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TransPAC2 Workplan - Engineering (v7.5)

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International Networking at Indiana University
International Networking at Indiana University

The document provides an engineering work plan for the TransPAC2 Project from 2007-2009. Key points include: - TransPAC2 will maintain a production network connection between North America and Asia, and assist in developing intra-Asian circuits. - The project will focus on supporting the existing trans-oceanic circuit while evaluating next generation technologies. - TransPAC2 will continue collaborating with projects like Internet2, HOPI, OSCARS and CHEETAH. - The work plan outlines the current network topology and status, and plans to expand intra-Asian connectivity to Hong Kong and Singapore. - TransPAC2 will cooperate with projects like TEIN2 and work on global routing

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Version 7.5 3/13/2011 TransPAC2 Engineering Work Plan 2007-2009 Prepared by Chris Robb Introduction The TransPAC2 Project Team will implement and maintain a production network connection between North America and Asia. In addition, the project will continue to develop existing relationships with Asian countries and assist in the development, configuration and installation of intra-Asian circuits to further increase the reach of TransPAC2's connectivity. While the TransPAC2 engineering staff and leadership will continually coordinate with other IRNC projects, the National Science Foundation, and the major R&E organizations on both continents to evaluate and offer additional network services, these activities will not be undertaken at the expense of the production quality of the network. With regard to the trans-oceanic circuit, the next two years of the project will focus on continuing the level of production support, as exemplified by the initial TransPAC project, while continuing to evaluate next generation technologies. The Project will continue to collaborate closely with the Internet2 HOPI project. This cooperation may expand to other lightpath research projects such as OSCARS1 and CHEETAH2. The TransAPC2 network has been stable from an engineering perspective since WorkPlan 7.0. Figure 1 APAN Backbone Topology as of 1 June 2005 [Diagram Courtesy of APAN-JP NOC] 1 http://www.es.net/oscars/ 2 http://cheetah.cs.virginia.edu/
Version 7.5 3/13/2011 TransPAC2 Current Status [as of 15 November 2007] TransPac2 US-Japan Connectivity The current TransPAC OC-192 between Tokyo and Los Angeles was upgraded from an OC 48 circuit in April of 2005. Indiana University entered into a two year contract with KDDI- America, the domestic division of international circuit provider KDDI, to provide OC-192 SONET service from the Otemachi building in Tokyo to 626 Wilshire Blvd. in Los Angeles. In order to provide as much bandwidth to the TransPAC2 project as possible, while keeping costs to a minimum, the OC-192 circuit was provisioned at an unprotected service level. Indiana University has entered into agreements with Japanese networks NII (National Institute of Informatics) and JGN2 (Japanese Gigabit Network) to provide mutual backup service in the event of a TransPAC2 circuit outage. KDDI-A has agreed to provision the JGN2 circuit and the TransPAC2 circuit as separate sides of the same trans-oceanic ring. Given the backup peering agreements, the net result is a continual exchange of Asian Pacific routes with the United States. In mid April 2005, TransPAC2 engineers installed a Juniper T320 router in Los Angeles to be dedicated to the TransPAC2 project. It is located in the KDDI-A collocation facility at 626 Wilshire Boulevard. The TransPAC2 circuit to Tokyo connects to this router. The diagram below illustrates the current connectivity topology in Los Angeles. Figure 2: TransPAC Topology in Los Angeles
Version 7.5 3/13/2011 To provide US connectivity, the TransPAC2 router maintains a 10 Gigabit Ethernet connection to the Pacific Wave facility at 1 Wilshire Blvd in Los Angeles. The Pacific Wave infrastructure provides a distributed peering fabric along the US west coast between Seattle and Los Angeles. The TransPAC2 router is one of many networks connected to the Pacific Wave exchange point. Through bilateral peering agreements with other US R&E networks connected to the Pacific Wave, the TransPAC2 router obtains routes to US domestic and international networks. This set of networks includes direct layer2 connectivity to the majority of US Federal networks. For a complete list of Pacific Wave participants, please visit their webpage3. The TransPAC2 router in Los Angeles provides production level IPv4 and Ipv6 unicast and multicast service between the US and Asia. Most US and international connectivity comes from two Abilene peerings across PacWave, though direct peerings with networks connected to Pacific Wave will be preferred over Abilene transit. TransPAC2 engineers are continuing to negotiate new peerings with other networks connected to Pacific Wave. In late February 2006, TransPAC2 expanded upon its existing cooperation with the Japanese Gigabit Network 2 (JGN2). In early 2006, NICT purchased a 10GigE switch from Force10 Networks to be placed in Los Angeles. This switch was be inserted into the existing JGN2 Tokyo-Chicago OC-192 circuit. NICT manages and operates the switch in close collaboration with the TransPAC2 project. Shortly after the JGN2 installation Transpac2 engineers installed an additional 6-port 10Gbps capable Hewlett Packard switch in the TransPAC2 rack in Los Angeles. This provided additional 10G ports to interconnect with a newly-installed JGN2 switch. This 10G interconnect provides more robust and rapid link redundancy given the bandwidth protection configuration of the transpacific portions of the JGN2 and TransPAC2 circuits. 3 http://www.pacificwave.net/participants.html
Version 7.5 3/13/2011 Figure 3: TransPAC2 Network Topology In addition to the network equipment involved in the direct support of the network laid out above, TransPAC2 has an additional, adjacent rack in Los Angeles to provide expansion capabilities as the TransPAC2 network evolves. Intra-Asian Circuits During PY01, TransPAC2 leadership and engineering collaborated with Asian Pacific leadership to expand connectivity between Japan and Hong Kong The National Institute of Information and Communications Technology (NICT) operates an OC-48 circuit between Tokyo and Hong Kong. This circuit, is terminated onto a Cisco 15454 SONET chassis in both Hong Kong and Tokyo The OC-48 circuit carries two Gigabit Ethernet circuits connecting the Tokyo XP with both the CNGI and HKLight exchange points.
Version 7.5 3/13/2011 Figure 4: TransPAC2 and new Asian circuits to Hong Kong and Singapore Work Plan 2008 During the third year of operations, the TransPAC2 project will continue to build out the network infrastructure in Los Angeles as well as help in the engineering and routing policy of the new intra-Asian circuits to Hong Kong and Singapore. An RFP for circuit and collocation services was released in late 2007. While the baseline IP service is expected to transition to a potential new carrier, there may also be an expansion of services, as allowed for under the project cost constraints and carrier responses. TEIN2 Collaboration TransPAC2 will continue to cooperate closely with the European-Union Funded TEIN2 project linking up Europe with the traditionally underrepresented countries of Southeastern Asia. The TEIN2 network, illustrated below in Figure 5, will interconnect with the APAN network at the Tokyo XP and exchange between APAN and the TEIN2 networks. In addition, the TransPAC2 will provide the primary transit between TEIN2 networks and US R&E networks.
Version 7.5 3/13/2011 Figure 5: TEIN2 Planned Backbone Topology TransPAC2 continues to participate in discussions with a number of groups including Internet2, the World Bank and representatives of Ernet (the Indian high-performance network) regarding a possible connection from Singapore to Mumbai on the Indian West Coast. Global Routing Collaboration With the recent expansion in international connectivity between the Americas, Europe and Asia, there has been an increased focus on the most optimal paths between R&E networks. With the unprecedented number of trans-oceanic circuits of varying bandwidth and latency, the R&E interconnection landscape is particularly ad-hoc and unfocused. TransPAC2 will join Internet2 and the NSF in taking a leadership role in the coordinated sets of discussions that will occur during FY02. The initial goal will be a sweeping survey of the transit policies of the major international R&E networks. Collaborators on this project are likely to include the RouteViews project as well as the Computer Networks Research Group at Roma Tre University and CAIDA. It is likely that this will ultimately lead to a re-evaluation and re-engineering of the routing policies of several significant R&E transit providers. International routing was discussed in detail at the APAN22 meeting in Sinagpore. Please see: http://www.apan.net/meetings/singapore2006/proposals/APAN-Routing.html. Additionally, TransPAC2 and GLORIAD are preparing a White Paper for discussion at the IRNC Review in October in Washington, DC. There will be a follow-up meeting in Chicago at the Internet2 meeting.
Version 7.5 3/13/2011 RENOG TransPAC2, in collaboration with Internet2 and other IRNC projects, will provide leadership in the formation of a Research and Education Network Operators Group (RENOG) as part of a global effort to link engineers in the R&E networking space. Given the sets of dynamics laid out in a TransPAC2 presentation given at the 2006 Spring Internet2 Members Meeting4, many members of the community believe a grass-roots, engineer-driven group would be of benefit to the community. TransPAC2 and Internet2 will collaborate on the creation of a RENOG charter, website, mailing list, and other collaborative tools. The first announcements were made to the JET and CCIRN groups in mid May. Intra-Asian Circuit TransPAC2 engineers will continue to work with the Asian Pacific community to explore new opportunities for connectivity, or optimization and expansion of existing connectivity. Project leadership and engineering will open dialogue with research and education networks in the Indian sub-continent and explore new circuit possibilities where none exist today. In addition, there will be considerable effort to expand bandwidth between Asia, Pakistan and India during the second project year in cooperation with the TEIN2/TEIN3 Project. 4 http://transpac.org/presentations/2006/International%20R&E%20Peering%20v1.1.pdf

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TransPAC2 Workplan - Engineering (v7.5)

  • 1. Version 7.5 3/13/2011 TransPAC2 Engineering Work Plan 2007-2009 Prepared by Chris Robb Introduction The TransPAC2 Project Team will implement and maintain a production network connection between North America and Asia. In addition, the project will continue to develop existing relationships with Asian countries and assist in the development, configuration and installation of intra-Asian circuits to further increase the reach of TransPAC2's connectivity. While the TransPAC2 engineering staff and leadership will continually coordinate with other IRNC projects, the National Science Foundation, and the major R&E organizations on both continents to evaluate and offer additional network services, these activities will not be undertaken at the expense of the production quality of the network. With regard to the trans-oceanic circuit, the next two years of the project will focus on continuing the level of production support, as exemplified by the initial TransPAC project, while continuing to evaluate next generation technologies. The Project will continue to collaborate closely with the Internet2 HOPI project. This cooperation may expand to other lightpath research projects such as OSCARS1 and CHEETAH2. The TransAPC2 network has been stable from an engineering perspective since WorkPlan 7.0. Figure 1 APAN Backbone Topology as of 1 June 2005 [Diagram Courtesy of APAN-JP NOC] 1 http://www.es.net/oscars/ 2 http://cheetah.cs.virginia.edu/
  • 2. Version 7.5 3/13/2011 TransPAC2 Current Status [as of 15 November 2007] TransPac2 US-Japan Connectivity The current TransPAC OC-192 between Tokyo and Los Angeles was upgraded from an OC 48 circuit in April of 2005. Indiana University entered into a two year contract with KDDI- America, the domestic division of international circuit provider KDDI, to provide OC-192 SONET service from the Otemachi building in Tokyo to 626 Wilshire Blvd. in Los Angeles. In order to provide as much bandwidth to the TransPAC2 project as possible, while keeping costs to a minimum, the OC-192 circuit was provisioned at an unprotected service level. Indiana University has entered into agreements with Japanese networks NII (National Institute of Informatics) and JGN2 (Japanese Gigabit Network) to provide mutual backup service in the event of a TransPAC2 circuit outage. KDDI-A has agreed to provision the JGN2 circuit and the TransPAC2 circuit as separate sides of the same trans-oceanic ring. Given the backup peering agreements, the net result is a continual exchange of Asian Pacific routes with the United States. In mid April 2005, TransPAC2 engineers installed a Juniper T320 router in Los Angeles to be dedicated to the TransPAC2 project. It is located in the KDDI-A collocation facility at 626 Wilshire Boulevard. The TransPAC2 circuit to Tokyo connects to this router. The diagram below illustrates the current connectivity topology in Los Angeles. Figure 2: TransPAC Topology in Los Angeles
  • 3. Version 7.5 3/13/2011 To provide US connectivity, the TransPAC2 router maintains a 10 Gigabit Ethernet connection to the Pacific Wave facility at 1 Wilshire Blvd in Los Angeles. The Pacific Wave infrastructure provides a distributed peering fabric along the US west coast between Seattle and Los Angeles. The TransPAC2 router is one of many networks connected to the Pacific Wave exchange point. Through bilateral peering agreements with other US R&E networks connected to the Pacific Wave, the TransPAC2 router obtains routes to US domestic and international networks. This set of networks includes direct layer2 connectivity to the majority of US Federal networks. For a complete list of Pacific Wave participants, please visit their webpage3. The TransPAC2 router in Los Angeles provides production level IPv4 and Ipv6 unicast and multicast service between the US and Asia. Most US and international connectivity comes from two Abilene peerings across PacWave, though direct peerings with networks connected to Pacific Wave will be preferred over Abilene transit. TransPAC2 engineers are continuing to negotiate new peerings with other networks connected to Pacific Wave. In late February 2006, TransPAC2 expanded upon its existing cooperation with the Japanese Gigabit Network 2 (JGN2). In early 2006, NICT purchased a 10GigE switch from Force10 Networks to be placed in Los Angeles. This switch was be inserted into the existing JGN2 Tokyo-Chicago OC-192 circuit. NICT manages and operates the switch in close collaboration with the TransPAC2 project. Shortly after the JGN2 installation Transpac2 engineers installed an additional 6-port 10Gbps capable Hewlett Packard switch in the TransPAC2 rack in Los Angeles. This provided additional 10G ports to interconnect with a newly-installed JGN2 switch. This 10G interconnect provides more robust and rapid link redundancy given the bandwidth protection configuration of the transpacific portions of the JGN2 and TransPAC2 circuits. 3 http://www.pacificwave.net/participants.html
  • 4. Version 7.5 3/13/2011 Figure 3: TransPAC2 Network Topology In addition to the network equipment involved in the direct support of the network laid out above, TransPAC2 has an additional, adjacent rack in Los Angeles to provide expansion capabilities as the TransPAC2 network evolves. Intra-Asian Circuits During PY01, TransPAC2 leadership and engineering collaborated with Asian Pacific leadership to expand connectivity between Japan and Hong Kong The National Institute of Information and Communications Technology (NICT) operates an OC-48 circuit between Tokyo and Hong Kong. This circuit, is terminated onto a Cisco 15454 SONET chassis in both Hong Kong and Tokyo The OC-48 circuit carries two Gigabit Ethernet circuits connecting the Tokyo XP with both the CNGI and HKLight exchange points.
  • 5. Version 7.5 3/13/2011 Figure 4: TransPAC2 and new Asian circuits to Hong Kong and Singapore Work Plan 2008 During the third year of operations, the TransPAC2 project will continue to build out the network infrastructure in Los Angeles as well as help in the engineering and routing policy of the new intra-Asian circuits to Hong Kong and Singapore. An RFP for circuit and collocation services was released in late 2007. While the baseline IP service is expected to transition to a potential new carrier, there may also be an expansion of services, as allowed for under the project cost constraints and carrier responses. TEIN2 Collaboration TransPAC2 will continue to cooperate closely with the European-Union Funded TEIN2 project linking up Europe with the traditionally underrepresented countries of Southeastern Asia. The TEIN2 network, illustrated below in Figure 5, will interconnect with the APAN network at the Tokyo XP and exchange between APAN and the TEIN2 networks. In addition, the TransPAC2 will provide the primary transit between TEIN2 networks and US R&E networks.
  • 6. Version 7.5 3/13/2011 Figure 5: TEIN2 Planned Backbone Topology TransPAC2 continues to participate in discussions with a number of groups including Internet2, the World Bank and representatives of Ernet (the Indian high-performance network) regarding a possible connection from Singapore to Mumbai on the Indian West Coast. Global Routing Collaboration With the recent expansion in international connectivity between the Americas, Europe and Asia, there has been an increased focus on the most optimal paths between R&E networks. With the unprecedented number of trans-oceanic circuits of varying bandwidth and latency, the R&E interconnection landscape is particularly ad-hoc and unfocused. TransPAC2 will join Internet2 and the NSF in taking a leadership role in the coordinated sets of discussions that will occur during FY02. The initial goal will be a sweeping survey of the transit policies of the major international R&E networks. Collaborators on this project are likely to include the RouteViews project as well as the Computer Networks Research Group at Roma Tre University and CAIDA. It is likely that this will ultimately lead to a re-evaluation and re-engineering of the routing policies of several significant R&E transit providers. International routing was discussed in detail at the APAN22 meeting in Sinagpore. Please see: http://www.apan.net/meetings/singapore2006/proposals/APAN-Routing.html. Additionally, TransPAC2 and GLORIAD are preparing a White Paper for discussion at the IRNC Review in October in Washington, DC. There will be a follow-up meeting in Chicago at the Internet2 meeting.
  • 7. Version 7.5 3/13/2011 RENOG TransPAC2, in collaboration with Internet2 and other IRNC projects, will provide leadership in the formation of a Research and Education Network Operators Group (RENOG) as part of a global effort to link engineers in the R&E networking space. Given the sets of dynamics laid out in a TransPAC2 presentation given at the 2006 Spring Internet2 Members Meeting4, many members of the community believe a grass-roots, engineer-driven group would be of benefit to the community. TransPAC2 and Internet2 will collaborate on the creation of a RENOG charter, website, mailing list, and other collaborative tools. The first announcements were made to the JET and CCIRN groups in mid May. Intra-Asian Circuit TransPAC2 engineers will continue to work with the Asian Pacific community to explore new opportunities for connectivity, or optimization and expansion of existing connectivity. Project leadership and engineering will open dialogue with research and education networks in the Indian sub-continent and explore new circuit possibilities where none exist today. In addition, there will be considerable effort to expand bandwidth between Asia, Pakistan and India during the second project year in cooperation with the TEIN2/TEIN3 Project. 4 http://transpac.org/presentations/2006/International%20R&E%20Peering%20v1.1.pdf