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Garching Germany
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SUSS MicroTec Group is a supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience.
The solution portfolio covers all performance relevant steps for wafer processing ranging from coating, baking, developing, aligning to wafer bonding and is complemented by specialised add-ons such as photomasks, nanoimprint lithography tools and optical lenses.
Tags
wafer bonding
karl suss
metal bonding
hybrid bonding
semiconductor
3d integration
3d bonding
suss microtec
bond
metal bonding wafer bonder suss microtec karl semi
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