15+ years in semiconductor packaging development & production quality:
- QFN, flip chip, PoP, WLP/eWLP, TSV, 3D packaging
- Processor, SoC, Connectivity, RF module, EPS
- 28/20nm backend Char
- Optical MEMS projecter/Fluidic MEMS printhead
- LAB on electronic component/assembly/ board characterization
- 8D/RMA/CAR/PCN
- Suppliers HVM ramp up audit/monthly operation KPI review
8+ years in industrial technology research and development
- automatic power transmission design and development
- scroll compressor design and development
- C and C++ program
75+ patents granted in USPTO, lead corporate paten team (2y)
Specialties:
- Advanced portable e...
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