The document presents detailed information about hybrid Time Delay and Integration (TDI) cameras, highlighting their technical features, applications, and advantages over traditional CCD and CMOS sensors. Hybrid TDI technology combines the sensitivity of CCD with the low power consumption and fast readout capabilities of CMOS, making it suitable for high-speed imaging in various applications like semiconductor inspection and high-resolution scanning. Additionally, the document includes specifications and comparisons of Vieworks' TDI camera lineup, emphasizing their high performance and efficiency.