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Garching Germany
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About
SUSS MicroTec Group is a supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. The solution portfolio covers all performance relevant steps for wafer processing ranging from coating, baking, developing, aligning to wafer bonding and is complemented by specialised add-ons such as photomasks, nanoimprint lithography tools and optical lenses.

Presentations(2)Ìý

Metal bonding alternatives to frit and anodic technologies for wlp
Metal bonding alternatives to frit and anodic technologies for wlpMetal bonding alternatives to frit and anodic technologies for wlp
Metal bonding alternatives to frit and anodic technologies for wlp
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Hybrid bonding methods for lower temperature 3 d integration 1
Hybrid bonding methods for lower temperature 3 d integration 1Hybrid bonding methods for lower temperature 3 d integration 1
Hybrid bonding methods for lower temperature 3 d integration 1
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