Lithography (NIL) Hot Embossing Lithography (HEL) UV-NIL Micro Contact Printing (µ-CP) Hard Stamp (Si, SiO2, Ni…) Hard Stamp (fused silicon) Soft Stamp (PDMS) Soft Stamp (PDMS)
18.05.2010 Tim Hösel - 11 - Replication methods Nano Imprint Lithography (NIL) ƒ UV-light source for UV assisted polymerisation of e.g. laminates, monomer resist systems ¾ Developed by IMTEK Process Technology Innovated by Jenoptik ƒ Transparent tools e.g. SiO2, PDMS ƒ Nanostructures on large surfaces 100 mm 18.05.2010 Tim Hösel - 12 - Optimised process combination Minimizing tool size for ECM ƒ Standard silicon technology for micro and nano structuring of highly doped silicon tool ƒ Shaping of tool steel via ECM with silicon tool ƒ Micro structuring in hardened/tool steels for polymer replication or stamps ƒ Application: e.g. product protection against piracy ƒ IMTEK logo in tool steel with surface roughness Ra = 90 nm Patent pending400 µm 1 mm 1 mm
18.05.2010 Tim Hösel - 13 - Optimised process combination Combining HE and Interference lithography ƒ Fresnel lens cavity milled via UPM ƒ Replication via HE ƒ Resist structuring via interference lithography on structured lens surface ƒ Motheye-like structures on structured lens surface ƒ Casting of PDMS tool for replication ƒ Anti reflection structures on Fresnel lens 18.05.2010 Tim Hösel - 14 - Optimised process combination Combining Interference and Nano Imprint Lithography ƒ Large scale mastering by interference lithography for resist structuring ƒ Tool fabrication by casting of PDMS for NIL ƒ Large scale NIL of monomer with following UV polymerisation ƒ Nanostructures on large surfaces 10 mm 10 mm
18.05.2010 Tim Hösel - 15 - Summary ƒ Shaping and replication technologies established ƒ Micro / nano manufacturing, tooling and replication by combination of silicon and non-silicon technologies ƒ These combinations enable new fields of applications ¾ Product piracy ¾ Large scale micro/nano integration ƒ Approaches for process flow optimisation ¾ In-process and statistical process control ¾ Standardised clamping system for high accuracy on every equipment Thank you for your attention
18.05.2010 Tim Hösel - 17 - Optimised process combination High precision micro insert moulding ƒ Mould insert for multifunctional hybrid effector ƒ Combination of: ¾ Micro milling ¾ EDM wire cutting ¾ EDM sinking ƒ EROWA clamping system for all process steps ƒ Automated in-process measurements ƒ Overall accuracy of ±7 µm 3mm

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TIm Hösel

  • 1. Optimised Process Combination: Lithography, Micro Milling, EDM, ECM Tim Hösel, Dr. Claas Müller Laboratory for Process Technology Department of Microsystems Engineering - IMTEK University of Freiburg, Germany 18.05.2010 Tim Hösel - 2 - Introduction Motivation ƒ High demand of miniaturisation and large scale replication ƒ Silicon based processes ideal for micro and nano structuring ¾ Expensive cleanroom equipment necessary ƒ Shaping and replication with non-silicon based techniques ¾ High material flexibility ¾ Real 3-D structuring ¾ Accuracy critical Solution ƒ Combination of silicon with non-silicon processes leads to innovative process chains by using advantages of both
  • 2. 18.05.2010 Tim Hösel - 3 - Shaping methods Lithography ƒ Different pos./neg. resist systems ƒ SU-8 for high aspect ratio structuring ƒ Dry resists for multiple layer structuring ƒ Buried channels for micro fluidic devices ƒ Interference lithography for nano structuring Additive Subtractive 18.05.2010 Tim Hösel - 4 - Shaping methods Ultra Precision Milling (UPM) ƒ Turning, milling and fly-cutting ƒ Surface quality: Ra<10 nm ƒ Tool: shaped diamonds ƒ Materials: ¾ Nonferrous metals ¾ Semiconductors ¾ Polymers
  • 3. 18.05.2010 Tim Hösel - 5 - Ultra Precision Milling Examples ƒ Lens mould insert for hot embossing ƒ Freeform surface ƒ Spherical retroreflector (outer diameter 80 mm) Shaping methods 18.05.2010 Tim Hösel - 6 - Shaping methods Electrical Discharge Machining (EDM) ƒ Different technologies available ¾ Wire cutting (RoboFil2020) ¾ Sinking (RoboForm35) ¾ Milling (SARIX SA200HP) ƒ Research on nonconductive materials e.g. ZrO2 ƒ Micro structuring in non-conductive ZrO2 with AR>10
  • 4. 18.05.2010 Tim Hösel - 7 - Shaping methods Electro Chemical Machining (ECM) ƒ Anodic metal dissolving ƒ Tool: pre-machined metals, alloys ƒ Materials: ¾ Hardened steels ¾ Titan ¾ Alloys ƒ Minimizing tool geometry: ¾ Carbon fibres as tool (Ø < 10 µm) ƒ Minimizing gap size: ¾ Oscillating electrode (PECM) ƒ Sinking and wire cutting Funded by 18.05.2010 Tim Hösel - 8 - Replication methods Micro Injection Moulding (µIM) ƒ High throughput replication ƒ Battenfeld Microsystem 50 ƒ Materials: ¾ Thermoplastic polymers ¾ Thermoplastic elastomers ƒ Minimal part weight 0.01 mg ƒ Insert technique ƒ MIM, CIM possible 5 mm
  • 5. 18.05.2010 Tim Hösel - 9 - Replication methods Hot Embossing (HE) ƒ Large area replication for prototyping and small series production ƒ HEX04 unit from Jenoptik ¾ Sample diameter: up to 300 mm ¾ Tmax = 350°C ¾ Fpress ≤ 400kN ƒ Materials: ¾ Thermoplastic polymers ¾ Thermoplastic elastomers ƒ Beneficial for optics due to low internal stresses 18.05.2010 Tim Hösel - 10 - Replication methods Nano Imprint Lithography (NIL) ƒ Replication of micro and nano structures ƒ Large scale surface structuring via stamp technology ƒ Different strategies Nano Imprint Lithography (NIL) Hot Embossing Lithography (HEL) UV-NIL Micro Contact Printing (µ-CP) Hard Stamp (Si, SiO2, Ni…) Hard Stamp (fused silicon) Soft Stamp (PDMS) Soft Stamp (PDMS)
  • 6. 18.05.2010 Tim Hösel - 11 - Replication methods Nano Imprint Lithography (NIL) ƒ UV-light source for UV assisted polymerisation of e.g. laminates, monomer resist systems ¾ Developed by IMTEK Process Technology Innovated by Jenoptik ƒ Transparent tools e.g. SiO2, PDMS ƒ Nanostructures on large surfaces 100 mm 18.05.2010 Tim Hösel - 12 - Optimised process combination Minimizing tool size for ECM ƒ Standard silicon technology for micro and nano structuring of highly doped silicon tool ƒ Shaping of tool steel via ECM with silicon tool ƒ Micro structuring in hardened/tool steels for polymer replication or stamps ƒ Application: e.g. product protection against piracy ƒ IMTEK logo in tool steel with surface roughness Ra = 90 nm Patent pending400 µm 1 mm 1 mm
  • 7. 18.05.2010 Tim Hösel - 13 - Optimised process combination Combining HE and Interference lithography ƒ Fresnel lens cavity milled via UPM ƒ Replication via HE ƒ Resist structuring via interference lithography on structured lens surface ƒ Motheye-like structures on structured lens surface ƒ Casting of PDMS tool for replication ƒ Anti reflection structures on Fresnel lens 18.05.2010 Tim Hösel - 14 - Optimised process combination Combining Interference and Nano Imprint Lithography ƒ Large scale mastering by interference lithography for resist structuring ƒ Tool fabrication by casting of PDMS for NIL ƒ Large scale NIL of monomer with following UV polymerisation ƒ Nanostructures on large surfaces 10 mm 10 mm
  • 8. 18.05.2010 Tim Hösel - 15 - Summary ƒ Shaping and replication technologies established ƒ Micro / nano manufacturing, tooling and replication by combination of silicon and non-silicon technologies ƒ These combinations enable new fields of applications ¾ Product piracy ¾ Large scale micro/nano integration ƒ Approaches for process flow optimisation ¾ In-process and statistical process control ¾ Standardised clamping system for high accuracy on every equipment Thank you for your attention
  • 9. 18.05.2010 Tim Hösel - 17 - Optimised process combination High precision micro insert moulding ƒ Mould insert for multifunctional hybrid effector ƒ Combination of: ¾ Micro milling ¾ EDM wire cutting ¾ EDM sinking ƒ EROWA clamping system for all process steps ƒ Automated in-process measurements ƒ Overall accuracy of ±7 µm 3mm