This document discusses the format war between Blu-ray and HD DVD high-definition optical disc technologies. Both formats claim to be the successor to DVDs, but Blu-ray has greater storage capacity and support from major movie studios. While the formats are similar in performance, Blu-ray may win due to its larger content library and integration with the PlayStation 3 gaming console. Alternative options like dual-format discs and streaming could also replace DVDs as the dominant distribution method for movies.
To restrict access to a wireless network using a password and MAC address filtering:
1. Log into the router at 192.168.1.1 with the default username and password of "admin", enable WEP security, and set a password.
2. Find the MAC addresses of allowed clients by viewing connected devices.
3. Enable the access list, select "allow" and add the MAC addresses, then apply the new configuration.
Location Based System For Mobile Devices Using Rfidvein
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This document summarizes a location-based system for mobile devices using RFID technology. The system uses a Java application on a mobile phone with an attached RFID reader to locate the user's position in a building based on fixed RFID tags. The system architecture is presented along with related work in other location-based systems using radio signal strength analysis or fixed RFID readers. Screenshots of a mobile emulator executing the application are also shown. In conclusion, the presented system was able to accurately locate users and send them information based on their location and interests.
Common Sense Based Joint Training Of Human Activity Recogizersvein
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This document outlines a study that presents a joint probabilistic model to improve activity detection by reasoning about object use, physical actions, and activities together. Sensors collected data from researchers performing 12 activities using 30 objects over 2 weeks. A dynamic Bayesian network model was used to infer the current action and object being used from the sensor data. Results showed the joint model produced better activity detection than models reasoning separately about object use, actions, and activities, and learned action models with less labeling than conventional approaches.
The document discusses different types of transmission media used in data communication networks, including guided media like twisted-pair cable, coaxial cable, and fiber-optic cable, as well as unguided or wireless media. It describes the key characteristics of each medium, such as how they transmit signals, their bandwidth capabilities, and advantages and disadvantages. The document also covers switching methods used in networks, including circuit switching, packet switching, and message switching, explaining how circuit-switched networks establish dedicated connections between nodes using time- or frequency-division multiplexing.
Dr. A.T. Kalghatgi gave a seminar on Ultra Wideband (UWB) technology and its applications. He discussed how UWB uses very short pulse transmissions which provide advantages like being immune to multipath fading, having high data transfer potential, and allowing many devices to operate simultaneously without interference. He then explained key UWB concepts, compared it to other wireless technologies, reviewed its regulatory definition and applications in areas like communications, radar, and asset tracking. Challenges in UWB design and adoption were also summarized such as coexistence with other systems, receiver complexity, and global spectrum harmonization.
The document discusses layout design rules for integrated circuits. It provides guidelines for feature sizes and spacings to ensure fabricated circuits meet intended designs. This includes minimum line widths, separations between layers, and allowances for misalignment. The document also notes two key checks that must be completed to validate a mask design: a design rule check to verify rules are followed, and circuit extraction to confirm masks produce the correct interconnected circuit.
The document discusses power factor correction and reactive power compensation. It mentions issues like reactive power burden, high harmonic currents, unbalanced loads, and excessive neutral currents. It also discusses different reactive power compensation techniques like thyristor controlled reactor, thyristor switched capacitor, static VAR compensator, and advanced static VAR compensator. The document recommends checking www.techalone.com for seminar and paper presentation topics on electrical engineering issues like power factor correction, harmonics compensation, load balancing, voltage regulation, and neutral current compensation.
Global warming is caused by the increasing levels of greenhouse gases like carbon dioxide and methane in the atmosphere from human activities such as the burning of fossil fuels and agriculture. This has led to increased global surface temperatures and more extreme weather events. Some of the impacts of global warming include rising sea levels, worsening air pollution and heat waves, changing rain patterns impacting food supply, and increased wildfires and pest outbreaks. Governments and individuals need to take actions like transitioning to renewable energy and reducing emissions to control the problem of global warming.
you can be friend with me on orkut
"mangalforyou@gmail.com" : i belive in sharing the knowledge so please send project reports ,seminar and ppt. to me .
1. The document discusses the process for designing and fabricating analog integrated circuits using CMOS technology. It covers topics like MOS transistor operation, CMOS fabrication process steps, and SPICE device modeling parameters.
2. The CMOS fabrication process involves growing gate oxides, depositing polysilicon gates, implanting sources and drains, and depositing multiple metal interconnect layers.
3. SPICE device models are needed to simulate the behavior of transistors and circuits during the design process prior to fabrication. Device parameters are provided for a 0.8 micron CMOS process.
Circuit switch telecommunication networkmangal das
?
This document summarizes the structure and components of the traditional telephone network, including exchanges, signaling systems, trunk lines, and hierarchies like PDH and SDH. It discusses the overall network architecture with analog and digital switches connected by various types of trunk lines. Signaling systems have evolved from SS1 to SS7 to support intelligent network services. SDH/SONET networks employ synchronous multiplexing in optical networks to transport telephone calls in digital formats. Bibliographies are also provided to learn more about digital telephony and SDH/SONET networks.
1. Students designed a half adder circuit using L-edit software to combine an XOR gate and an AND gate.
2. A half adder adds two binary digits and produces a sum and carry output. The sum is calculated with an XOR gate while the carry uses an AND gate.
3. The students first designed individual XOR and AND gates meeting design rules before connecting them in a half adder cell to produce a working half adder circuit.
The document discusses stick diagrams and design rules for VLSI layout. It begins by explaining stick diagrams, which provide topological information to represent circuits between the schematic and layout levels. Examples of stick diagrams for CMOS inverters and other gates are shown. The document then covers design rules, which specify geometries and spacing to optimize yield and reliability. Examples of minimum widths, spacings, and other rules are discussed. The end discusses layout verification using techniques like DRC, LVS, and extraction to check for errors and ensure consistency between schematic and layout.
The document discusses circuit design processes and stick diagrams. It begins by introducing MOS layers and objectives of understanding stick diagrams, design rules, and layout. It then covers stick diagrams in depth, explaining that they show relative component placement and layer information through color codes as an interface between symbolic circuits and layouts. Examples of stick diagram rules, notations, and common MOS circuits are provided. Finally, it discusses design rules, explaining that they define feature sizes and spacings to interface between circuits and fabrication processes while allowing for manufacturing tolerances.
This document provides an overview of an "Analog VLSI Design" course. The goals of the course are to introduce principles of analog integrated circuit design and CMOS technology. Students will learn about CMOS layout design using CAD tools and complete a design project. The course covers topics including CMOS technology, resistors, capacitors, MOSFETs, current mirrors, amplifiers, and data converters. Assessment includes homework, a project, and a final exam.
The document describes the CMOS design and fabrication process. Key points include:
- CMOS uses complementary n-type and p-type MOS transistors to reduce power consumption.
- Transistors are built on a silicon substrate using dopants to create n-type and p-type regions. PN junctions form diodes and MOS capacitors.
- The CMOS fabrication process involves layering and patterning of silicon, oxides, and metals through steps like oxidation, lithography, etching, and doping.
This document discusses multiple access protocols for wireless networks. It begins by describing random access protocols like ALOHA and slotted ALOHA. It then covers controlled access protocols using reservation, polling, and token passing. Finally, it discusses channelization protocols using frequency division multiple access (FDMA), time division multiple access (TDMA), and code division multiple access (CDMA). Throughout are examples calculating throughput for different access loads and determining minimum frame sizes.
The document provides an overview of analog layout design. It discusses that analog circuits require careful attention to geometry during layout due to process variations. The analog design flow includes electrical design, physical design involving layout, and fabrication/testing. Key considerations for analog layout include minimizing parasitic resistances and capacitances, reducing noise, and ensuring matching between identical components using techniques like common-centroid layout. Resistors and capacitors must be carefully laid out to minimize non-ideal effects and provide accurate values.
This document discusses circuit design processes, specifically stick diagrams and design rules. It provides objectives and outcomes for understanding stick diagrams, which convey layer information through color codes. Stick diagrams show relative component placement but not exact sizes or parasitics. The document defines rules for stick diagrams and provides examples. It also discusses lambda-based design rules that define minimum widths and spacings to prevent shorts and allows scalability. Design rules provide a compromise between designers wanting smaller sizes and fabricators requiring controllability.
Insulated Gate Bipolar Transistors (IGBTs) are power semiconductor devices that have advantages of both MOSFETs and BJTs. IGBTs have lower conduction losses than BJTs and can block higher voltages than MOSFETs. The document discusses the construction, operation, and modeling of IGBTs. It covers the multi-cell structure of IGBTs, their blocking and on-state operations, equivalent circuits, and I-V characteristics. SPICE simulation models were also developed for IGBTs.
The document discusses different types of transmission media used in data communication networks, including guided media like twisted-pair cable, coaxial cable, and fiber-optic cable, as well as unguided or wireless media. It describes the key characteristics of each medium, such as how they transmit signals, their bandwidth capabilities, and advantages and disadvantages. The document also covers switching methods used in networks, including circuit switching, packet switching, and message switching, explaining how circuit-switched networks establish dedicated connections between nodes using time- or frequency-division multiplexing.
Dr. A.T. Kalghatgi gave a seminar on Ultra Wideband (UWB) technology and its applications. He discussed how UWB uses very short pulse transmissions which provide advantages like being immune to multipath fading, having high data transfer potential, and allowing many devices to operate simultaneously without interference. He then explained key UWB concepts, compared it to other wireless technologies, reviewed its regulatory definition and applications in areas like communications, radar, and asset tracking. Challenges in UWB design and adoption were also summarized such as coexistence with other systems, receiver complexity, and global spectrum harmonization.
The document discusses layout design rules for integrated circuits. It provides guidelines for feature sizes and spacings to ensure fabricated circuits meet intended designs. This includes minimum line widths, separations between layers, and allowances for misalignment. The document also notes two key checks that must be completed to validate a mask design: a design rule check to verify rules are followed, and circuit extraction to confirm masks produce the correct interconnected circuit.
The document discusses power factor correction and reactive power compensation. It mentions issues like reactive power burden, high harmonic currents, unbalanced loads, and excessive neutral currents. It also discusses different reactive power compensation techniques like thyristor controlled reactor, thyristor switched capacitor, static VAR compensator, and advanced static VAR compensator. The document recommends checking www.techalone.com for seminar and paper presentation topics on electrical engineering issues like power factor correction, harmonics compensation, load balancing, voltage regulation, and neutral current compensation.
Global warming is caused by the increasing levels of greenhouse gases like carbon dioxide and methane in the atmosphere from human activities such as the burning of fossil fuels and agriculture. This has led to increased global surface temperatures and more extreme weather events. Some of the impacts of global warming include rising sea levels, worsening air pollution and heat waves, changing rain patterns impacting food supply, and increased wildfires and pest outbreaks. Governments and individuals need to take actions like transitioning to renewable energy and reducing emissions to control the problem of global warming.
you can be friend with me on orkut
"mangalforyou@gmail.com" : i belive in sharing the knowledge so please send project reports ,seminar and ppt. to me .
1. The document discusses the process for designing and fabricating analog integrated circuits using CMOS technology. It covers topics like MOS transistor operation, CMOS fabrication process steps, and SPICE device modeling parameters.
2. The CMOS fabrication process involves growing gate oxides, depositing polysilicon gates, implanting sources and drains, and depositing multiple metal interconnect layers.
3. SPICE device models are needed to simulate the behavior of transistors and circuits during the design process prior to fabrication. Device parameters are provided for a 0.8 micron CMOS process.
Circuit switch telecommunication networkmangal das
?
This document summarizes the structure and components of the traditional telephone network, including exchanges, signaling systems, trunk lines, and hierarchies like PDH and SDH. It discusses the overall network architecture with analog and digital switches connected by various types of trunk lines. Signaling systems have evolved from SS1 to SS7 to support intelligent network services. SDH/SONET networks employ synchronous multiplexing in optical networks to transport telephone calls in digital formats. Bibliographies are also provided to learn more about digital telephony and SDH/SONET networks.
1. Students designed a half adder circuit using L-edit software to combine an XOR gate and an AND gate.
2. A half adder adds two binary digits and produces a sum and carry output. The sum is calculated with an XOR gate while the carry uses an AND gate.
3. The students first designed individual XOR and AND gates meeting design rules before connecting them in a half adder cell to produce a working half adder circuit.
The document discusses stick diagrams and design rules for VLSI layout. It begins by explaining stick diagrams, which provide topological information to represent circuits between the schematic and layout levels. Examples of stick diagrams for CMOS inverters and other gates are shown. The document then covers design rules, which specify geometries and spacing to optimize yield and reliability. Examples of minimum widths, spacings, and other rules are discussed. The end discusses layout verification using techniques like DRC, LVS, and extraction to check for errors and ensure consistency between schematic and layout.
The document discusses circuit design processes and stick diagrams. It begins by introducing MOS layers and objectives of understanding stick diagrams, design rules, and layout. It then covers stick diagrams in depth, explaining that they show relative component placement and layer information through color codes as an interface between symbolic circuits and layouts. Examples of stick diagram rules, notations, and common MOS circuits are provided. Finally, it discusses design rules, explaining that they define feature sizes and spacings to interface between circuits and fabrication processes while allowing for manufacturing tolerances.
This document provides an overview of an "Analog VLSI Design" course. The goals of the course are to introduce principles of analog integrated circuit design and CMOS technology. Students will learn about CMOS layout design using CAD tools and complete a design project. The course covers topics including CMOS technology, resistors, capacitors, MOSFETs, current mirrors, amplifiers, and data converters. Assessment includes homework, a project, and a final exam.
The document describes the CMOS design and fabrication process. Key points include:
- CMOS uses complementary n-type and p-type MOS transistors to reduce power consumption.
- Transistors are built on a silicon substrate using dopants to create n-type and p-type regions. PN junctions form diodes and MOS capacitors.
- The CMOS fabrication process involves layering and patterning of silicon, oxides, and metals through steps like oxidation, lithography, etching, and doping.
This document discusses multiple access protocols for wireless networks. It begins by describing random access protocols like ALOHA and slotted ALOHA. It then covers controlled access protocols using reservation, polling, and token passing. Finally, it discusses channelization protocols using frequency division multiple access (FDMA), time division multiple access (TDMA), and code division multiple access (CDMA). Throughout are examples calculating throughput for different access loads and determining minimum frame sizes.
The document provides an overview of analog layout design. It discusses that analog circuits require careful attention to geometry during layout due to process variations. The analog design flow includes electrical design, physical design involving layout, and fabrication/testing. Key considerations for analog layout include minimizing parasitic resistances and capacitances, reducing noise, and ensuring matching between identical components using techniques like common-centroid layout. Resistors and capacitors must be carefully laid out to minimize non-ideal effects and provide accurate values.
This document discusses circuit design processes, specifically stick diagrams and design rules. It provides objectives and outcomes for understanding stick diagrams, which convey layer information through color codes. Stick diagrams show relative component placement but not exact sizes or parasitics. The document defines rules for stick diagrams and provides examples. It also discusses lambda-based design rules that define minimum widths and spacings to prevent shorts and allows scalability. Design rules provide a compromise between designers wanting smaller sizes and fabricators requiring controllability.
Insulated Gate Bipolar Transistors (IGBTs) are power semiconductor devices that have advantages of both MOSFETs and BJTs. IGBTs have lower conduction losses than BJTs and can block higher voltages than MOSFETs. The document discusses the construction, operation, and modeling of IGBTs. It covers the multi-cell structure of IGBTs, their blocking and on-state operations, equivalent circuits, and I-V characteristics. SPICE simulation models were also developed for IGBTs.
2. K? ho?ch th?c hi?n ?? t¨¤i T?ng quan VoIP Xem x¨¦t c¨¢c y?u t? c?u th¨¤nh VoIP ??nh tuy?n cu?c g?i qua c?ng Analog Voice Th?c hi?n ph¨¢t t¨ªn hi?u tho?i qua c?ng Digital Voice Kh?o s¨¢t VoIP Gateways v¨¤ Gateway Control Protocols
3. K? ho?ch th?c hi?n ?? t¨¤i X¨¢c ??nh c¨¢c ??c t¨ªnh c?a Dial Plan C?u h¨¬nh n?ng cao Dial Plan C?u h¨¬nh H.323 Gatekeeper Thi?t l?p h? th?ng VoIP th?c t?
4. Bu?i 1 T?ng quan VoIP Gi?i thi?u VoIP C¨¢c k? thu?t chuy?n m?ch C¨¢c m? h¨¬nh k?t n?i qua m?ng VoIP C¨¢c th¨¤nh ph?n c?u th¨¤nh m?ng VoIP C¨¢c giao th?c m?ng C¨¢ch th?c ho?t ??ng Nh?n t? ?nh h??ng ?u Nh??c ?i?m ?ng d?ng
5. Gi?i thi?u VoIP M?ng ?i?n tho?i truy?n th?ng PSTN (tho?i) v¨¤ m?ng Internet (data) t¨¢ch bi?t nhau
6. Gi?i thi?u VoIP Voice v¨¤ Data s? ???c truy?n t?i tr¨ºn IP qua c¨´ng 1 m?ng
14. VoIP Protocols VoIP Signaling Protocols: control and call-signaling protocol Media Transmission Protocols:
15. VoIP Signaling Protocols H.323 MGCP: Media Gateway Control Protocol SIP: Session Initiation Protocol SCCP: Skinny Client Control Protoco
16. H.323 D efined by the International Telecommunication Union (ITU) for multimedia conferences over LANs A standard that specifies the components, protocols, and procedures that provide multimedia communication services, real-time audio, video, and data communications over packet networks, including IP networks.
18. MGCP MGCP is a client/server call control protocol built on a centralized control architecture MGCP is a plain-text protocol used by call-control devices to manage IP telephony gate-ways
20. SIP SIP is a peer-to-peer protocol where user agents (UAs) initiate sessions, similar to H.323. SIP is a protocol developed by the Internet Engineering Task Force (IETF) Multiparty Multimedia Session Control (MMUSIC) Working Group as an alternative to H.323
21. SIP SIP is a common standard based on the logic of the World Wide Web and is very simple to implement, it is widely used with gateways and proxy servers within service provider networks for internal and end-customer signaling.
27. Real-Time Transport Protocol Defined a standardized packet format for delivering audio and video over the Internet. Developed by the Audio-Video Transport Working Group of the IETF Provide end-to-end network transport functions intended for applications with real-time transmission requirements, such as audio and video, include payload-type identification, sequence numbering, time stamping, and delivery monitoring
28. RTP Control Protocol RTP provides out-of-band control information for an RTP flow used for QoS reporting provides a mechanism for hosts involved in an RTP session to exchange information about monitoring and controlling the session
30. Secure RTP Published by IETF Designed to provide encryption, message authentication, and integrity, and replay protection to RTP data in both unicast and multicast applications.
31. C¨¢ch th?c ho?t ??ng S? h¨®a t¨ªn hi?u Analog L?y m?u (Sampling) L??ng t? h¨®a (Quantization) M? h¨®a (Encoding) N¨¦n gi?ng n¨®i (Voice Compression) T?o Voice Datagram: ?¨®ng g¨®i d? li?u G?n Header theo c¨¢c chu?n: RTP, UDP, IP,¡ Chuy?n c¨¢c g¨®i tin ??n IP nh?n th?ng qua Network
32. C¨¢ch th?c ho?t ??ng IP nh?n nh?n c¨¢c g¨®i tin X? l? c¨¢c g¨®i tin Gi?i n¨¦n c¨¢c g¨®i tin CODEC t¨ªn hi?u Digital th¨¤nh Analog
36. Nh?n t? ?nh h??ng Factors influence : Echo: amplitude and delay Jitter: individual packets, contention, or congestion Delay: distance, coding, compression, serialization, and buffers Packet Loss: unstable network, network congestion, or too much variable delay in the network
41. ?ng d?ng c?a VoIP D?ch v? tho?i qua Internet Tho?i th?ng minh Dich v? t¨ªnh c??c cho b? g?i Dich v? Callback Web D?ch v? Fax qua IP Dich v? Call Center
42. N?i dung tr¨¬nh b¨¤y k? t?i IP Networking and Audio Clarity How to Improve Voice Quality Transporting Modulated Data over IP Networks Processing Voice Packets with Codecs and DSPs